Prashant Aji, KLA-Tencor
Jeff Barnum, KLA-Tencor
Sumita Basu,Ph.D., Intel Corporation
Jeanne P. Bickford, Ph.D. IBM Silicon Solutions Development
Duane Boning, Ph.D., MIT
Jennifer Braggin, Entegris
Thanas Budri, Texas Instruments
Philippe Campion, STMicroelectronics
Amiad Conley, Applied Materials
Eric T. Eisenbraun, Ph.D., College of Nanoscale Science & Engineering
Gary Green, Alphray, Inc.
Dave Gross, GLOBALFOUNDRIES
Franz Heider, Ph.D., Infineon Technologies Austria
Christopher Hess, PDF Solutions
Hamid Khorram, Nikon Precision
Scott Lantz, Intel Corporation
Byoung-Ho Lee, Ph.D., Samsung
John Lin, TSMC
Christopher Long, IBM Research
James Lu, Ph.D., RPI
Holly Magoon, Nikon Precision
Daniel Maynard, IBM Microelectronics
 

Scott McClure, IBM Microelectronics
Michael McIntyre
Israel Ne'eman, Applied Materials
Kazunori Nemoto, Ph.D., Hitachi Hi-Technologies
Oliver Patterson, Ph.D.,IBM Microelectronics
Viraj Pandit, Intel Corporation
Larry Pulvirent, GLOBALFOUNDIRES
Robert Pearson, Ph.D., Rochester Institute of Technology
Dieter Rathei, D R YIELD Software & Solutions
Jan Rothe, GLOBALFOUNDRIES
Agnès Roussy, EMSE - CMP Georges Charpak
Leonard Rubin, Ph.D., Axcelis
Michael Sevegney, Ph.D., Pall Corporation
Thuy Tran-Quinn, IBM Microelectronics
Jacek Tyminski, Nikon Research
Alok Vaid, GLOBALFOUNDRIES
Raymond Van Roijen, IBM Microelectronics
Paul Werbaneth
Brett Williams, ON Semiconductor
Yayi Wei, Ph.D., GLOBALFOUNDRIES
Naomi Yoshida, Applied Materials