Strategic Materials Conference—SMC 2014

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This year’s theme, Materials Matter—Enabling the Future of IC Fabrication and Packaging, will take a broad look at what is driving the demand for new materials, and how material suppliers are being impacted by the value chain they serve.

The semiconductor industry has reached a major inflection point: no longer is device scaling and performance driven solely by reductions in feature size.  Higher device performance using less power requires the incorporation of many new materials to maintain the industry’s cadence.  These material needs to span across the spectrum from fabricating 3D transistor structures, to accelerating interconnect speeds, to packaging the devices in the appropriate form factors for use in phones, tablets and devices encompassing the internet of things.  SMC will discuss market opportunities and examine how to win in this “Age of Materials”. 

New in 2014!  

  • Device Makers Session: Materials Challenges for Emerging Technology and Devices
  • Market Trends Session: Economic/Material Trends/Emerging Technology Trends
 

Date:  

Tuesday and Wednesday
September 30–October 1, 2014

Location:  
Biltmore Hotel and Suites
Santa Clara, California

 


SMC 2014 Sponsors

 

 

 

American Elements manufactures high purity crystals, wafers, organometallic precursors, & ceramic packaging materials for semiconductor devices, integrated circuits, electronics, & solar cells

 

 

 

 

JSR Micro

 

JX Logo

 

            

 

 

 

SAFC High Tech Logo

 

 

Download Sponsorship Opportunities 

For further information on sponsorship opportunities, please contact:

Marlene Sibley
Tel: 1.408.943.6988
Email msibley@semi.org.

 


Questions?

Lin Tso
Tel: 408.943.7920
Email: ltso@semi.org

 

 

 Keynote Speakers:

Tim G. HendryMatt Nowak
Vice President, Technology & Manufacturing GroupSenior Director, Engineering, Global Operations Group
Intel CorporationQualcomm

Topics Covered

  • Device Architecture Processing Technologies for IC Manufacturing
  • Evolving IC Packaging Assembly Approaches
  • Scaling challenges and emerging solutions of the microelectronics value chain
  • Implications for FEOL/BEOL materials suppliers aligned to the roadmaps of key industry participants, including IDMs, OEMs, and strategic technology developers
  • Economic, Material, Emerging Technology Trends

SMC has provided valuable information and networking opportunities to materials and electronics industry professionals since 1995. SMC 2014 builds on that legacy, expanding the reach and focus of the conference to examine advanced electronics materials for the semiconductor and adjacent industries.

2014 Participating Companies

  • Air Liquide S.A.
  • Air Products and Chemicals
  • Albemarle Corporation
  • Applied NanoStructured Solutions
  • ASE, Inc.
  • AZ Electronic Materials
  • BASF SE
  • Brewer Science
  • Cabot Microelectronics
  • ChemTrace Analytical Services
  • Data Key Consultting
  • Digital Specialty Chemicals, Ltd.
  • Delphon Industries 
  • Dow Chemical Company
  • Eastman Chemical Company
  • Edwards Vacuum
  • Electronic Fluorocarbons
  • Eminess Technologies
  • Entegris
  • Eastman Chemical Company
  • Evonik Industries
  • Fine Consulting
  • Fujifilm
  • Gelest Inc.
  • GLOBALFOUNDRIES
  • Greene, Tweed & Co.
  • Hilltop Economics
  • Hitachi Chemical Co. America
  • Honeywell Electronic Materials
  • IBM Almaden Research Center
  • IBM T.J. Watson Research Center
  • IC Insights
  • IHS Chemical
  • IIika Technologies
  • Intel Corporation
  • JSR Micro
  • JX Nippon Mining & Metals
  • KMG Electronic Chemicals
  • Lam Research Corporation
  • LG Silltron, Inc.
  • Linde Electronics
  • Linx Consulting
  • Lux Research
  • Matheson
  • MicroChem
  • Micron Technology
  • Milliken Intrastructure Solutions
  • Momentive Performance Materials
  • Namics Technologies, Inc.
  • Nano-C
  • OCI Materials Co., Ltd.
  • Pioneer Materials
  • Praxair Electronics
  • Qualcomm
  • ReVera Incorporated
  • SACHEM
  • SAFC Hitech
  • Safina Materials, Inc.
  • SanDisk Corporation
  • SEH America, Inc.
  • Siltronic AG
  • SiVance LLC
  • Stanford University, Materials Science and Engineering
  • Stifel Nicolaus
  • Strategic Metal Investments
  • SunEdison Semiconductor
  • Taiwan HIUV New Materials Corporation
  • Techcet Group LLC
  • TechSearch International, Inc.
  • Tessera
  • The Linde Group
  • Tosoh SMD USA, Inc.
  • TriQuint Semiconductor
  • Ultra Clean Technology
  • UP Chemical Co., Ltd.
  • Vacuum Engineering & Materials Co.
  • VLSI Research, Inc.
  • W.L. Gore & Associates, Co., Ltd.