SEMI Members Only: ASMC 2013
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Technical Session Papers for SEMI Member Download
|Tuesday, May 14, 2013|
| Session 1: Advanced Patterning/Design for Manufacturing |
Chairs: Yayi Wei, GLOBALFOUNDRIES; Jacek Tyminski, Nikon Research
Advanced patterning and design for manufacturing (DFM) are key elements of leading edge semiconductor fabrication. This session covers a broad spectrum of innovations in these areas, including source and mask optimization, carbon nanotubes and improved double patterning.
2: Factory Optimization I
Chairs: Scott Lantz, Intel Corporation; Jan Rothe, GLOBALFOUNDRIES
Semiconductor equipment and manufacturing is increasingly complex and driven by strict economic constraints. It is vital for IC production to improve efficiency and control costs. This session discusses new approaches to factory optimization based on data analysis and simulation.
| Session 3: 3D/TSV Technology |
Chairs: Hamid Khorram, Nikon; James Lu, RPI; Thuy Tran-Quinn, IBM
This session will cover key innovation in the field of 3D/Through-silicon via technology (TSV) including TSV processing, interposer, thin-wafer handling, reliability and power delivery.
| Session 4: Factory Optimization II
Chairs: Dave Gross, GLOBALFOUNDRIES; Holly Magoon, Nikon; Patrick Varekamp, IBM
Semiconductor equipment and manufacturing is increasingly complex and driven by strict economic constraints. It is vital for IC production to improve efficiency, control costs, and be good environmental stewards. This session covers novel solutions for factory and equipment productivity as well as environmental efficiency.
| Session 5: Interactive Poster Session and Reception (sponsored by KLA-Tencor, NY Loves Nanotech/Marcy Nanocenter)
Chairs: Thanas Budri; Texas Instruments; Eric Eisenbraun, CNSE; Dan Maynard, IBM; Mike McIntyre; Patrick Varekamp; IBM; Paul Werbaneth
Innovative integrated circuit functionalities continue to be integrated in semiconductor manufacture. This session presents analysis of the effects of enabling technologies, and innovative integrated circuit designs.
|Wednesday, May 15, 2013|
|Session 6: Yield Enhancement I |
Presentations not available for download.
(sponsored by FEI Company)
Chairs: Oliver Patterson, IBM; Gary Green, Alphray
Defect inspection, yield analysis and optimization are integral components in the development and manufacture of semiconductor devices. This session covers a variety of techniques to improve yield using design, defect, electrical test, bitmap and failure analysis data. Using two or more of these data sources together intelligently is a recurrent theme.
Session 7: Advanced Metrology I
Session 8: Defect Inspection I
9: Advanced Equipment Processes and
Materials Presentations not available for download.
Chairs: Chris Long, IBM; Brett Williams, ONSemiconductor
Both advanced memory, analog and logic manufacturers face daunting challenges as the next generation device nodes come on line. These challenges are being met by the development and applications of innovations in equipment, materials, and processes. This session will focus on solutions to advanced application requirements and will highlight the latest innovations that are being implemented in leading edge high volume manufacturing.
| Session 10: E-Beam Inspection (in parallel with Session 11) |
Chairs: Jennifer Braggin, Entegris; Jeanne P. Bickford, IBM
Defect inspection, yield analysis and optimization are integral components in the development and manufacture of semiconductor devices. This session will feature papers describing how e-beam inspection is used to rapidly drive yield for both physical and voltage contrast defects.
| Session 11: APC (in parallel with Session 10)
Chairs: Agnés Roussy, EMSE; Raymond Van Roijen, IBM
This session covers innovations for advanced process control, including new methods in fault detection and classification (FDC), process controls and virtual metrology for predictive maintenance.
|Thursday, May 16, 2013|
| Session 12: Yield Enhancement II (in parallel with Session 13)|
Chairs: Philippe Campion, STMicroelectronics; Amiad Conley, Applied Materials; Larry Pulvirent, GLOBALFOUNDRIES
Defect inspection, yield analysis and optimization are integral components in the development and manufacture of semiconductor devices. This session covers process engineering work in N2 purge and cleans to minimize defectivity and improve yield.
| Session 13: Advanced Metrology II (in parallel with Session 12)
Chairs: Franz Heider, Infineon; Dick James, Chipworks
This session details some advanced metrology techniques, including new ellipsometry, spectrometry, infra-red, e-beam, X-ray and metrology modeling use cases.
| Session 14: Defect Inspection II (in parallel with Session 15)|
Chairs: Mike Sevegney, Pall Corp.; Dieter Rathei, DR Yield
Defect inspection, yield analysis and optimization are integral components in the development and manufacture of semiconductor devices. This session will feature a number of case studies where key technology limiting defect types are characterized and eliminated. The final paper is a study of the ability of different tools and tool modes to measure the size of defects.
| Session 15: Advanced Equipment Processes and Materials (in parallel with Session 14)
Chairs: Naomi Yoshida, Applied Materials; Rob Pearson, Rochester Institute of Technogy
This session provides an overview of the state of advanced memory technology, spin torque magnetic memory and novel processing techniques. The final paper gives insight into the status of volume high-purity carbon nanotube production.
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