Tim G. Hendry, Vice President, Technology and Manufacturing Group, Director of Fab Materials, INTEL CORPORATION
Tim G. Hendry is vice president of the Technology and Manufacturing Group and Director of Fab Materials. He is responsible for the procurement and quality management of all fab materials. Prior to his current position, Hendry was the Fab11X Plant Manager for Intel Fab/Sort Manufacturing from 2001 – 2010. In this role, he was responsible for all operations at Fab 11X in Rio Rancho, New Mexico; the company's first 300mm high-volume manufacturing facility, and for overseeing technology used to control and monitor equipment at Intel's network of wafer manufacturing facilities.
Mr. Hendry joined Intel in 1988 as a Senior Process Engineer in Rio Rancho. He has also served as the Process Engineering Manager and as a Factory Manager at Intel manufacturing facilities in New Mexico. Before joining Intel, Hendry was a Process Engineering group leader at Fairchild Semiconductor from 1982-1987.
He received his bachelor's degree in Metallurgical Engineering from the University of Washington in 1982. Mr. Hendry is the recipient of two Intel Achievement Awards.