Due to overwhelming response, SEMI Malaysia Forum 2013 registration will
close by 8 November, 10PM (Singapore time). No walk-in registration will be accepted.
For any queries, please do not hesitate to contact Mr. Melvin Yeo of SEMI Southeast Asia at +65 63396361 or email: firstname.lastname@example.org.
Technology Innovation in Assembly & Test
November 20, 2013
As Southeast Asia has firmly established its position as the leading market for semiconductor assembly and test operations, Malaysia has grown as a critical center of microelectronics final manufacturing. More than 70 global and domestic packaging and test companies call Malaysia home, and Malaysia continues to attract new investment to fuel future growth.
The SEMI® Malaysia Forum is the first regional SEMI event dedicated to serving the growing Malaysia
market. The SEMI Malaysia Forum will address current critical technology and business issues in
contemporary packaging and semiconductor test, exploring global trends and providing insight into how
companies in Southeast Asia and around the world are addressing new challenges and opportunities in
packaging and test in the coming age of 3D IC, new transistor architectures, and HMV advance copper wire bonding.
Conference topic areas include:
- Global and Southeast Asia Industry Market Outlook
- Advanced and Contemporary Packaging
- Challenges and Opportunities in 2.5D and 3D IC
- Semiconductor Test in the 3D IC Era