What’s Happening in Standards? Selected Updates on 450mm, 3D-IC, HB-LED, and FPD

What’s Happening in Standards? Selected Updates on 450mm, 3D-IC, HB-LED, and FPD

450mm: New International Task Force on Cluster Tool and Process Module Physical Interface

The International Process Module Physical Interface Task Force (IPPI-TF) was chartered to address standardization of physical interface and other interoperability related specification for the 450mm (vacuum) process modules and transfer module of the cluster tool.  The task force was approved at the last North America Physical Interfaces & Carriers Technical Committee face-to-face meeting held at SEMICON West 2011 in July. The Task Force will focus on assessing industry needs and the necessary extent of standardization activities for physical interfaces and other interoperability-related specifications for the 450mm (vacuum) process modules and transfer module of the cluster tool.

Among the so-called Cluster Tool Module Interface Standards for 300mm tools, the SEMI E21.1 (Mechanical Interface and Wafer Transport Standard) and SEMI E22.1 (Transport Module End Effector Exclusion Volume Standard) standards were widely adopted by suppliers of process tools and cluster tools. Many believe that these two standards have facilitated easy integration of various process modules into cluster tool (platform) or the transfer module of an existing process tools.

Standardizing the physical interface between the cluster tool and process module is beneficial for both process equipment supplier and users as it can shorten the period between the chamber development stage and the volume production tool qualification stage. The 450mm Standards to be developed would define the physical interface and other interoperability-related specification between the process chamber and the different modules (e.g., transfer module) of a cluster tool, which would be the 450mm equivalent of SEMI E21.1 and SEMI E22.1 or something similar.  This approach would minimize the necessary level of physical connectivity to the transport module part of a process tool for any process module without any significant design change when the process module is incorporated into the process tool.

The International Process Module Physical Interface TF will be led by Supika Mashiro (Tokyo Electron) and Richard Oechsner (Fraunhofer Institute) with several other companies planning to participate in this effort, including: Brooks Automation, Canon Anelva, Crossing Automation, Daifuku, Dainippon Screen, Hitachi High-Tech, Hitachi Kokusai, Muratec Automation, and Nikon.

If you register for the Physical Interfaces & Carriers Committee (as a Technical Committee Member), you will receive important emails/announcements related to this committee. 

NEXT MEETINGS: The next SEMI IPPI Task Force Meeting will be held on October 11 (not 13 as originally reported) in conjunction with the Standards Meetings at SEMICON Europa then on October 24 in conjunction with the North America Standards Fall 2011 Meetings. Also note upcoming training on December 9: 450mm STEP

For more information about 450mm standards, please contact Paul Trio at ptrio@semi.org.

SEMI North America 3DS-IC Committee

The SEMI North America 3DS-IC Committee approved two new activities under its Inspection & Metrology Task Force during SEMICON West 2011 in San Francisco, California:

The committee appointed Yi-Shao Lai (ASE), Curt Shannon (SigmaTech), and David Read (NIST) as the new leaders of the Inspection & Metrology Task Force.  The task force also discussed creating a reference standard on test and detection protocols for metrology tools to be used for “round-robins.”

The Thin Wafer Handling Task Force continued its discussion and development of a Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers (#5175).  Areas of focus for this activity will include, but are not limited to: shipping containers (post de-bond), transportation after dicing, containers that support tape frame, criteria for the cleaning process (before as well as on mounted thin frame), and final packaging (structure for supporting wafers).

The Bonded Wafer Stacks TF reviewed preliminary drafts of the bonded wafer parameters (#5173) as well as ID and marking (#5174) specifications.

NEXT MEETING: October 25, San Jose, Calif. in conjunction with the North America Standards Fall 2011 meetings

For more information, please contact Paul Trio at ptrio@semi.org

SEMI North America HB-LED Committee

The North America HB-LED Committee welcomed David Reid (Silian) as the newest co-chair serving with Bill Quinn (Veeco), Iain Black (Philips Lumileds), and Chris Moore (Semilab).  The committee also appointed new leaders for its HB-LED Wafer Task Force: David Joyce (GT Crystal) and Julie Chao (Silian). Task force reports are as follows:

  • The HB-LED Wafer Task Force formalized its development of a Specification for 150 mm Diameter Sapphire Wafers for HB-LED Applications with the submission of a form (SNARF, #5265) that was reviewed and approved by the HB-LED technical committee at SEMICON West.  The group discussed 19 properties for the 150 mm sapphire wafer specification including: impurity content, surface conditions, diameter, fiducial type/dimensions, edge profile, bow, warp, TTV, edge profile, defects.  The first draft is expected in Fall 2011.
  • The HB-LED Equipment Automation Task Force is comprised of a Hardware Working Group and a Software Working Group.  The Hardware Working Group identified open cassette, shipping cassette, and load port as the first set of automation components to standardize with preliminary assumptions made on wafer thickness/warp, end effector and lift clearances, capacity, etc.  The Software Working Group has reviewed and identified relevant SEMI Communications Standards and identified functional requirements for software interface in HB-LED.
  • A HB-LED Standards Introduction Meeting was held in Taipei, Taiwan with leading HB-LED manufacturers. Task Force members provided information and received input on developing wafer and factory automation standards.

A survey on issues related to functional requirements for HB-LED factory automation was deployed in early October 2011.

NEXT MEETING: October 27, San Jose, Calif. in conjunction with the North America Standards Fall 2011 meetings

SEMI D62: Measurement Method of LED Light Bar for Liquid Crystal Displays

SEMI announced a new standard for liquid crystal displays, SEMI D62-0611: Measurement Method of LED Light Bar for Liquid Crystal Displays. This standard is a combined effort by AUO, ITRI, Chimei-innolux and many other Taiwan FPD supply chain companies. It is the first liquid crystal display standard for LED backlight applications. This standard will help the industry to reduce production and communication costs.  It also demonstrates Taiwan’s technological expertise which is critical for standards development.

“The display industry is huge and supply chains are very complex, therefore, international standards are key to industrial development.” said Mr. Lu (VP, AUO), “SEMI D62 was developed to solve this problem and to provide relevant test methods for LED light bar in LCD backlight units.”

This measurement standard defines measurement methods and reporting requirements for various characteristics of light emitting diode (LED) light bars for liquid crystal displays (LCDs). The standard will be helpful to unify measurement methodologies used for electro-optical and mechanical characteristics which can be used to improve the quality of integrated LED backlight units and track conformity to original design rules.

NEXT MEETING: The next Taiwan FPD Committee meeting is tentatively scheduled for November 3, 2011 at ITRI in Hsinchu.

For more information, please contact Catherine Chang (cchang@semi.org)

New FPD Standard: Test Method for Measuring the Spatial Contrast Ratio of FPD

For several decades in the FPD industry, metrics such as contrast ratio and contrast modulation have been widely used to quantify contrast performance, and sequential test patterning was one of the most popular methods to measure contrast ratio.  However, the sequential full screen test pattern does not give consistent results for the new display technologies that dynamically adjust gray levels based on image contents. In addition, they do not fully consider the real situation of display image contents.

The Korea Spatial Contrast Ratio Task Force, formed in late 2009, has been working on this issue for the past year and a half.  Now, they have successfully developed their first standard, “Test method for measuring the spatial contrast ratio of Flat Panel Display”, which was published as SEMI D64-0811 in August, 2011. The benefit of this new standard is better reliability in assessing the display device in terms of contrast ratio by using the spatial test pattern.  This shows the maximum and minimum luminance area on the same screen at the same time. Consequently, a new metrology including the test pattern which is considered the average picture level can help to evaluate the contrast ratio with the objective way to all types of display technologies.

For more information, please contact Natalie Shim (eshim@semi.org )

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October 4, 2011