ASMC 2012 Agenda

Complete ASMC 2012 agenda (May 15-17)

Highlights:

Workshop (May 14 - 3:30pm) Workforce Development (to participate, contact mkindling@semi.org)

Keynote (May 15 - 8:45am) Michael Campbell, Sr. Vice President, of Engineering, Qualcomm: Mobile Wireless Driving the Semi Industry: A Semi Customer’s View

Tutorial (May 16 - 2:05pm) Stefan Wurm, Director of Lithography, SEMATECH: Lithography Challenges – A Technology Update

Keynote (May 16 - 8:30am) Dr. Subramanian Iyer, IBM Fellow, IBM Microelectronics: "From Deep Trenches to Skyscrapers - the Evolution of Embedded Memory at IBM"  

Keynote (May 17 - 12:20pm)  Risto Puhakka, President, VLSI Research: IC Market Trends and Forecast

Tutorial (May 17 - 8:00am) Edward J. Nowak, IBM Fellow: Advanced Device Design

Panel: Competing for R&D Dollars: Funding the Future (following Sessions 12 & 13 on May 16)
As advances in materials and process technology continue, the semiconductor manufacturing industry is faced with difficult challenges concerning costs.  In order to stay on the productivity curve, companies must address several critical technology issues.  However, with limited R&D dollars, it is unclear how wafer size transition, next node scaling, new transistor technology, and 3D IC will be funded.  A limited number of companies will pursue 450mm, but many more are looking at 3D ICs.  Add to this the challenge of EUV.  Where will IC companies put their investment? What about their suppliers?  Should the focus be on 450mm conversion or advanced process technologies?  Who will ultimately pay the price?  Where does the ROI end?   A panel of industry experts addresses these and other related productivity and technology challenges facing the global chip-making community.
Moderator: Peter Singer, Editor-in-Chief, Solid State Technology.  Panelists: David Bennett, VP Alliances, GLOBALFOUNDRIES; Noreen Harned, VP Marketing, ASML; Subramanian Iyer, Ph.D., IBM Fellow, IBM Systems & Technology Group;  Nag Patibandla, Ph.D., Sr. Director (Office of CTO), Applied Materials; Risto Puhakka, President, VLSI Research.

Technical Sessions:

Session 1 - Yield Enhancement (in parallel with Session 2)
Chairs:
Gary Green, Green Consulting; Christopher Hess, PDF Solutions

Defect inspection, yield analysis and optimization are integral components in the development and manufacture of semiconductor devices.
This session reviews optimizing and maximizing product yield and intelligently isolating faults.

Session 2 - Factory Optimization I
Chairs:
Prashant Aji, KLA-Tencor; Stefan Radloff, Intel Corporation

Semiconductor equipment and manufacturing is increasingly complex and driven by strict economic constraints.   It is vital for IC production to improve efficiency, control costs, and be good environmental stewards.  This session discusses new approaches to factory optimization based on data analysis and simulation.

Session 3 - Defect Inspection
Chairs
: Kazunori Nemoto, Hitachi Hi-Tech; Oliver Patterson, IBM; Dieter Rathei, D R Yield
Defect inspection, yield analysis and optimization are integral components in the development and manufacture of semiconductor devices.  Defect inspection takes place in several areas of the fab, ranging from initial inspection of ultra thin films to final inspection of scribed die.  This session will review several innovative techniques to detect and reduce defects in varied processes in semiconductor manufacturing.  

Session 4 - Advanced Metrology I (in parallel with session 3)
Chairs: Dick James, Chipworks; Alok Vaid, GLOBALFOUNDRIES

Advanced semiconductor manufacturing demands advanced metrology techniques. This session details some new reflectometry, ellipsometry, scatterometry, X-ray andthermal wave use cases.

Session 5 - Emerging Technologies and Innovative Devices
Chairs
:  Eric Eisenbraun, CNSE; Jacek Tyminski, Nikon Precision
Innovative integrated circuit functionalities continue to be integrated in semiconductor manufacture. This session presents analysis of the effects of enabling technologies, and innovative integrated circuit designs.

Session 6 - Advanced Metrology I (in parallel with session 5)
Chairs:
  Pat Gabella, The Gabella Group; David Huang, Pall Microelectronics; ThanasBudri, Texas Instruments

Advanced semiconductor manufacturing demands advanced metrology techniques.  This session details some new reflectometry, ellipsometry, scatterometry, X-ray and thermal wave use cases.

Session 7 - Interactive Session and Reception
This popular session provides an ideal opportunity for interaction between authors and conference attendees.  During this session, participants may engage authors in in-depth discussion of a wide range of issues impacting semiconductor manufacturing, from wide range of manufacturing and technology enhancements.
Chairs:  Jennifer Braggin, Entegris; Russell Dover, Brion; Dave Gross, GLOBALFOUNDRIES; Rob Pearson, Rochester Institute of Technology; Darryl Peters, Confluense; Viraj Pandit, Novellus; Thuy Tran-Quinn, IBM

Session 8 - Factory Optimization
Chairs:
Sumita Basu, Intel Corporation; Paul Werbaneth,
Semiconductor equipment and manufacturing is increasingly complex and driven by strict economic constraints.  It is vital for IC production to improve efficiency, control costs, and be good environmental stewards.  This session covers novel solutions for environmental and material handling challenges

Session 9 - Advanced Process Control (in parallel with Session 8)
Chairs:
Agnès Roussy, EMSE; Raymond van Roijen, IBM
The demand for high quality and yield is a constant driver for advanced process development and control techniques. This session covers innovation in process controls and shows how predictive maintenance and virtual metrology will impact manufacturing.

Session 10 - Equipment and Materials Productivity
Chairs: Scott Lantz, Intel Corporation; Christopher Long, IBM Research
The challenges of current and future semiconductor process technologies require a higher level of equipment reliability, quality, repeatability and productivity.  Optimizing equipment performance will help improve fab metrics, minimize wafer costs and maximize competitiveness.  Papers in this session will review ideas and successes to help optimize equipment utilization, improve predictive modeling of fab operations, and tool performance.

Session 11 - Advanced Patterning and Design for Manufacturability
Chairs: Holly Magoon, Nikon Precision; Mike McIntyre, GLOBALFOUNDRIES
IC production today requires innovative lithography design and manufacturing techniques. Papers in this informative session include collaborative efforts between chip makers and equipment suppliers discussing leading-edge solutions for advanced lithography techniques such as double patterning. Recent developments in Design for Manufacturability will also be highlighted.

Session 12 - Equipment and Materials Productivity
Chairs:
Johann Massoner, Infineon; Naomi Yoshida, Applied Materials
The challenges of current and future semiconductor process technologies require a higher level of equipment reliability, quality, repeatability and productivity.  Optimizing equipment performance will help improve fab metrics, minimize wafer costs and maximize competitiveness. Papers in this session will review ideas and successes to help optimize equipment utilization, improve predictive modeling of fab operations, and tool performance.

Session 13 - Equipment Performance ((in parallel with Session 13)
Chairs: Jan Rothe, GLOBALFOUNDRIES; Brett Williams, ON Semiconductor
The challenges of current and future semiconductor process technologies require a higher level of equipment reliability, quality, repeatability and productivity.  Optimizing equipment performance will help improve fab metrics, minimize wafer costs and maximize competitiveness.  Papers in this session will review ideas and successes to help optimize equipment utilization, improve predictive modeling of fab operations, and tool performance.

Session 14 - Defect Inspection II
Chairs
: Jeff Barnum, KLA-Tencor; Bill Miller, IBM Microelectronics
Defect inspection, yield analysis and optimization are integral components in the development and manufacture of semiconductor devices.  This session will feature papers on e-beam inspection used for defect inspection of advanced technologies and improving defect inspection efficiency. 

Session 15 - 3D/Through Silicon Via (TSV)  (in parallel with session 14)
Chairs
: Hamid Khorram, Nikon Precision; James Lu, RPI
Very large Scale Integration motivates 3D integrated circuit architectures. This session presents complexities of Through Silicon Via techniques supporting 3D designs.