Jon Casey, Ph.D.
Jon Casey received his Ph.D. from the University of Florida in 1983 in Material Science and Engineering. He joined IBM in 1983 as a member of the Advanced Semiconductor Packaging Laboratory in East Fishkill, NY. Dr. Casey has worked in a number of Packaging and semiconductor areas throughout his career in IBM and was appointed to IBM Fellow in 2013. Dr. Casey’s current responsibilities include leading IBM’s Semiconductor Packaging technology and solutions for both IBM systems as well as OEM applications. Dr. Casey is a Fellow of the American Ceramic Society, holds more than 65 US Patents, has published numerous technical papers and has co-authored two books on Colloid and Surface Science.