Assembly & Packaging Committee

Assembly & Packaging Committee

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This committee explores, evaluates and formulates consensus-based specifications that through voluntary compliance will enhance the manufacturing capability of the semiconductor industry as it relates to the packaging and assembly of the semiconductor chip.

This includes the materials, piece parts, and interconnection schemes, and unique packaging assemblies that provide for the communication link between the semiconductor chip and the next level of integration.

Emphasis will be placed on establishing standards, guidelines, test methods, practices, and specifications for materials, equipments, physical and electrical acceptance criteria, environmental testing, and test methods for measuring these standards.

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