HB-LED Standards Update

HB-LED Standards Update

By Paul Trio, SEMI

The North America HB-LED Committee held its Fall 2011 meeting on October 27 at SEMI Headquarters in San Jose, California.  The committee’s progress on various standardization efforts are provided below:

New Task Force on Impurities & Defects

The committee authorized the formation of the Impurities & Defects in HB-LED Sapphire Wafers Task Force.  The task force (TF) was chartered to investigate, define and/or measure critical impurities and defects in sapphire wafers and the metrology intended to measure them.  Topics to be considered may include, but are not limited to:

  • Bulk Crystal Defects
  • Bulk Crystal Impurities
  • Surface Defects
  • Surface Impurities

The task force will then create standards related to these impurities and defects for use by HB-LED sapphire wafer makers and producers of related devices.

Upcoming Standards Meetings

SEMI HB-LED Standards Task Force Meetings: In conjunction with Strategies in Light on Thursday, Feb 9 from 1:00-5:00 PM (U.S. Pacific Time) at the Santa Clara Convention Center, 5001 Great America Parkway, Santa Clara, CA, in the Great America Ballroom K. Click here for Strategies in Light (Feb 7-9) information.  For more information, contact Paul Trio, 408.943.7041, Email:  ptrio@semi.org

Since there will not be enough time for detailed technical discussions on Feb 9, there will be an additional all-day meeting at SEMI HQ on Tue, Feb 7 at 3081 Zanker Road, San Jose, CA. The meeting will cover: Equipment Automation Task Force (TF), Hardware/Software Working Groups (8:00 AM to 5:00 PM, Seminar 3 Room) and Wafer Task Force (2:00 PM to 5:00 PM, Pine Room).

More NA HB-LED committee and TF meetings will be held on April 5 in conjunction with the North America Standards Spring 2012 meetings in San Jose, CA.  Adjudication of ballot 5265 will take place at the HB-LED Committee meeting on April 5.

HB-LED Wafer Task Force

The HB-LED Wafer Task Force recently completed its development work on SEMI Draft Document 5265, Specification for 150 mm Diameter Sapphire Wafers for HB-LED Applications.  The document covers four specifications depending on fiducial type (flat/notch) and thickness (1,000 um/1,300 um). 

SEMI uses the balloting process to obtain comments and votes as a means of achieving industry consensus on a proposed standard.  If all negatives and comments on the document are resolved to the satisfaction of the technical committee and within the limits defined by SEMI Standards Regulations, the ballot passes.  If certain parameters need further discussion and require additional changes, the ballot can be failed, revised, and then reballoted for voting.

Ballot 5265 is currently issued in the Cycle 1 voting period.  All SEMI HB-LED Technical Committee Members are requested to review the ballot and cast their votes.  The last day for voting for Cycle 1 ballots is February 16, 2012.

SEMI Standards activities are open to all interested parties, but registration for SEMI Standards Program membership is required in order to participate in meetings as well as to vote on ballots.  Also, by registering for the HB-LED Committee as a Technical Committee Member, members will receive important announcements (including the availability of ballots for voting) that are related to this group.

The SEMI Standards Membership Application Form is available at: www.semi.org/standardsmembership

HB-LED Equipment Automation Task Force

The HB-LED Equipment Automation Task Force is comprised of a Hardware Working Group (WG) and a Software WG. 

The Hardware WG began drafting a specification for 150 mm open cassette.  Parameters of this draft specification include:

  • Exterior dimensions (e.g., length, width, height)
  • Capacity (e.g., pockets per container, pocket spacing)
  • Other details (e.g., pocket width/depth/flat, pin and hole center distance from pocket center line)

The WG is also discussing standardization for the HB-LED load port.

The Software WG is continuing its analysis of the HB-LED factory communications survey that was deployed in early fall 2011.  The survey solicited industry feedback on functional requirements for software interface in HB-LED:

  • Today (e.g., trace data collection of system variables, equipment control, process program management, event/alarm reporting, etc.)
  • Future (e.g., process job/control job management, complex wafer tracking in cluster, support for advanced process control, support for Interface A, protection against virus attacks & data misusage, etc.)

Responses received from the survey would be used as building blocks for the HB-LED factory communications standards to be developed by this group.

Upcoming Standards Meetings

SEMI HB-LED Standards Task Force Meetings: In conjunction with Strategies in Light on Thursday, Feb 9 from 1:00-5:00 PM (U.S. Pacific Time) at the Santa Clara Convention Center, 5001 Great America Parkway, Santa Clara, CA, Meeting Room: Great America Ballroom K. Click here for Strategies in Light (Feb 7-9) information. 

Since there will not be enough time for detailed technical discussions on Feb 9, there will be an additional all-day meeting at SEMI HQ on Tue, Feb 7 at 3081 Zanker Road, San Jose, CA. The meeting will cover: Equipment Automation Task Force (TF), Hardware/Software Working Groups (8:00 AM to 5:00 PM, Seminar 3 Room) and Wafer Task Force (2:00 PM to 5:00 PM, Pine Room).

More NA HB-LED committee and TF meetings will be held on April 5 in conjunction with the North America Standards Spring 2012 meetings in San Jose, CA.  Adjudication of ballot 5265 will take place at the HB-LED Committee meeting on April 5.

For more information, contact Paul Trio at ptrio@semi.org.

February 6, 2012