Corporate Technology Officer
Robert is Corporate Technology
Officer at Amkor Technology. Robert has
24 years experience in the IC packaging field at the Microelectronics Center of
Motorola, and Amkor. Robert has a B.S. in Nuclear Engineering from Iowa State University and a Ph.D. in Materials Science and Engineering from North Carolina State
University. His areas of expertise in IC packaging include thermal and mechanical simulation, materials characterization, failure analysis, and fatigue life prediction for solder
joints. Robert has published over 75 technical papers and has 22 patents.