AM: Advanced Metrology
Development of new metrology techniques and
methodologies; in-situ monitoring methods; metrology for process
control; measuring critical dimensions, overlay, films; metrology of
next-generation materials, processes and architectures (TSV, FinFETs, EUV, etc.);
novel extension of existing metrology tools as well as evaluation of upcoming
measurement technologies to meet HVM requirements.
AEPM: Advanced Equipment Processes and Materials
of new front- and back-end processes; characterization and integration of
barrier layers, advanced gates, high-k and low-k, isolators, optical and
conducting materials; evaluation of novel substrates; methodologies for driving
new materials from R&D to mass production.
AP/DFM: Advanced Patterning/Design for Manufacturability
Immersion, double/multiple patterning, and EUV lithography; advanced
resolution enhancement techniques; source/mask optimization; alignment and
overlay enhancement solutions; advanced reticles; alternative patterning
methods; high versus low volume manufacturing effect on lithography process;
computational lithography; process model and process model file; optical
proximity correction and verification; design rules creation and verification;
DFM in support of yield learning through product cycle; use of test structures
for design rule and process window validation; early manufacturing involvement;
integrated product and process development (IPPD).
APC: Advanced Process Control
techniques such as run-to-run control; model-based control; non-linear control
methods; application of advanced statistical methods to control; advanced SPC
techniques; fault detection and classification (FDC), virtual metrology.
CFM: Contamination Free Manufacturing
contamination; EUV lithography cleanliness; ultraclean technologies; materials;
control of mini-environments; environmental factors; wafer and reticle
carriers/transport; static charge control.
DM: Data Management and Data Mining Tools
test floor data collection methods; data format, volume and interface
challenges; fast drill-down to problem tools and sources; foundry-to-fabless
data transfers and information issues; new visualization methods for improved
data understanding; applying data mining techniques to isolate critical
information from large data volumes.
DI: Defect Inspection and Reduction
darkfield, e-beam and other techniques and technologies for cost-effective
yield control; process development using defect detection and management; new
methodologies for detection, characterization, classification and disposition
of defect counts, types and distributions; diagnostic techniques to correlate
in-line inspection results to product yield, defectivity for 28nm and beyond.
ET/ID: Enabling Technologies and Innovative Devices
magnetic heads, micro displays, motion sensors, DLP, MRAM, organic
semiconductors, silicon modulators, photonic devices, 3D gates or novel
structures; biosensors; semiconductor photovoltaic challenges; new process
technologies; CMP developments; novel and emerging applications of existing
process techniques, carbon nanotubes, PCM.
ER: Equipment Reliability and Productivity Enhancements
measurements; optimizing and extending fab productivity within the framework of
existing wafer sizes (200 mm, 300 mm); cycle time reduction; cost reduction;
best practices; customer-supplier continuous improvement programs; high
mix/high-volume factories with high-equipment productivity; small-lot
manufacturing and single-wafer/mini batch tools; fab conversions; integration
of factory control systems into the complete supply chain; enhancements in 200
mm factories and 200 mm manufacturing.
FA: Factory Automation
Automation in fab, probe,
assembly and test factories; e-diagnostics; e-manufacturing; WIP management;;
scheduling; planning; logistics; modeling; productivity; supply chain
management; manufacturing performance; capacity, metrics, supply/demand
management; deployment, cycle time and time-to-market; fully automated factory
and remote operation center equipment and equipment interfaces; data collection
interfaces; automated material handling systems (AMHS) challenges and carriers;
standards and standardization.
GF: Green Factory
The role of environment; health and
safety; emissions and effluents control; energy saving; recycling; safety and
health; community involvement; ergonomics; zero emission; global environment
protection; waste reduction; sustainability.
IE: Industrial Engineering
Facilities design and
layout; equipment design and AMHS interactions; manufacturing systems design;
statistics/quality; computer modeling; simulation; systems management; human
factors in engineering; financial decision making; cost reduction.
LM: Lean Manufacturing
Establishing flow, standards and standard work, value stream
mapping, kaizen, kaikaku, cycle times, WIP, 5S, continuous improvement;
metrics, training within industry (TWI), waste reduction.
3D/TSV: Packaging and Through Silicon Via
integration in general and associated topics like wire bonding, flip chip
bonding (bump metallization), micro-bump bonding, C4 New Process, through wafer
vias, silicon carrier; Novel approaches to global/local interconnect issue,
power delivery and thermal management
YE: Yield Enhancement/Learning
Yield analysis tools
and methods, including identifying root cause of yield loss and reliability
fails; failure analysis; defect-to-yield correlation; zonal and spatial pattern
analysis; slot signature analysis; use of volume diagnostics for pinpointing
net failures; determination of critical particle size and types.
YM: Yield Methodologies
Yield monitoring and modeling
accuracy; model types; critical area extraction techniques; yield-targeted data
mining; modeling of systematic and parametric yield; process sector analysis;
short-flow yield programs.
Papers co-authored between device
manufacturers, equipment or materials suppliers, and/or academic institutions that
demonstrate innovative, practical solutions for advancing semiconductor
manufacturing are highly encouraged. Original, non-commercial and non-published
works are being solicited in specific categories. Peer-reviewed papers are
selected based on a clear outline of problem, analysis, solution/results and
conclusion. Authors are requested to provide an extended abstract of no more
than one page of text (max. of 1000 words, MS Word or PDF) with an additional
page including supporting data and figures. Please summarize the topic and
theme in as much detail as allowed by the word count limitation. Include title,
author(s), company affiliation(s), contact information, topic and five key
words describing the work. Authors who prefer
to present in the poster session must indicate request on abstract. Submit an Abstract Online.
Important Dates (subject to change)
Due Extended: November 12, 2012Submit an Abstract Online
Notification: December 20, 2012
Manuscripts Due: March 7, 2013
Manuscripts Due: April 25, 2013
Conference Dates: May 14-16, 2013