Advanced Packaging R&D Integration Manager
Michel Koopmans is the Advanced Packaging R&D Integration manager for Micron Technology. In this current role, he’s responsible for all integration aspects of 3 Dimensional Interconnects, post Probe Through Silicon Via wafer level processes and packaging. His previous experience includes managing multiple DRAM and Imager package development activities, Wafer Level Redistribution process development and Photo Lithography. He joined Micron Technology in 1999 after graduating from the Netherlands with a bachelor’s degree in mechanical engineering.