Malaysia Forum 2013 - Agenda

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November 20, 2013
Eastin Hotel
Penang, Malaysia

Malaysia Forum Committee

Preliminary Agenda - Theme : Technology Innovation in Assembly and Test

0800-0850 Registration
0800-0850 Welcome Coffee/Tea 
0900-0915 Welcome Speech by Mr NG Kai Fai, President, SEMI Southeast Asia
0915-0925 Opening Speech by Datuk Phang Ah Tong, Deputy CEO (Manufacturing & Services Development II), Malaysian Investment Development Authority (MIDA)
0925-0950 Guaranteed Growth for Smart Devices
Ms. Selinna CHIN, Managing Director (Consumer Choices), GfK
0950-1015 SEMI Market Update & Outlook: Equipment and Materials
Ms. Bettina WEISS, Vice President, SEMI Global Business Development
1015-1040Semiconductor Industry: Finance, Secondary Equipment, Mergers & Acquisitions... and Profitability!
Mr. Melvin LOW, CEO, Equvo Pte Ltd
1040-1100 Coffee/Tea Break : Visit tabletop
1100-1135 Transforming Wire Bond Eco System
Mr. M. Sivakumar, Technical Marketing Manager, ASM Technology
Challenges & Solution for Fine Pitch Cu Pillar Filp Chip Bonding Process
Mr Nelson FAN Chun Ho, Business Development Manager, ASM Technology
1135-1210 What will drive the ATE Market beyond 2013?
Mr. Michael FRAZIER, Market Development, LTX-Credence Corporation
Challenges Faced in Testing Wideband Power Amplifier Devices (LTE Advanced and 802.11ac)
Mr. Lenny LEON, SR RF Marketing Technologist, LTX-Credence Corporation
1210-1235 Flip Chip Technology for 2.5D and 3D Packaging
Dr. LEE Teck Kheng , Director (Technology), Institute of Technical Education (ITE) College Central
1235-1330 Lunch : Visit tabletop
1330-1405

Pushing the Wire Bonding Boundary
Mr. Nelson WONG, Vice President (Wire Bond Solutions Business Unit), Kulicke & Soffa Pte Ltd

"From CU Wire Bonding to Thermo-Compression Bonding for Advanced Packaging"
Mr. Patrick DESJARDINS, Director (Product Marketing), Kulicke & Soffa Pte Ltd

1405-1430

Solutions for HVM Advanced Copper Wire Bonding Challenges and Silver Alloy Bonding - A Capillary Perspective
Mr. Jason TAN, Product Manager, Small Precision Tools/SPT Asia Pte Ltd

1430-1455 Developments in One Step Chip Attach (OSCA) for Thermo-compression Bonded Advanced Packaging
Dr. Christopher BREACH, Head (Technology R&D), Kester Components Pte Ltd
1455-1520

The Critical Role Of OSAT In Ever Changing Semiconductor Industry

Mr Moses CHEE, Director, Technical & Business Development, ASE Electronics (M) Sdn Bhd

1520-1545 Coffee/Tea Break : Visit tabletop
1545-1610

Enabling System-Level Test on ATE: Vision, Challenges, and Where We Are Today
Dr. Clemens LEICHTLE, Director (V93000 SOC Center of Expertise), Advantest Europe GmbH

1610-1635 2.5/3D Wafer Test Trend and Solution
Mr. Ben ELDRIDGE, CTO,  Form Factor
1635-1655 Introduction to Fluxless High Volume Manufacture for Advanced 2.5/3DiC Packaging
Dr. Jian ZHANG, President, SEMIgear, Inc.
1655-1720 Advanced Package Challenges to Wafer Test
Mr. Fred SATO, Senior Manager (ATS Marketing Dept. ATSBU), Tokyo Electron Limited
1720-1930 Networking Cocktail Reception (Free Flow of Beer, Wine, Soft Drinks)
*Program subjects to further changes

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Supported by

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Premier Sponsors:

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Related Event:

SEMICON Singapore 2014