Assembly & Packaging Committee

This committee explores, evaluates and formulates consensus-based specifications that through voluntary compliance will enhance the manufacturing capability of the semiconductor industry as it relates to the packaging and assembly of the semiconductor chip.

This includes the materials, piece parts, and interconnection schemes, and unique packaging assemblies that provide for the communication link between the semiconductor chip and the next level of integration.

Emphasis will be placed on establishing standards, guidelines, test methods, practices, and specifications for materials, equipments, physical and electrical acceptance criteria, environmental testing, and test methods for measuring these standards.

For more information, contact SEMI Standards at standards@semi.org.

Assembly & Packaging Committee Activities

Upcoming SEMI Standards Meetings:

• View SEMI Standards Calendar of Events

Interested in Participating?

SEMI Standards Program Membership is required to participate. Registration is free and quick. Join Now!

SEMI Assembly & Packaging Standards

Search for published SEMI Assembly & Packaging Standards

Quick Links:

• Document Status Report
• New Activity Report Forms (SNARFs) and Task Force Organization Forms (TFOFs)
• Committee Meeting Minutes

Balloting Information

• Critical Dates for Ballots – Submission Deadlines and Voting Period
• Vote on Ballots
• How to vote on SEMI Standards Ballots

Contact Us

• SEMI Staff Contacts