December 2011 SEMI Book-to-Bill Rescheduled

The December 2011 SEMI Book-to-Bill press release, originally scheduled for January 19, 2012, has been rescheduled pending completion of data collection.

SEMI will issue the December 2011 Book-to-Bill press release at approximately 1:30 p.m. Pacific on Monday, January 23, 2012.

About the SEMI Book-to-Bill

The SEMI Book-to-Bill Report provides a first look at the book-to-bill ratio for North American Headquartered Semiconductor Equipment Manufacturers. The three-month average global bookings and billings are a strong indicator for trends in the worldwide semiconductor industry. SEMI follows the protocol established by the U.S. Department of Commerce in publishing our figures only on a three-month average basis. We do this in order to smooth out the natural volatility in bookings. This report is distributed monthly approximately three weeks after the close of each month. Categories covered include front-end (wafer processing/mask/reticle/wafer manufacturing/fab facilities) equipment and final manufacturing (assembly/packaging/test) equipment. For more information, visit