Packaging Materials Market is in the Midst of Significant Changes
SAN JOSE, Calif. — December 14, 2011 — The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $22.8 billion in 2011 and grow to $25.7 billion by 2015, according to a new study by SEMI and TechSearch International. Laminate substrates remain the largest segment of the market, worth an estimated $9.7 billion globally in 2011, and on a unit basis are projected to grow at a compound annual growth rate of eight percent over the next five years.
The report, titled “Global Semiconductor Packaging Materials Outlook: 2011/2012 Edition,” covers laminate substrates, flex circuit/tape substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics and thermal interface materials.
Several areas are experiencing stronger growth as new material ramp up in production in packaging, including underfill materials, wafer-level dielectrics, copper bonding, leadframe CSP, and others.
Semiconductor Packaging Materials Segment
Estimate of 2011
Flex Circuit/Tape Substrates
Die Attach Materials
Wafer Level Package Dielectrics
Thermal Interface Materials
The findings in the report are based on more than 140 indepth interviews conducted with packaging subcontractors, semiconductor manufacturers and materials suppliers. It includes previously unpublished data on revenue, unit shipments and market shares for each packaging material segment; a five-year forecast of revenue and units (2011-2015), average selling price data and trends; and an analysis of regional market trends.
The report also identifies important technology and business trends affecting the packaging materials market, as well as opportunities for suppliers. Some of the key opportunities include:
- Companies targeting laminate substrates with 9 micron lines and spaces
- New improved materials to reduce warpage in thin core substrates
- Resin materials with low ionic levels compatible with copper bonding wire
- Mold compound or encapsulant materials for high wire density packaging and matrix substrates
- No-flow or “wafer applied” underfill for flip chip die
- Reworkable package underfill materials
- Thermally conductive die attach film (DAF) materials
- Improved materials for redistribution layers (RDLs) in wafer level packages (WLPs) with higher resolution at thicker layers
The report is available for purchase from SEMI for $4,000 (SEMI members), and $5,000 (non-members). A company-wide site license is also available. For more information, visit www.semi.org/en/MarketInfo.
SEMI is the global industry association serving the nano- and microelectronics manufacturing supply chains. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org
About TechSearch International
Founded in 1987, TechSearch International (Austin, Texas) is a technology licensing and consulting company specializing in accurate, relevant and timely information on advanced packaging technology and market developments. For more information, visit TechSearch International Inc. at www.techsearchinc.com
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