The SEMI Arizona Steering Committee presents:
The SEMI Arizona Breakfast Forum - "New Advanced Packaging Insights on Technology and Applications"
Date: Friday, October 18, 2013
Location: Freescale Semiconductor, Inc.
Address: 2100 East Elliot Road, Tempe, Arizona, 85284
Please join us for a unique experience at Freescale Semiconductor Inc. as experts discuss the latest developments and hot topics in the high-tech semiconductor industry. SEMI Arizona Breakfast Forum is a great opportunity to network with your colleagues and meet other local industry professionals.
By October 4, 2013:
After October 4, 2013:
|7:30am–8:00am||Breakfast & Registration|
Welcome & Opening Remarks
Vice President & General Manager, Freescale Semiconductor
Vice President & General Manager, North America, EV Group
Advanced Packaging Solutions – Copper Pillars From Lab to FabGarrett Oakes (Biography)
Director of Technology, North America
Market Trends and ForecastJim Feldhan
Semico Research Corp.
| 8:50am–9:15am |
Advanced Packaging Migration to Modularity
Senior Vice President, Advanced Product Platform Development
|9:15am–9:35am ||Networking Break|
Evolution of Wafer Level Packaging for Mobile Applications
Director of Engineering, Product Promotion
ASE (US), Inc.
System-in-Package (SiP) Solutions for Those Applications Requiring Significant Volumetric Shrinks and Heterogeneous Integration
Scott Hayes (Biography)
Chip Packaging Systems Solutions, Sr. R&D Manager
Freescale Semiconductor, Inc.
|10:25am–10:30am||Closing/Thank you for Joining SEMI|
|Agenda Subject to change|
Brand your company to the industry professionals in the Arizona. Sponsorship opportunities
for this event are available.
SEMI has a reserved a block of rooms at reduced rates at Courtyard and Fairfield Inn & Suites by Marriott
Chandler Fashion Center. To reserve a room, please contact Laura
Director of Sales at Direct (480) 273-8723 or Cell (720) 934-7068.
Questions, please contact Lin Tso.
Sr. Programs Manager