ASMC 2013 - Second Call for Papers - Submit an Abstract Now

Presentations on original, non-commercial and non-published works are being solicited in the following areas:

AM: Advanced Metrology
Development of new metrology techniques and methodologies; in-situ monitoring methods; metrology for process control; measuring critical dimensions, overlay, films; metrology of next-generation materials, processes and architectures (TSV, FinFETs, EUV, etc.); novel extension of existing metrology tools as well as evaluation of upcoming measurement technologies to meet HVM requirements.

AEPM: Advanced Equipment Processes and Materials
Development of new front- and back-end processes; characterization and integration of barrier layers, advanced gates, high-k and low-k, isolators, optical and conducting materials; evaluation of novel substrates; methodologies for driving new materials from R&D to mass production.

AP/DFM: Advanced Patterning/Design for Manufacturability
Immersion, double/multiple patterning, and EUV lithography; advanced resolution enhancement techniques; source/mask optimization; alignment and overlay enhancement solutions; advanced reticles; alternative patterning methods; high versus low volume manufacturing effect on lithography process; computational lithography; process model and process model file; optical proximity correction and verification; design rules creation and verification; DFM in support of yield learning through product cycle; use of test structures for design rule and process window validation; early manufacturing involvement; integrated product and process development (IPPD).

APC: Advanced Process Control
Advanced control techniques such as run-to-run control; model-based control; non-linear control methods; application of advanced statistical methods to control; advanced SPC techniques; fault detection and classification (FDC), virtual metrology.

CFM: Contamination Free Manufacturing
Backside contamination; EUV lithography cleanliness; ultraclean technologies; materials; control of mini-environments; environmental factors; wafer and reticle carriers/transport; static charge control.

DM: Data Management and Data Mining Tools
Fab and test floor data collection methods; data format, volume and interface challenges; fast drill-down to problem tools and sources; foundry-to-fabless data transfers and information issues; new visualization methods for improved data understanding; applying data mining techniques to isolate critical information from large data volumes.

DI: Defect Inspection and Reduction
New brightfield, darkfield, e-beam and other techniques and technologies for cost-effective yield control; process development using defect detection and management; new methodologies for detection, characterization, classification and disposition of defect counts, types and distributions; diagnostic techniques to correlate in-line inspection results to product yield, defectivity for 28nm and beyond.

ET/ID: Enabling Technologies and Innovative Devices
MEMS, magnetic heads, micro displays, motion sensors, DLP, MRAM, organic semiconductors, silicon modulators, photonic devices, 3D gates or novel structures; biosensors; semiconductor photovoltaic challenges; new process technologies; CMP developments; novel and emerging applications of existing process techniques, carbon nanotubes, PCM.

ER: Equipment Reliability and Productivity Enhancements
Efficiency/productivity measurements; optimizing and extending fab productivity within the framework of existing wafer sizes (200 mm, 300 mm); cycle time reduction; cost reduction; best practices; customer-supplier continuous improvement programs; high mix/high-volume factories with high-equipment productivity; small-lot manufacturing and single-wafer/mini batch tools; fab conversions; integration of factory control systems into the complete supply chain; enhancements in 200 mm factories and 200 mm manufacturing.

FA: Factory Automation
Automation in fab, probe, assembly and test factories; e-diagnostics; e-manufacturing; WIP management;; scheduling; planning; logistics; modeling; productivity; supply chain management; manufacturing performance; capacity, metrics, supply/demand management; deployment, cycle time and time-to-market; fully automated factory and remote operation center equipment and equipment interfaces; data collection interfaces; automated material handling systems (AMHS) challenges and carriers; standards and standardization.

GF: Green Factory
The role of environment; health and safety; emissions and effluents control; energy saving; recycling; safety and health; community involvement; ergonomics; zero emission; global environment protection; waste reduction; sustainability.

IE: Industrial Engineering
Facilities design and layout; equipment design and AMHS interactions; manufacturing systems design; statistics/quality; computer modeling; simulation; systems management; human factors in engineering; financial decision making; cost reduction.

LM: Lean Manufacturing
Establishing flow,  standards and standard work, value stream mapping, kaizen, kaikaku, cycle times, WIP, 5S, continuous improvement; metrics, training within industry (TWI), waste reduction.

3D/TSV: Packaging and Through Silicon Via
3D integration in general and associated topics like wire bonding, flip chip bonding (bump metallization), micro-bump bonding, C4 New Process, through wafer vias, silicon carrier; Novel approaches to global/local interconnect issue, power delivery and thermal management

YE: Yield Enhancement/Learning
Yield analysis tools and methods, including identifying root cause of yield loss and reliability fails; failure analysis; defect-to-yield correlation; zonal and spatial pattern analysis; slot signature analysis; use of volume diagnostics for pinpointing net failures; determination of critical particle size and types.

YM: Yield Methodologies
Yield monitoring and modeling accuracy; model types; critical area extraction techniques; yield-targeted data mining; modeling of systematic and parametric yield; process sector analysis; short-flow yield programs.

Author Instructions

 Papers co-authored between device manufacturers, equipment or materials suppliers, and/or academic institutions that demonstrate innovative, practical solutions for advancing semiconductor manufacturing are highly encouraged. Original, non-commercial and non-published works are being solicited in specific categories. Peer-reviewed papers are selected based on a clear outline of problem, analysis, solution/results and conclusion. Authors are requested to provide an extended abstract of no more than one page of text (max. of 1000 words, MS Word or PDF) with an additional page including supporting data and figures. Please summarize the topic and theme in as much detail as allowed by the word count limitation. Include title, author(s), company affiliation(s), contact information, topic and five key words describing the work.  Authors who prefer to present in the poster session must indicate request on abstract.  Submit an Abstract Online.

Important Dates (subject to change)

Abstract Due Extended: November 12, 2012
Author Notification: December 20, 2012
Preliminary Manuscripts Due: March 7, 2013
Final Manuscripts Due: April 25, 2013
Conference Dates: May 14-16, 2013