SiP Global Summit : 3D IC Technology Forum


 
3D IC Technology Forum

Thursday, September 5th, 2013
08:30 –17:00
Room 504 , 5F, TWTC Nangang Exhibition Hall, Taipei


           
 

Theme :    3D IC - The Power of Synergy

Forum Objectives:
(1) Review 2.5D/3D IC Market Situation
(2) Discuss Barrier(or Challenge) to Volume Adoption of 3D IC
(3) Best Practice Knowledge Sharing for Cost & Yield
(4) Discuss the Optimal Standardization on Eco-system and Process Flow. 
  
Outline:

While the whole supply chain is preparing for 3D IC readiness with a given developing infrastructure & facilities to support its go-to-market, and when 2.5D IC design had been adopted by advanced product. However, the ecosystem is looking forward to achieving a faster volume adoption and wider market penetration to ICT products.

Although many valuable perspectives had been addressed about 3D IC in recent years, this 2013 3D IC Technology Forum is to provide further guidance on the path between 2.5DIC and 3DIC from both market and technology drivers. The core issues of yield, standardization and cost will also be addressed to ensure maturity for high volume 2.5D / 3DIC production with TSV. 

Brought to you by
SEMI Taiwan PKG&TEST Committee                          
Program Organizing Committee                         
 
General Chair:
Chairman, SEMI Taiwan PKG&TEST Committee / General Manager & Chief R&D Officer, ASE Group
 
 
 
Forum Chair & Morning Session Moderator: 
Mr. Mike Liang / 梁明成, Member, SEMI Taiwan PKG&TEST Committee / President, Amkor Technology Taiwan
 
Forum Co-Chair & Afternoon Session Moderator

Dr. Mike Ma / 馬光華, Vice President, Corporate R&D, SPIL

 
Panel Discussion Moderator:
Dr. Ian Chan / 詹益仁,  CSO, Hermes-Epite Corp
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Agenda
Time Title / Speaker
08:30 – 09:00Registration 
09:00 – 09:05
Welcome / Opening Remarks
Mr. Mike Liang/ 梁明成, President, Amkor Technology Taiwan
09:05 - 09:45
Opening Speech –2.5D, 3D & Beyond
Dr. Ho-Ming Tong / 唐和明, General Manager & Chief R&D Officer, ASE Group 
09:45 - 10:15
Keynote I: From Advanced Package to 2.5D/3D IC
Dr. Choon-Heung Lee, Corporate Vice President Business & Technology, Amkor Technology
10:15 - 10:45
Keynote II: 3D IC Memory Opportunity: HMC
Mr. Dean Klein, VP of Memory System Development, Micron
10:45 - 11:00Break Time 
11:00 - 11:30
3D IC Integration Challenges and Opportunities 
Dr. S. P. Jeng / 鄭心圃, Director, 3D IC, TSMC
11:30 - 12:00
Glass Interposer Substrates: Fabrication, Characterization and Modeling
Dr. Aric Shorey,  Manager of Commercial Technology,  Corning Incorporated 
12:00 - 13:30Lunch Break

13:30 - 13:35

Welcome Remarks
13:35 - 14:05
A Holistic Method for 3D-IC Realization
Mr. Brandon Wang / 王秉達 , Director, 3D-IC, Silicon Realization Group,Cadence Design Systems, Inc
14:05 - 14:35
TRUE:A New Metrics for ATE Cost Effectiveness 
Mr. Gregory Smith, General Manager, Complex SOC Business Unit Teradyne, Inc
14:35 - 15:05
Update in Material and Process Technologies for 2.5/3D IC
Dr. Rainer Knippelmeyer, Group VP R&D / CTO and General Manager Wafer Bonder, SÜSS MicroTec AG
15:05 - 15:35
Underfill Design and Trend for 2.5D/3D with TSV Package
Mr. Haruyuki Yoshii / 吉井東之, Group Manager, Technical R&D DIV.,NAMICS Corporation
15:35 - 15:45Break
 15:45 - 17:00
 Panel Discussion:
"When the 3DIC/TSV era really comes, and what is the roadblock?"
Moderator: Dr. Ian Chan / 詹益仁, CSO, Hermes-Epitek Corp  
Keynote Presentation: Meterial-Driven Process Development as a New Mode for Industry Collaboration
Dr. Terry Brewer, Founder and President / CEO, Brewer Science, Inc. (20 mins)
 
Panelists: 
1.Dr. Choon-Heung Lee, CTO, Amkor Technology
2.Mr. Dean Klein, VP of Memory System Development, Micron
3.Dr. Terry Brewer, Founder and President / CEO, Brewer Science, Inc.
4.Dr. Huili Fu, Chief IC Packaging Expert and Department Director of IC Packaging Engineering Dept., Huawei (Hisilicon) 
5.Dr. Mike Ma / 馬光華, Vice President, Corporate R&D, SPIL
6.Dr. S. P. Jeng / 鄭心圃, Director, 3D IC, TSMC
7.Mr. Gregory Smith, General Manager, Complex SOC Business Unit Teradyne, Inc. 
 17:00 Adjournment
Programs are subject to change without prior notice.
● All presentations will be conducted in English.
No recording/ photography during seminar.

 

 Forum Fee :
Price & Member TypesOriginal & On-site Price 
Non-Member 
USD$ 235
NTD$ 6,500 
SEMI Member
IEEE Member
USD$195
NTD$5,000

 

 

 

 

 

*Price is not included with 5% tax