Webinar Replay: 3D TSV Without Limits

This webinar was recorded on Nov. 18, 2013
7am - 8am (PST). 


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Heads of the 3D TSV groups among the most renowned R&D labs shared  their views on what is coming next with 3D TSV technologies. Mid to long term perspective were shared with attendees. They informed the attendees about their upcoming presentation topics planned for the European 3D TSV Summit 2014

Eric Beyne 
Program Director 3D System Integration

3D and Photonics Convergence for Very High Bandwidth Chip to Chip Communication
Herve Ribot
Head of 3D Integration

3D Wafer Level System Integration – Fraunhofer Approach
M. Jurgen Wolf
Head of dept. WLSI, Mgmt. ASSID



Francoise von Trapp
Queen of 3D
3D InCites

This webinar is brought to you by the European 3D TSV Summit, main SEMI event dedicated to 3D TSV technologies.

European 3D TSV Summit is planned in Grenoble (France) in Jan 20-22, 2014. CEA-LETI, imec and Fraunhofer-IZM will be presenting with many more executives from leading edge companies. Summit registrations are opened.Click here.