SEMI Arizona Breakfast Forum - October 18, 2013 New Advanced Packaging Insights on Technology and Applications

The SEMI Arizona Steering Committee presents: 
The SEMI Arizona Breakfast Forum - "New Advanced Packaging Insights on Technology and Applications"

Date: Friday, October 18, 2013
Time: 7:30am–10:30am
Location: Freescale Semiconductor, Inc.
Address: 2100 East Elliot Road, Tempe, Arizona, 85284

Map: 
http://azsiteserv.am.freescale.net/azss/maps/Tempe.Map.pdf

Please join us for a unique experience at Freescale Semiconductor Inc. as experts discuss the latest developments and hot topics in the high-tech semiconductor industry.  SEMI Arizona Breakfast Forum is a great opportunity to network with your colleagues and meet other local industry professionals.

Host: 

 

Breakfast Sponsor:

EVG Logo

 

 

 

Corporate Sponsor:


 

 

 

 

 

Register button

By October 4, 2013: 
SEMI Members: $35
Non Members: $50

After October 4, 2013: 
SEMI Members: $45
Non Members: $65


 Tweeting?  #semiazforum

 

 


   

 

                     

 

  

Agenda

7:30am–8:00am
Breakfast & Registration
8:00am–8:05am

Welcome Remarks

 

Moderator 

Welcome & Opening Remarks

 

Babak Taheri

Vice President & General Manager, Freescale Semiconductor

Dave Kirsch 

Vice President & General Manager, North America, EV Group


8:05am–8:25am 

Advanced Packaging Solutions – Copper Pillars From Lab to Fab

Garrett Oakes (Biography) 

Director of Technology, North America

EV Group
8:25am–8:50am

Jim Feldhan

Market Trends and Forecast

Jim Feldhan

President

Semico Research Corp.

 8:50am–9:15am 
 

Advanced Packaging Migration to Modularity

Ron Huemoeller (Biography)

Senior Vice President, Advanced Product Platform Development

Amkor Technology

 

9:15am–9:35am
 Networking Break
9:35am–10:00am

Evolution of Wafer Level Packaging for Mobile Applications

John Hunt (Biography) (Abstract)

Director of Engineering, Product Promotion

ASE (US), Inc.

10:00am–10:25am

System-in-Package (SiP) Solutions for Those Applications Requiring Significant Volumetric Shrinks and Heterogeneous Integration

Scott Hayes  (Biography)

Chip Packaging Systems Solutions, Sr. R&D Manager

Freescale Semiconductor, Inc.

10:25am–10:30am Closing/Thank you for Joining SEMI

Note:

 

 Agenda Subject to change

Sponsorship Opportunities (pdf sponsorship page click here)

Brand your company to the industry professionals in the Arizona.  Sponsorship opportunities
for this event are available.

Marlene Sibley
msibley@semi.org
Tel: 1.408.943.6988

Hotel Accommodations

SEMI has a reserved a block of rooms at reduced rates at Courtyard and Fairfield Inn & Suites by Marriott Chandler Fashion Center.  To reserve a room, please contact Laura Engler 
Director of Sales at Direct (480) 273-8723 or Cell (720) 934-7068.

Questions, please contact Lin Tso.

Lin Tso
Sr. Programs Manager

ltso@semi.org

Tel: 1.408.943.7920