SMC 2013 Abstract: Michel Koopmans, Micron
From Stacked Packages to an All Silicon Future…..
Process Integration Manager, Micron
Reductions in packaging material cost, minimizing form factor and lowering power requirements are driving efforts to eliminate the laminate based substrates. New technologies are being developed to overcome various wafer level and package level manufacturing challenges and introduce all silicon cubes. From silicon interposers to known good stacked devices in an all silicon form factor, the need for improved and revolutionary materials is there to enable future packaging solutions.
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