3DS-IC Industry Standards

(Three-dimensional Stacked Integrated Circuits) Committee

To explore, evaluate, discuss, and create consensus-based specifications, guidelines, and practices that, through voluntary compliance, will;

• promote mutual understanding and improved communication between users and suppliers of 3DS-IC materials, carriers, equipment, automation systems and devices
• enhance the manufacturing efficiency, capability and shorten 3DS-IC time-to-market
• reduce manufacturing cost in the 3D-IC industry.

For more information, contact SEMI Standards at standards@semi.org.

3DS-IC Industry Standards Committee Activities

Upcoming SEMI Standards Meetings:

• July 9, 2013. SEMICON West Standards Meetings
  San Francisco, CA
• View SEMI Standards Calendar of Events

Interested in Participating?

SEMI Standards Program Membership is required to participate. Registration is free and quick. Join Now!

Published SEMI 3DS-IC Standards:

SEMI 3D1-0912, Terminology for Through Silicon Via Metrology

3DS-IC  standards are currently in discussion and development.

Quick Links:

• New Task Forces and Activities
• 3DS-IC Document Status Report
• New Activity Report Forms (SNARFs) and Task Force Organization Forms (TFOFs)
• Committee Meeting Minutes
• Committee Express Reports
• SEMI Standards 3DS-IC Site

Balloting Information:

• Critical Dates for Ballots – Submission Deadlines and Voting Period
• Vote on Ballots
• How to Vote on SEMI Standards Ballots

Contact Us:

• SEMI Staff Contacts