Spotlight on 3D-IC, 450mm Wafer Transition, and MEMS — SEMICON Taiwan 2012 Preview

Spotlight on 3D-IC, 450mm Wafer Transition, and MEMS — SEMICON Taiwan 2012 Preview
ARM, Micron and TSMC executives to share their visions at CEO Forum

Driven by consumer demand for tablet, smartphone, and mobile devices, Taiwanese chipmakers, LED manufacturers, and Outsourced Semiconductor Assembly and Test (OSAT) firms will spend firm nearly $40 billion in the next two years on equipment and materials, fueling excitement for SEMICON Taiwan 2012. On September 5-7 at the TWTC Nangang Hall in Taipei, SEMICON Taiwan will feature co-located events and technology theme pavilions focusing on LEDs, IC design, MEMS, 3D-ICs, advanced packaging/testing, 450mm wafer transition, green manufacturing, and secondary equipment.

Turning Point for 3D-IC Technology

 According to Yole Développement, in 2011 the market value of all the devices using TSV packaged in 3D in the 3D-IC or 3D-WLCSP platforms (CMOS image sensors, ambient light sensors, power amplifiers, RF and inertial MEMS) was worth $2.7 billion. In terms of TSV platform, 3D WLCSP is the most mature and preferred solution today with continuous growing at 18 percent CAGR.

Global 3D TSV device market value
Future 3D-IC market driven by stacked memories and logic SOC

(Yole Développement, July 2012)

As 3D stacked DRAM is expected to be one the biggest drivers for the volume adoption of 3D-IC technology, Nanya Technology, one of DRAM manufacturers in Taiwan, sparked  industry excitement by unveiling its prototype 8Gb QDP (quad-die package) DDR3 based on in-house-developed via-middle TSV (through silicon via) 3D-IC technology in July. The 8Gb QDP DDR3 involves stacking four 2Gb DDR3 dies in four layers. Nanya expects that volume production of TSV-based QDP DRAM (mainly for use in mobile or high-speed computing devices) will start in 2013 or 2014.

To participate the race in 3D-IC, foundry, fabless, OSATs from around the world will examine solutions at SEMICON Taiwan 2012 where leading manufacturers, packaging and test companies, fabless semiconductor companies, global top equipment and materials suppliers will showcase their contemporary, advanced and specialized 3D integration solutions at Advanced Packaging Pavilion.

In conjunction with SEMICON Taiwan, the 2nd annual SiP Global Summit will return to Taipei on September 6-7 featuring more than 20 industry leaders from Amkor, Aptina, ASE, Intel, LSI, STATS ChipPAC, STMicroelectronics, UMC and Xilinx to share their insights and solutions on 3D-IC, Through Silicon Via (TSV), 2.5D-IC with silicon interposer, and embedded substrate technologies. The event is one of the world’s most prestigious international summits focusing on advanced packaging and testing technology development and it is expected to attend by more than 500 industry elites from around the world.

New Era of Wafer Transition: 450mm

The Taiwan government approved a request by TSMC to build a new 450mm wafer factory in Taiwan, with the investment amount valued at $8-10 billion, hoping to dramatically lower chip production costs for the whole industry.

In spite of the difficulties ahead, many semiconductor leaders (including TSMC) call for move to 450mm transition to meet the growing complexity, cost and time-to-market challenges.  The next 450mm Supply Chain Forum will be held at SEMICON Taiwan on September 5-7, 2012. As the industry gears up for manufacturing on 450mm wafers, experts from around the world, including representatives from Applied Materials, Lam Research Corporation, Tokyo Electron Limited, TSMC, and the Global 450 Consortium (G450C), will review the R&D initiatives that may lead to fuller implementation of 450mm wafer processing and provide a status of the prevailing challenges for device makers and their suppliers.

Growing Market: MEMS

 Driven by the booming demand of consumer applications, the MEMS market is expected to see another surge in the next few years. According to the latest Yole Développement forecast, MEMS market revenues reached $10.2 billion with strong 17 percent growth in 2011, and will reach an estimated $20 billion above by 2017 with 13 percent CAGR. In a report by IC Insights, the solid-state sensor market grew 21 percent in 2011. Between 2011 and 2016, worldwide sensor sales are expected to grow to $10.9 billion, with an increase of 18 percent CAGR.Trajectory of Sensor Sales

With a comprehensive and robust supply chain, the Taiwan MEMS market holds a strong market position globally. SEMICON Taiwan 2012 features novel development and technology updates on MEMS at the MEMS pavilion, MEMS forum, Innovative Technology Center, and University MEMS Research bringing opportunities to explore the considerable and promising ways to ride the emerging market surge.

Get Ready for the Challenges

Facing the fast-changing business environment and global competition, enterprises must be prepared for unexpected challenges to survive. Mark Durcan (CEO of Micron), Graham Budd (COO of ARM), Mark Liu (executive VP and Co-COO of TSMC), and Dr. Pete Bocko (CTO of Corning Glass Technologies) will be on the same stage at SEMICON Taiwan CEO Forum to share their visions, and point out Taiwan’s strategic role in the world’s microelectronics industry.

For more information and online registration, visit the SEMICON Taiwan website:


August 7, 2012