3DS-IC SEMI Standards Committee

3DS-IC Industry Standards SEMI Standards Logo

(Three-dimensional Stacked Integrated Circuits) Committee

To explore, evaluate, discuss, and create consensus-based specifications, guidelines, and practices that, through voluntary compliance, will;

  • promote mutual understanding and improved communication between users and suppliers of 3DS-IC materials, carriers, equipment, automation systems and devices
  • enhance the manufacturing efficiency, capability and shorten 3DS-IC time-to-market
  • reduce manufacturing cost in the 3D-IC industry.

For more information, contact SEMI Standards at standards@semi.org.

3DS-IC Industry Standards Committee Activities

Upcoming SEMI Standards Meetings:


Interested in Participating?

SEMI Standards Program Membership is required to participate. Registration is free and quick. Join Now!


Published SEMI 3DS-IC Standards:

SEMI 3D1-0912, Terminology for Through Silicon Via Metrology

3DS-IC  standards are currently in discussion and development.

Quick Links:


Balloting Information:


Contact Us: