Backend Assembly and Materials: The Limiting Factors
E. Jan Vardaman
TechSearch International, Inc.
The impact of backend assembly and the critical role that materials play has become increasingly important in the semiconductor industry. Over the last few years, companies have seen the price of silicon fabrication fall and the cost of packaging, assembly, and test rise. The desire to adopt 3D IC using through silicon via (TSV) technology provides a clear illustration of the overlap between the traditional backend operations and the technology and business issues that have stalled the adoption of the technology. This presentation provides an insight into the future role of the foundry and the OSATs, the requirements for new materials, and a view of requirements for the adoption of new technologies.