ASMC 2014 - Author Kit
ASMC continues to be one of the leading international technical conferences for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing has been a combined effort by device makers, equipment and materials suppliers and academics. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies. Technical presentations at ASMC highlight industry innovations with specific results. If you are interested in presenting at ASMC 2015, please contact email@example.com
Why Become an ASMC Speaker?
- Recognition from industry peers
- Interaction with representatives from leading manufacturers, suppliers and academics
- Opportunity to share your knowledge, experiences and practical expertise
- IEEE Publication
- Considered for ASMC 2014 Best Paper award, sponsored by
The ASMC Committee is composed of industry professionals representing the microelectronics supply-chain. Abstracts are peer-reviewed by members of ASMC technical committee with the goal of developing a high quality, informative conference. All abstracts will be evaluated on the strength of the abstract submitted, including content matter and relevance to semiconductor manufacturing. If your abstract is accepted, your paper MUST be presented in person. Submission of an abstract to ASMC represents a commitment to present a non-commercial, peer-reviewed paper at the conference. ALL technical manuscripts, regardless of presentation format, will be published in the ASMC 2014 proceedings. If you cannot confirm that your paper will be presented in person, either by yourself, co-author or qualified speaker, your paper NOT published. ASMC 2014 will be held in Saratoga Springs, New York, USA. If you travel to ASMC from outside the United States, you must obtain a visa. Please begin the process early! If you require a letter of invitation for to obtain a travel visa to the U.S., please contact firstname.lastname@example.org
It is critical that you include in your timeline company approval cycles, which may be a longer process than preparation of the actual manuscript and presentation. Please note the following dates and share this information with your co-author(s) and management. Conference registration is a requirement for participation. Dates are subject to change.
Important Dates and Instructions
|Call for Papers Opens||August 22, 2013|
|Abstract Submissions Due||November 28, 2013||Abstracts submitted after the published deadline will be considered on a case-by-case basis.|
|Author Notification Sent||December 20, 2013||Primary authors/contacts will receive an instructional email. Upon notification, authors will be requested to confirm their participation in the conference.|
|Speaker Agreement Due||January 10, 2014||Speaker agreements and confirmations are due.|
|Draft Manuscripts Due||March 10, 2014|
ALL authors, regardless of session, are required to submit a preliminary/draft manuscript using
|Final Manuscript Due ||April 28, 2014|
Final, company-approved manuscript (PDF) and must be submitted electronically
|Presentations Due||May 12, 2014|
|Conference Dates||May 19-21, 2014|
Hilton Hotel/City Center, Saratoga Springs, New York. All ASMC 2014 speakers/presenters who attend the conference must register. Speaker code is ASMCSPKR
All authors are required to submit a draft/preliminary manuscript (PDF or DOC) to the ASMC collection site. Authors do NOT have to process through IEEE PDF eXpress for preliminary manuscript. This is only for final version.
Final, company-approved manuscripts, follow these steps (after receiving final input from reviewers):
Maximum number of pages is six (6) Authors will be provided feedback to ensure the highest technical quality of manuscripts. If you have misplaced your ID and password, please contact email@example.com. Authors presenting in the interactive poster session, we will supply the poster frame and push pins. The dimensions are 4ft x 4ft (1.21m x 1.21m).
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