HB-LED Standardization Updates – December 2011
By Paul Trio, SEMI
The North America HB-LED Committee held its Fall 2011 meeting on October 27 at SEMI Headquarters in San Jose, California. The committee’s progress on various standardization efforts are provided below:
New Task Force on Impurities & Defects
The committee authorized the formation of the Impurities & Defects in HB-LED Sapphire Wafers Task Force. The task force (TF) was chartered to investigate, define and/or measure critical impurities and defects in sapphire wafers and the metrology intended to measure them. Topics to be considered may include, but are not limited to:
- Bulk Crystal Defects
- Bulk Crystal Impurities
- Surface Defects
- Surface Impurities
The task force will then create standards related to these impurities and defects for use by HB-LED sapphire wafer makers and producers of related devices.
HB-LED Wafer Task Force
The HB-LED Wafer Task Force recently completed its development work on SEMI Draft Document 5265, Specification for 150 mm Diameter Sapphire Wafers for HB-LED Applications. The document covers four specifications depending on fiducial type (flat/notch) and thickness (1,000 um/1,300 um). The next step is to submit a ballot proposal to the global HB-LED technical committee for members to cast their votes.
SEMI uses the balloting process to obtain comments and votes as a means of achieving industry consensus on a proposed standard. If all negatives and comments on the document are resolved to the satisfaction of the technical committee and within the limits defined by SEMI Standards Regulations, the ballot passes. If certain parameters need further discussion and require additional changes, the ballot can be failed, revised, and then reballoted for voting.
The ballot proposal from the HB-LED Wafer Task Force, SEMI Draft Document 5265, is scheduled to be issued for the Cycle 1, 2012 voting period. The voting period starts January 17 and ends February 16.
SEMI Standards activities are open to all interested parties, but registration for SEMI Standards Program membership is required in order to participate in meetings as well as to vote on ballots. Also, by registering for the HB-LED Committee as a Technical Committee Member, members will receive important announcements (including the availability of ballots for voting) that are related to this group.
The SEMI Standards Membership Application Form is available at: www.semi.org/standardsmembership
HB-LED Equipment Automation Task Force
The HB-LED Equipment Automation Task Force is comprised of a Hardware Working Group (WG) and a Software WG.
The Hardware WG began drafting a specification for 150 mm open cassette. Parameters of this draft specification include:
- Exterior dimensions (e.g., length, width, height)
- Capacity (e.g., pockets per container, pocket spacing)
- Other details (e.g., pocket width/depth/flat, pin and hole center distance from pocket center line)
The WG is also discussing standardization for the HB-LED load port.
The Software WG is continuing its analysis of the HB-LED factory communications survey that was deployed in early fall 2011. The survey solicited industry feedback on functional requirements for software interface in HB-LED:
- Today (e.g., trace data collection of system variables, equipment control, process program management, event/alarm reporting, etc.)
- Future (e.g., process job/control job management, complex wafer tracking in cluster, support for advanced process control, support for Interface A, protection against virus attacks & data misusage, etc.)
Responses received from the survey would be used as building blocks for the HB-LED factory communications standards to be developed by this group.
Upcoming Standards Meetings
The next face-to-face meetings for the HB-LED task forces will be held in conjunction with Strategies in Light, February 7-9, 2012 in Santa Clara, California. The next NA HB-LED committee and TF meetings will be held on April 5 in conjunction with the North America Standards Spring 2012 meetings in San Jose, CA. Adjudication of ballot 5265 will take place at the HB-LED Committee meeting on April 5.
SEMI Standards Watch, December 2011