SEMI Announces "Call for Presenters" for SEMICON West 2013

Topics Cover Developments in Lithography, Nonplanar Architectures, Advanced Materials, 3D-IC and Advanced Packaging, Test, Lab-to-Fab, Productivity Innovation, and More

SAN JOSE, Calif. — December 6, 2012 — SEMI today announced a "Call for Presenters" for technical sessions and presentations at SEMICON West 2013, which takes place July 9-11 at the Moscone Center in San Francisco, Calif. Presentation abstracts are due March 1, 2013.

SEMICON West 2013 will feature more than 60 hours of technical sessions and presentations across four show floor technology stages — the TechXPOTs — focused on critical industry topics shaping design and manufacturing of semiconductors, high-brightness (HB) LEDs, MEMS, printed and flexible electronics, and other related technologies. New this year will be sessions on Manufacturing Solutions for Nonplanar Transistors, Productivity Innovation (solutions for existing 200mm and 300mm fabs) and Lab-to-Fab (R&D development, and transition to high-volume manufacturing technologies). SEMI is soliciting technical presentations in topic areas including:

Wafer Processing

  • Manufacturing nonplanar transistors
  • Advanced lithography
  • 450mm wafer processing
  • Advanced materials and processes

Productivity Innovation

  • Productivity technology for existing fabs
  • Equipment and materials management
  • Secondary equipment and solutions

Packaging and Test

  • Semiconductor test strategies
  • Trends and opportunities in 3D IC
  • Advanced packaging materials and technologies
  • Probe card technology

"Extreme Electronics"

  • Lab-to-Fab: R&D to high-volume manufacturing
  • MEMS Manufacturing and Technology
  • High-Brightness LED manufacturing
  • Printed and flexible electronics

Prospective presenters are invited to submit abstracts (maximum 500 words) on key industry issues and topics in the areas listed above for consideration. Presentations should focus on the latest developments and innovations in these technology areas, inclusive of supporting data. Submissions may be made online from the SEMICON West 2013 "Call for Participants" website at: www.semiconwest.org/Participate/SPCFP.

Premier sponsors of SEMICON West 2013 include: Advantest, Applied Materials, and KLA-Tencor.

The deadline for abstract submission is March 1, 2013.

About SEMICON West

SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products and technologies for microelectronics design and manufacturing, featuring technologies from across the microelectronics supply chain, from electronic design automation, to device fabrication (wafer processing), to final manufacturing (assembly, packaging, and test). More than semiconductors, SEMICON West is also a showcase for emerging markets and technologies born from the microelectronics industry, including micro-electromechanical systems (MEMS), photovoltaics (PV), flexible electronics and displays, nano-electronics, solid state lighting (LEDs), and related technologies. For more information, visit www.semiconwest.org

About SEMI

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. Our 2,000 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.

Association Contact
Deborah Geiger
Email: dgeiger@semi.org
Phone: 1.408.943.7988