From Lab to Fab; Progress and Challenges for Industrialization of New Lithography Technologies

Jim Koonman
President
ASML Brion

Abstract:

As an industry we have kept Moore's law alive, albeit at the cost of complexity and shrinking tolerances. Often the path to the solution that best fits a chip manufacturer's needs is not immediately obvious. As an industry leader in lithography equipment, ASML provides crucial support for the semiconductor shrink roadmap.

ASML continues to develop immersion lithography scanners to support cost-effective double patterning and even quadruple patterning, supported by an expanding portfolio of Holistic Lithography products that can predict and adjust for shrinking tolerances. 

At the same time, EUV lithography has become a reality with five second-generation EUV systems already exposing wafers at customer manufacturing sites. Offering single exposure shrink and many other advantages over more complex technologies, EUV is in the process of becoming a stable, high-productivity lithography platform for the next decade of shrink, offering several more benefits for the early adopters. 

This presentation connects the crossroads faced by today's pluriform chip manufacturing industry and ASML's commitment to help the industry continue Moore's law.