"Challenges & Solutions in Development of New Package & Interconnect Technologies"
Darveaux, Ph.D. (Biography)
Corporate Technology Officer
Packaging has evolved from an enabling to a differentiating technology for many devices and end applications. As a result a detailed understanding of the system and semiconductor device requirements is required for affective development of new package technologies. With declining product life cycles and faster ramps from research to high volume manufacturing - packaging and interconnection must be developed as platform technologies.
This talk will explore some of the challenges associated with new package and interconnect development requirements and what solutions were applied to develop new packaging and interconnect technologies across a range of applications.