Successful SEMI Europe Networking Day in Portugal

Successful SEMI Europe Networking Day in Portugal

SEMICON Europa 2013 is coming up soon... 

October 8-10

Semiconductor Front-End

Test & Packaging

MEMS

 More info and registration: www.semiconeuropa.org/

More than 150 people attended the SEMI Europe Networking Day focusing on Embedded Packaging on June 27 in Vila do Conde (Porto), Portugal. Attendees hailed from 68 companies and institutions and 14 different countries. After the welcoming address delivered by the president and CEO of NANIUM,  Armando Tavares, participants saw a strong lineup of eight high-level speakers who design, manufacture and sell embedded devices all over the world.

 Speakers from  Intel Mobile Communications (Germany) and ASE Group (Taiwan) delivered keynotes, followed by technical and market overview presentations by Amkor Technology (USA), NANIUM (Portugal), NXP (Netherlands), AT&S (Austria), TechSearch International (USA) and Yole Développement (France). The event was hosted by NANIUM, the largest pure play packaging foundry in Europe.

Driven by consumer markets and mainly by smartphone products, embedded packaging solutions provide the best power, performance, and area system tradeoff by integrating more functionalities into a smaller and thinner package. With annual growth forecast at more than 25 percent, these technologies are already implemented in high-volume cellular phones and are critical for enabling future innovative solutions, including 3D packaging solutions.

Networking Day

 “We are pleased that we developed such a strong lineup of speakers from the main players designing, manufacturing and selling embedded packages all over the world. We are still at an early stage, many additional business opportunities in embedded packaging are still upfront for equipment and materials companies. Embedded packages have the potential to become the new packaging platform beyond the BGA solution,” said Heinz Kundert, SEMI Europe president.

“The contribution of NANIUM and its partners to FO-WLP high-volume manufacturing is a cornerstone of the embedded packaging industry. Hosting this event in our facility is proof of our commitment to extend the technology further into the market,” said Armando Tavares, president and CEO of NANIUM.

Networking DayThe Networking Day combined presentations from companies that influence the industry and offered unique add-ons such the visit of NANIUM’s clean room, the largest FO-WLP 300mm facility worldwide, and several networking opportunities including the Speed Networking Session and social evening events.

In two “Speed Networking Sessions”, eight companies and institutions presented so-called “Elevator Talks.” Networking opportunities were provided before and after the presentations, and during the breaks.  Special “Quiet Networking Corners” were provided for more confidential talks. The social event in the evening was also an excellent networking opportunity. The event was supported by 15 sponsors and four media partners.

Networking Day

Steffen Kröhnert, director of Technology at NANIUM and co-chair of the “SEMI Networking Day” organizing committee said: “We are very pleased to be recognized by the organizer SEMI, but even more important also by all participants as reliable host providing the right environment, conditions and services needed to run such successful event. When NANIUM started in February 2010, nobody could imagine that only three years later we would have the privilege of welcoming a large part of the Semiconductor Packaging family in our facilities. We are proud to be part of this family, and we offer our support and hospitality also to other associations, institutions and co-operations active in Semiconductor Packaging arena.”

The Networking Days are a SEMI Europe initiative to support start-ups, SMEs, laboratories and large companies and to get “up to date” on hot topics that appeal to people across the semiconductor supply chain. SEMI Networking Days, held on quarterly basis in industrial sites, are prime events to connect with the people who influence the industry and to initiate preliminary partnership and business relationships. The Networking Days are open to anyone and free of charge for SEMI member companies.

The next SEMI Networking Day will be a MEMS Tech Seminar hosted by STMicroelectronics in Castelletto (Italy) on Sept 26 (www.semi.org/eu/node/8546). Registration is now open.

For more information, please contact Yann Guillou at yguillou@semi.org

 

August 6, 2013