Scaling Challenges: The Future of Materials and Packaging
|September 20–21, 2016|
Computer History Museum
Mountain View, CA 94043
The Strategic Materials Conference—SMC 2016, is a two-day conference that brings together key players from the semiconductor industry ecosystem to share insights on the latest developments in advanced materials. SMC 2016 will delve into what’s driving demand for new materials and packaging and discuss how suppliers are responding to problems posed by existing scaling limitations.
This year’s must-attend event will focus on emerging materials and packaging technology trends across the entire microelectronics supply chain and provide an insider’s outlook for the future. High-profile keynotes will deliver insights on the business drivers behind innovations in device manufacturing and scaling.
SMC 2016 Keynotes
|From Materials to Artificial Intelligence—A Deep Learning IC Industry Neuro- network in the Era of System Level Integration||The Overview of China IC Materials Industry and the Growing Market||A Critical Look at Material Challenges Emerging as a Result of Patterning becoming Integrated and Self- aligned|
|John Hu, Ph.D.|
|Ingrid Y. Shi|
The Integrated Circuit Materials Industry Technology Innovative Alliance
|Anton deVilliers, Ph.D.|
Director Patterning Technology SMTS
Tokyo Electron America
SMC 2016 SPONSORS