China Leaders Urge TSV Roadmap to Speed the Development of 3D-IC Technology

China Leaders Urge TSV Roadmap to Speed the Development of 3D-IC Technology

By SEMI China

As the industry packs more and more functionality into smaller and smaller form factors, TSV-based 3D-IC integration is becoming more mainstream as a critical technology in the near future. However, before the advent of the next “killer application,” the investment in TSV-based 3D-IC technology is limited due to two reasons: high cost and an unclear technology roadmap.

To help local companies in China speed the development of TSV-based 3D-IC technology and reduce the potential risk, at its fourth SEMI China committee meeting in Wu Xi, the Assembly & Testing Committee (A/T Committee) set a new goal — to figure out the technology roadmap. By doing so, the local IC companies can clearly identify the challenges for 3D-IC and then forecast the milestone for each challenge.

The SEMI China A/T committee covers the whole supply chain. The committee members come from: System Vendors (Huawei), IC Design Houses (MTK, Spreadtrum), Foundries (HHNEC, SMIC), Equipment Suppliers (Teradyne, Advantest, TEL, DISCO, AMAT, NMC), Material Suppliers (Sinyang, An Ji, Henckle), OSAT Vendors (JCET, NT-Fujitsu, NCAP), IDMs (IBM), and EDA Vendors (Mentor Graphics). So, the committee has sufficient resources to analyze TSV-Based 3D-IC market from all perspectives of the industry, but realizes that a survey of the market is the first step. SEMI China has organized the sub-group to carry out the study and will share the information at the next meeting in Xi’an.

Besides the technology roadmap, the A/T committee also realizes that the next “killer application” will be a major drive for TSV-Based 3D-IC Integration technology, helping move it to mass production. The Committee forecasts that such applications would occur in mobile devices and that IDMs would probably be the first ones to apply TSV-Based technology to mass production since IDMs have optimized supply chains and the capability to absorb the high research cost.

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August 7, 2013