SEMI 450 Central -- Archive: More Viewpoints

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Archive: More Viewpoints

450mm Update on SEMI Standards 
SEMI Standards task forces are getting the industry to collaborate on key issues like the technical parameters for 450mm silicon wafers, physical interfaces, carriers, and more. (SEMI, Dec 2014)

450mm Innovations & Synergies for Smaller Diameters
Semiconductor equipment and materials innovations are expanding as 450mm research and development proceeds at consortia, institutes and companies around the world. (SEMI, Nov 2014)

450mm Standards Update: October 2014
The first standard proposal was submitted in 2007, and SEMI has since published nearly nineteen 450mm-related Standards.  New standards are being developed as the industry identifies new requirements, and revisions to published standards are being made as areas for improvement are recognized. (SEMI, Oct 2014)

450mm Development Status Reports from SEMICON West 2014 
The first fully patterned 450mm wafers were on display at SEMICON West 2014. Article includes development updates (standards, EPM, lithography) from Nikon Precision, G450, and more. (SEMI, Aug 2014)

EUV is Key to 450mm Wafers
Whether the wafers in question are 200mm in diameter, or 300mm, or potentially 450mm, larger wafer sizes have always been justified by manufacturing economics. If the cost to process a wafer stays the same, but the wafer contains more devices, then the cost per device goes down. (K. Derbyshire, SemiEngin, July 2014)

The Macroeconomics of 450mm Wafers
SEMICON West 2014 in San Francisco was a great place to meet bloggers in the semiconductor industry to get updated on the status of 450mm diameter silicon wafers. On one side, there is a good news about the unprecedented level of collaboration taking place between the design and construction professionals through the G450C to deconstruct a semiconductor facility matter associated with 450mm adoption.  (A. Mulay, SEMI, July 31)

What Happened to 450mm?
There was a time not very long ago — one process node, in fact — when the economic momentum of Moore’s Law seemed unstoppable with a combination of extreme ultraviolet lithography, larger wafer sizes and a variety of new materials. Shrinking feature sizes is still technically possible, but certainly not with the same promised economic benefits and, at least for the foreseeable future, not with 450mm wafers. (M. Lapedus/E. Sperling/K. Derbyshire; SemiEngin, July 17) 

450mm Transition toward Sustainability: Facility and Infrastructure Requirements
Hard data and strong collaboration are proving effective in solving the challenges inherent in building 450mm semiconductor fabs. In the past year, the Facilities 450mm Consortium (F450C) — the facilities-focused off-shoot of the Global 450mm Consortium — has provided the unified forum to test and analyze utility requirements, overhead conveyance systems and energy-efficiency strategies. (A. Maynes/F. Robertson, G450C, in SST, June 20)

450mm Standards Update
While the timing of a transition to 450mm wafers remains unclear, the industry is continuing to develop the standards that will be essential to high-volume manufacturing on larger substrates. The first standard proposal was submitted in 2007, and SEMI has since published nearly twenty 450mm-related Standards.  New standards are being developed as the industry identifies new requirements, and revisions to published standards are being made as areas for improvement are recognized. (Kevin Nguyen, SEMI, June 10)

Is 450mm Dead in the Water?
At one time, Intel, TSMC and Samsung were aggressively beating the 450mm drum. Chipmakers wanted, if not demanded, 450mm pilot line fabs by 2016, with high-volume manufacturing 450mm plants slated by 2018.  At least for those companies, 450mm made some sense. Moving to 450mm wafers would supposedly give chipmakers a 2.25x boost in wafer area and a 30% cost reduction over 300mm substrates. But, of course, the business model was (and still is) shaky. (Mark LaPedus, SemiEngin, May 15)

450mm Update on SEMI Standards
SEMI Standards task forces are working on encouraging the industry to collaborate on key issues like the technical parameters for 450mm silicon wafers, physical interfaces, carriers, assembly and packaging. SEMI has 13 task forces working on 450mm and has published nineteen 450mm standards with 17 more in the pipeline.  (SEMI, Apr 17)

Intel Says 450mm Will Deploy Later in Decade
Intel, one of the five members of Gov. Andrew Cuomo’s G450C, says that it is still on track to move its manufacturing to the larger, 450mm wafers that are being developed at the SUNY CNSE but some obstacles exist. (Larry Rulison, Times Union, Mar 18)

450mm Standards Update — March 2014
SEMI has published more than 19 Standards for 450mm generation.  New standards are being created to facilitate supplier and user for material and equipment.  Revisions to published standards are needed as improvements are constantly identified. (SEMI, Mar 4)

No Technical Barriers Seen for 450mm
Paul Farrar, GM of the G450C, said early work has demonstrated good results and that he sees no real barriers to implementing 450mm wafers from a technical standpoint. Speaking at the SEMI ISS meeting in January, Farrar showed impressive results from etch... (Pete Singer, SST, Feb 19)

450 May Never Happen, says Micron CEO
450mm  may never happen, according to Mark Durcan, CEO of Micron, the world’s fourth largest semiconductor company. “I am not convinced that 450mm will ever happen but, to the extent that it does, it’s a long way out in the future,” says Durcan...  (David Manners, Electronics Weekly, Feb 11) 

Fab Tool Industry has Lost its Way
The relationship between chipmakers and fab tool vendors has always been a bit rocky, but the supply chain has generally worked. Chipmakers demand a tool for a particular application. Then, tool makers attempt to deliver the goods, and ask few, if any, questions. (SemiEngineering, Jan 23)

The State of 450mm and Intel Gossip 
Paul Farrar, the GM of the Global 450mm Consortium (G450C) presented at the SEMI ISS conference.... The current plans call for work to take place over the next 3-4 years and be ready for volume manufacturing in 2018 or 2019.  (SemiWiki, Jan 14)

450 Update on SEMI Standards
SEMI Standards task forces are working on encouraging the industry to collaborate on key issues like the technical parameters for 450mm silicon wafers, physical interfaces, carriers, assembly & packaging. SEMI has 13 task forces working on 450mm and has published 19 450mm standards with 14+ in the pipeline. (James Amano, SEMI, Nov 5)

450mm Higher Gas Flows Pose Opportunities
The semiconductor industry is gearing-up for a transition in silicon wafer diameter from 300mm to 450mm, driven by the requirement to reduce device manufacturing costs. This transition is the latest in a series of wafer size increases. (Edwards, SST, Oct 30)

Progress on 450mm: G450C
At SEMICON Europa last week, Paul Farrar, GM of G450C, provided an update on the consortium’s progress in demonstrating 450mm process capability. He said 25 tools will be installed in the Albany cleanroom by the end of 2013. (Pete Singer, SST, Oct 14)

Litho Roadmap Remains Cloudy
For some time, the lithography roadmap has been cloudy. Optical lithography has extended much further than expected. And delays with the various next-generation lithography technologies have forced the industry to re-write the roadmap. (Mark LaPedus, SemiEngin, Sep 19)

Intel Delaying 14nm Move-in. 450mm Slipping, EUV, Who Knows?
Report from SEMI Silicon Valley Lunch Forum meeting. Lots of talk about capex numbers on conference calls but it is the equipment vendors who get the orders for particular types of equipment.  (Paul McLellan, SemiWiki, Aug 24)

450 Silicon Wafer Issues Emerge
The most critical component in semiconductor manufacturing is arguably the silicon wafer, but the substrate is often taken for granted in the supply chain... The transition toward the next-generation 450mm wafer size likely will be a long and painful chapter for silicon wafer suppliers. (Mark LaPedus, SemiEngin, Aug 15)

450mm: Out of Sync 
The IC industry has been talking about it for ages, but vendors are finally coming to terms with a monumental shift. The vast changes involve a pending and critical juncture, where the 450mm wafer size transition, new device architectures and other technologies will likely converge. (Mark LaPedus, SemiEngin, Jul 18)

Foundry Talk
GlobalFoundries CEO Ajit Manocha sounds off on Foundry 2.0, 450mm wafers, lithography challenges, stacked die, the Internet of Things and the rush to the next process node. Video (12:39 min). (Ed Sperling, SemiEngin, Jul 7)

Consortium Mania Sweeps 450mm Landscape
In the mid-1990s, the semiconductor industry embarked on a costly and problematic migration from 200mm to 300mm wafer fabs. At the time, the 300mm development efforts were in the hands of two groups—Sematech and a Japanese-led entity. The equipment industry was on the outside looking in. (Mark LaPedus, SemiEngineering, Jun 20)

450mm-- It's Bigger than You Think  
Much has been said of the 450mm transition.  But the description of this inflection is something of a misnomer.  Though everyone desires a smooth, coordinated and orderly conversion, it may be a less placid than the term “transition” implies.  Rather, I suggest calling it the 450mm “transformation.”  (Jonathan Davis, SEMI, Jun 4)

The Bumpy Road to 450mm
After its formation nearly 20 months ago, a 450mm consortium has reached its latest milestone by recently completing a cleanroom and installing the first 450mm demonstration tools in the facility.  (By Mark Lapedus, SemiEngin, May 16)

450mm in 2017: It's Coming
The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. (By Pete Singer, SST/SemiMD, May 1) 

Industry Alignment on Cost and Time Savings in the 450 mm Transition
The virtues of collaboration in the extraordinarily complex and capital-intensive business of microelectronic technology development have been long recognized and are only becoming more important as transition to manufacturing on 450mm wafers accelerates. (By J. Davis, F. Robertson, A. Ware, Future Fab International, Apr 25)

WEBCAST: G450C 450mm Status Report  by Paul Farrar, G450, and Lode lauwers, imec (SST on Apr 3; webcast is still available after registration)

Supersizing Wafers 
Get ready for 450mm wafers. First seriously considered in 2005, these supersized wafers, along with the equipment to handle, measure, and process them, have gradually made their way to the top of the semiconductor industry’s priority list.  But what exactly does that mean? What will 450mm fabs look like, and how will they differ from the 300-mm fabs being built today? (By Katherine Derbyshire, SemiEngineering, Jan 20)

450mm Wafer at Industry Strategy Symposium 2013
Intel's Robert E. Bruck (corp. VP and GM of Technology Mfg. Engineering) and Mario Abravanel, 450mm Equipment program manager, make the first public presentation of a fully patterned 450mm silicon wafer at the SEMI Industry Strategy Symposium on Jan. 15, 2013. Bruck said the wafer was patterned with 26nm features using nano imprint lithography and that thousands of similar wafers will be made available in the coming quarters to suppliers engaged in 450mm tool development. (SEMI, Jan 15)

Nikon and Intel Announcements Highlight 450mm News from Japan
News from SEMICON Japan 450mm Transition Forum: Kazuo Ushida, president of Nikon Precision Equipment, said the company plans to ship high-volume manufacturing (HVM) lithography tools in 2017 through a joint development effort with a chip maker.

Paul Farrar, Jr., Discusses Global 450mm Consortium (G450C) 
Paul Farrar, Jr., GM of the G450C at College of Nanoscale Science and Engineering (CNSE) and CNSE VP for Manufacturing Innovation, discusses the progress and impact of the G450C and its significant potential benefits to New York State and the nanoelectronics industry. (YouTube, 32 min)

European Consortia, ASML, Supplier Network Plan for 450mm Transition
At SEMICON Europa in Dresden, representatives from G450C, imec, Fraunhofer IISB, and others discussed mechanisms for greater European participation, and emerging research initiatives, related to 450mm development--possibly signaling a major change in the 450mm planning framework

TSMC Unveils Schedule for 450 Mass Production -- and Lithography is the Key
At the SEMICON Taiwan 2012 450mm Supply Chain Forum on September 7, leading foundries and equipment manufacturers such as TSMC, TEL, Lam Research, Applied Materials and KLA-Tencor convened to discuss the latest trends in 450nm technology as well as the opportunities and challenges involved.

Innovation plus Scale-up Needed to Tackle the Complexities and Cost of 450mm
It’s fair to say that the 450mm transition is one of the most expensive and complicated endeavors the industry has had to navigate; some might even say it’s the most complicated undertaking. 

450mm Wafer Transition: Supply Chain Impact Discussed at SEMICON West 2012
With pilot line programs accelerating in New York and leading chip manufacturers increasingly committed to 450mm, discussions on the industry’s transition to larger wafers have moved to the complicated questions of when and how.

SEMI Educates Policymakers on 450mm Transition
As the transition to 450mm heats up, SEMI has met with over 50 Federal and State government officials to discuss the likely impacts and requirements on a chip industry transition to 450mm wafers.

Back-End Perspectives on 450mm Wafers and Emerging Panel Scale Packaging Technologies
With the transition to 450mm wafers, collaborations and exchanges between industry players are needed to develop cost effective and timely solutions for packaging and assembly.

Report Examines Europe’s 450mm Role
A study commissioned by the European Commission on the impact of 450mm manufacturing concludes that not having a 450mm production infrastructure in Europe will “threaten the competitiveness of the current European SC manufacturing base, including technology development and device design.”

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