SEMI North America 3DS-IC Committee at SEMICON West 2011
- SNARF (Standards New
Activity Report Form) #5269
New Standard: Guide for Terminology for Measured Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures
- SNARF #5270
New Standard: Guide for Measuring Voids in Bonded Wafer Stacks
The committee also appointed Yi-Shao Lai (ASE), Curt Shannon (SigmaTech), and David Read (NIST) as the new leaders of the Inspection & Metrology Task Force. The task force also discussed creating a reference standard on test and detection protocols for metrology tools to be used for “round-robins”.
The Thin Wafer Handling Task Force continued its discussion and development of a Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers (#5175). Areas of focus for this activity will include, but are not limited to: shipping containers (post de-bond), transportation after dicing, containers that support tape frame, criteria for the cleaning process (before as well as on mounted thin frame), and final packaging (structure for supporting wafers).
The next SEMI North America 3DS-IC committee and Task Force meetings will be held on October 25 in conjunction with the North America Standards Fall 2011 meetings in San Jose, California.