EU Invests € 4.8 billion into Semiconductors; France Announces € 3.5 billion “Nano2017” Program
By Rania Georgoutsakou, director, Public Policy, SEMI Europe
Investment in semiconductor manufacturing in Europe is picking up speed. Following the launch of the new EU 10/100/20 strategy, the European Commission has now announced a new EU funding instrument for nanoelectronics, ECSEL, with a total budget of € 4,8 billion. A few days later, the French government launched Nano2017, a five-year investment program worth €3,5 billion euro. With fab and equipment investment in Europe in 2014 expected to be in the range of US$ 5 billion, SEMI is supporting members to access this funding and benefit from the next wave of investment in Europe. Your next stop is SEMICON Europa with hands-on advice on how to get EU funding and opportunities to network and find potential partners.
New EU 10/100/20 strategy already underway
The new EU industrial strategy for micro- and nanoelectronics, dubbed the EU 10/100/20 strategy, is proving to be much more than words. Launched in the end of May 2013, it pledges € 10 billion public/private investment in research and manufacturing over the next 7 years, with the aim of Europe holding 20 percent of the global chip production market by 2020. The European semiconductor manufacturing industry committed € 100 billion investment to support the strategy. Early proof that Europe is serious about making chips came a few days later with the launch of five pilot lines, worth over € 700 million, and helping companies from across the entire supply chain develop and validate 450mm equipment, MEMS or GaN technologies for example.
France announces the ‘Nano2017’ € 3,5 billion investment program
On 22 July 2013 the French Prime Minister Jean-Marc Ayrault visited Grenoble and Crolles, accompanied by three ministers, to launch ‘Nano2017,’ a public/private research & development strategy for the period 2013-2017. € 3,5 billion will be invested in research and manufacturing in the area. Public authorities will cover almost one third of the bill: € 600 million financing from the national government, € 400 million from the EU and € 100 million from local authorities. The program is led by STMicroelectronics and includes CEA-Leti, IBM and around 100 small and medium-sized companies from across the supply chain. STMicroelectronics alone will invest € 1,3 billion to double the production capacity of its 300mm fab in Crolles to around 7 000 silicon wafers a week.
New EU funding instrument unveiled
In early July, the European Commission unveiled ECSEL — the new joint technology initiative (JTI) that will combine EU, national and private investments into electronic components and systems research and manufacturing in Europe. ECSEL’s estimated budget is € 4,8 billion over the period 2014-2020: the EU and Member States will each contribute € 1,2 billion, with industry contributing at least half of the remaining € 2,4 billion. ECSEL will be launched in early 2014.
This new instrument is in fact a merger of the existing ENIAC (nanoelectronics) and ARTEMIS (embedded systems) joint technology initiatives, which together during the period 2008-2012 have funded over 100 projects worth in excess of € 2,8 million. These projects brought together 2000 partners, 40 percent of which were small and medium-sized companies.
Want to join Europe’s investment wave?
The SEMI World Fab Watch foresees fab and equipment spending in Europe to be in the range of $ 5 billion in 2014. Coupled with the increased investment opportunities that the new EU 10/100/20 strategy will spur, the European market is looking to grow in the next few years, creating important business opportunities for equipment and material suppliers.
Visit SEMICON Europa 2013 (8-10 October, Dresden, Germany), to understand the opportunities offered by the EU 10/100/20 strategy, learn about the latest technology and meet with the industry. Mark Thursday 10 October 2013 in your calendar — our EU Funding Opportunities Workshop (10:30-13:00) will explain the basics around EU funding programs and will offer hands-on advice about how your company can join a project. Our programs will cover all major technologies, including 450mm wafer processing, power electronics, MEMS, FDSOI as well as advanced packaging, including 3D TSV.
For more information on SEMICON Europa, please visit: www.semiconeuropa.org. The event in Dresden will again be co-located with Plastic Electronics Europe. The conference and exhibition is the leading international technology-to-industry and industry-to-industry event focused on organic and large area electronics. It is the premium forum in its kind where professionals in the area and from around the world meet to present and to discuss progress of topics. For more information, please visit: www.plastic-electronics.org.
For more information on the EU 10/100/20 strategy, please visit: www.semi.org/eu10-100-20
August 6, 2013