XeF2 Etch Technology for MEMS Applications
Dr. Kyle Lebouitz, Director of Technology, Release Etch Products
MEMS (Microelectromechanical Systems) fabrication is very similar to traditional semiconductor fabrication techniques with the exception of the need for a release process. The release process is the key to allowing the mechanical structure to be able to move relative to the electronic circuit. Whereas most semiconductor etching produces straight, vertical sidewalls, release etches intentionally undercut the structure. There are several combinations of etches and materials that can be used to perform the release process. This talk will focus on the use of Xenon Difluoride vapor as a release etch.