SiP Global Summit : 3D IC Technology Forum


 
3D IC Technology Forum

Thursday, September 5th, 2013
08:30 –17:00
Room 504 ABC, 5F, TWTC Nangang Exhibitoin Hall, Taipei

           
 
Theme :    3D IC - Standardization, Cost and Yield 
Forum Objectives:
(1) Review 2.5D/3D IC Market Situation
(2) Discuss Barrier(or Challenge) to Volume Adoption of 3D IC
(3) Best Practice Knowledge Sharing for Cost & Yield
(4) Discuss the Optimal Standardization on Eco-system and Process Flow. 
  
Outline:

While the whole supply chain is preparing for 3D IC readiness with a given developing infrastructure & facilities to support its go-to-market, and when 2.5D IC design had been adopted by advanced product. However, the ecosystem is looking forward to achieving a faster volume adoption and wider market penetration to ICT products.

Although many valuable perspectives had been addressed about 3D IC in recent years, this 2013 3D IC Technology Forum is to provide further guidance on the path between 2.5DIC and 3DIC from both market and technology drivers. The core issues of yield, standardization and cost will also be addressed to ensure maturity for high volume 2.5D / 3DIC production with TSV. 

Brought to you by
                           
                           
 
General Chair:
Chairman, SEMI Taiwan PKG&TEST Committee / General Manager & Chief R&D Officer, ASE Group
 
 
 
Forum Chair & Moderator: 
Mr. Mike Liang/ 梁明成, President, Amkor Technology艾克爾國際科技股份有限公司 總經理, Chairman, SEMI Taiwan PKG&TEST Committee                       
 
Forum Co-Chair(TBD)

Dr. CP Hung / 洪志斌, VP of Corporate R&D, ASE

 
Panel Discussion Moderator:(TBD)
Organized by
 
 
 
 
Technical Sponsored by
 
 
 
 
 
 
 
Sponsored by

 



    
 
Agenda
Time 
Title / Speaker
08:30 – 09:00
Registration 
09:00 – 09:20
Welcome / Opening Remarks
1. Executive, SEMI
2. Dr. Ho-Ming Tong / 唐和明, Chairman, SEMI Taiwan PKG&TEST Committee / General Manager & Chief R&D Officer, ASE Group
3. Mr. Mike Liang/ 梁明成, President, Amkor Technology艾克爾國際科技股份有限公司 總經理, Chairman, SEMI Taiwan PKG&TEST Committee
09:20 - 09:50
Opening Speech – Technology Overview
(From Advanced Package to 2.5D/3D IC)
Mr. Choon-Heung Lee, EVP & CTO, Amkor 
09:50 - 10:20
Keynote Speech - 3D IC Last Mile to Product Adaption (Benefit/Advantage to consumer & system)
Dr. Steve Bezuk, VP, Qualcomm ( Inviting)      
10:20 - 10:30
Break Time 
10:30 - 11:00
3D IC Market Opportunities
CEO,Yole
11:00 - 11:30

3D IC (Interposer & Stacking) Cost Effective Technology Solution-Foundry / OSAT 

Mr. Jerry Tzou / 鄒覺倫 Deputy Director, Backend Business Devision, TSMC

11:30- 12:00

3D IC (Interposer & Stacking) Cost Effective Technology Solution-Process, Equipment and Materials

12:00-13:30
Lunch Break
12:30-12:35
Welcome Remarks
13:35–14:05

A Holistic Method for 3D-IC Realization

 Mr. Brandon Wang , Director, 3D-IC Solutions, Silicon Realization Group,Cadence Design Systems, Inc

14:05–14:35
DfM & Technology Readiness - Test for TSV Perspective
Mr.Greg Smith, General Manager, Computing and Communications Business Unit, Semiconductor Test Division, Teradyne
14:35–15:05
DfM & Technology Readiness – Equipment /Process Perspective (Temp Bond/Debond)
 SUSS      
15:05–15:35

DfM & Technology Readiness – Underfill Design and Trend for 2.5D/3D with TSV Package

Haruyuki Yoshii / 吉井東之, Group Manager, Technical R&D DIV.,NAMICS 

15:35–15:45
Break
 15:45–17:00
 Panel Discussion:
“3D IC Supply Chain Synergy ”

Moderator: Dr. Ian Chan, Hermes-Epitek 
Keynote Presentation:Meterial-Driven Process Development as a New Mode for Industry Collaboration
Dr. Terry Brewer, CEO, Brewer Science (20 mins)

Panelists: 
1.Mr. Choon-Heung Lee, CTO, Amkor
2.Dr. CP Hung, VP of Corporate R&D, ASE Group
3.Dr. Terry Brewer, CEO, Brewer Science
4.Dr. Mike Ma, Vice President, Corporate R&D, SPIL
5.Dr. Steve Bezuk, VP, Qualcomm (Inviting)
6.Mr. Jerry Tzou, Deputy Director, Backend Technology and Service Div., TSMC
7.Mr. Gregory Smith, General Manager, Semiconductor Test Division, Teradyne 

 17:00
 Adjournment
● Programs are subject to change without prior notice.
● All presentations will be conducted in English.
● No recording/ photography during seminar.

 

 Forum Fee :

Price & Member Types
Original & On-site Price (AfterSeptember 1st)
Special Price (Until August 9th)

Group Price - 3 People Above

(August 10th to August 31st)

Non-Member 

USD$ 235

NTD$ 6,500 

USD$140

NTD$3,600

USD$140 / Per Person

 NTD$ 3,600 / Per Person

 

SEMI Member

IEEE Member

USD$195

NTD$5,000

USD$140

NTD$3,500

 

 

 

 

 

 

* Price is not included with 5% tax

* On-Line Registration is open until Auguest 31st 

* To complete registration and payment brfore Auguest 9th to enjoy special price