Executive Summary of Global SEMI Packaging Material Outlook 2015 to 2019

Global SEMI Packaging Material Outlook 2015 to 2019

A comprehensive study that examines the semiconductor packaging materials markets

Publication Date: December 2015.
Authors: SEMI and TechSearch International
Format: .pdf, .xls, .ppt (includes three files)  
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  (Executive Summary)
   
   

Global Semiconductor Packaging Materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets. Packaging materials markets are quantified; new opportunities are highlighted for advanced technology nodes and emerging package form factors; and forecasts through 2019 are presented. 

Global Semiconductor Packaging Materials Outlook is an essential business tool for anyone interested in the plastic packaging materials arena. Packaging materials directly affect the performance, reliability and cost of semiconductors, and offer significant improvement potential.

Methodology

In-person interviews with material suppliers, packaging subcontractors and semiconductor manufacturers around the world are the sources of information for this study. Market size information is developed through primary research and modeling. Five-year market forecasts are developed based on different scenarios of new technology penetration and market growth.

Features

  • Technology trends
  • Regional market size
  • Five-year market forecast
  • Supplier market share
  • Market size in revenue and units
  • Capacity and utilization trends

Table of Contents

EXECUTIVE SUMMARY 1
1 INTRODUCTION 5
1.1 Methodology 5
1.2 Assumptions 6
1.3 Report Organization 8

2 SEMICONDUCTOR PACKAGING AND INDUSTRY TRENDS 8
2.1 Semiconductor Trends - Industry Markets 10
2.2 Semiconductor Trends - Regional and Market Issues 14
2.3 Packaging Materials Needs – Customer Input 19
2.4 Packages and Electronic End-market Applications 19

3 SUBSTRATES 23
3.1 Laminate Substrates 23
3.2 Build-up Substrates 24
3.3 Organic Substrate Technology Trends 25
3.4 Organic Substrate Material Markets and Forecasts 26
3.5 Organic Substrate Pricing 27
3.6 Organic Substrate Supply 27
3.7 Flex Circuit/Tape Substrates 27

4 LEADFRAMES 29
4.1 Leadframe Market and Technology Trends 30
4.2 Leadframe Markets 32
4.3 Leadframe Market Forecasts 36
4.4 Leadframe Supply 38

5 BONDING WIRE 50
5.1 Bonding Wire Market and Technology Trends 52
5.2 Bonding Wire Markets 54
5.3 Bonding Wire Pricing 61
5.4 Bonding Wire Market Forecasts 61
5.5 Bonding Wire Supply 62

6 Mold Compounds 77
6.1 Mold Compound Technology Trends 78
6.2 Mold Compound Markets 80
6.3 Mold Compound Market Forecasts 81
6.4 Mold Compound Supply 82

7 UNDERFILL MATERIALS 85
7.1 Capillary Underfill (CUF) 85
7.2 Molded Underfill (MUF) 85
7.3 Non-conductive Paste (NCP) 85
7.4 Non-conductive Film (NCF) 86
7.5 U nderfill Technology Trends 86
7.6 U nderfill Material Market 87
7.7 U nderfill for Packages 87
7.8 Underfill 88

8 Liquid Encapsulants 91
8.1 Liquid Encapsulant Technology Trends 91
8.2 Liquid Encapsulant Markets 92
8.3 Liquid Encapsulant Market Forecasts 93
8.4 Liquid Encapsulant Supply 93

9 DIE ATTACH MATERIALS 95
9.1 Die Attach Technology Trends 95
9.2 Die Attach Markets 97
9.3 Die Attach Market Forecasts 99
9.4 Die Attach Supply 100

10 SOLDER BALLS 102
10.1 Solder Ball Material Technology Trends 102
10.2 Solder Ball Market and Forecast 102
10.3 Solder Ball Supply 102

11 WATER LEVEL PACKAGE DIELECTRICS 105
11.1 Wafer Level Package Dielectrics Technology Trends 105
11.2 Wafer Level Package Dielectrics Market and Forecast 106
11.3 Wafer Level Package Dielectrics Supply 107

12 THERMAL INTERFACE MATERIALS 109
12.1 Thermal Interface Material Selection 109
12.2 Thermal Interface Material Types 109
12.3 Thermal Interface Material Applications 109
12.4 Thermal Interface Material Development 112
12.5 Thermal Interface Material Market and Forecast 114
12.6 Thermal Interface Material Supply 114

13 SUMMARY AND CONCLUSIONS 117
13.1 Acknowledgements 118
14 APPENDICES 117

 
Deliverables:
This study has a user-friendly electronic format and includes:
  • Concise executive summary
  • Adobe Acrobat chapters for each materials segment
  • Excel workbook file summarizing market information
  • PowerPoint charts, ideal for presentations

For more information or to preorder, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers).  For further questions, please contact SEMI Global Customer Service at 1.408.943-6901 or email mktstats@semi.org.  For information on all SEMI Market research reports, visit www.semi.org/en/MarketInfo.

About SEMI
SEMI is a global industry association serving companies that develop and provide manufacturing technology, materials and services used to make semiconductors, flat panel displays (FPDs) microelectromechanical systems (MEMS) and related microelectronics. SEMI maintains offices and hosts programs and activities in every major microelectronics and display manufacturing region around the world. SEMI maintains offices in Austin, Bangalore, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo and Washington, D.C.

About TechSearch International, Inc. 
Founded in 1987, TechSearch International (Austin, Texas) is a technology licensing and consulting company specializing in accurate, relevant, and timely information on advanced packaging technology and market developments. 


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Pricing Information for 2015 edition with outlook to 2019:

 

Member          

Non-Member      
Single-user$5,000$6,000
Multi-user$10,000$12,500
Product #   Description 

3566

    Global Semiconductor Packaging Materials Outlook to 2019 - Single User

       
3567    Global Semiconductor Packaging Materials Outlook to 2019 - Multi User