Materials for Classic and New Memories
Er-Xuan Ping, Managing Director, Silicon System Group Chief
We will discuss various memory technologies that will power the advanced semiconductors that are facing scaling limits from existing NAND, DRAM and NOR memory technologies. Highlighting the device, integration and manufacturing challenges ahead as transition to new technologies such as PCRAM, STT-RAM and ReRAM, the discussion will focus on required material changes, the increased manufacturing complexity, and the innovation to address these challenges. The equipment and techniques which enable highly controlled material interfaces and atomically precise thin film processing that are required in manufacturing will be discussed.