This webinar was recorded on Nov. 18, 2013
7am - 8am (PST).
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Heads of the 3D TSV groups among the most renowned R&D labs shared their views on what is coming next with 3D TSV technologies. Mid to long term perspective were shared with attendees. They informed the attendees about their upcoming presentation topics planned for the European 3D TSV Summit 2014.
3D and Photonics Convergence for Very High Bandwidth Chip to Chip Communication
3D Wafer Level System Integration – Fraunhofer Approach
Francoise von Trapp
Queen of 3D
This webinar is brought to you by the European 3D TSV Summit, main SEMI event dedicated to 3D TSV technologies.
European 3D TSV Summit is planned in Grenoble (France) in Jan 20-22, 2014. CEA-LETI, imec and Fraunhofer-IZM will be presenting with many more executives from leading edge companies. Summit registrations are opened.Click here.