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ASMC HOMEAGENDAREGISTERSPONSORSHIPSUBMIT YOUR ABSTRACT

Author Instructions

ASMC 2026 Call For Abstracts is now closed. ASMC 2027 Call for Abstracts will open in August 2026. Join our mailing list to get notified. 

Please review below information, including important due dates before submitting an abstract on the submission site. 

Abstracts must be original, non-commercial work that has not been and will not be published anywhere else.

All technical manuscripts, regardless of presentation format, will be published in the ASMC 2026 proceedings on IEEE Xplore. Authors who missed the call for papers could consider submitting an abstract in the 'Breaking News' category.

We strongly recommend that authors receive management approval, including travel support, in advance of abstract submission. If you cannot confirm that your paper will be presented in person, either by yourself, a co-author, or a qualified replacement speaker, your paper will not be published. 

It is critical that you include in your timeline company approval cycles, which may be a longer process than the preparation of the actual manuscript and presentation. Please note the following dates and share this information with your co-author(s) and management. Conference registration is a requirement for participation and to receive the ASMC 2025 proceedings. Dates are subject to change.

ASMC 2026 Call For Abstract Submission Site is closed

 
 

Call For Abstract Topics

  • AEPM: Advanced Equipment Processes and Materials
  • AM: Advanced Metrology
  • AP/DFM: Advanced Patterning / Design for Manufacturability / Design-Technology Co-Optimization
  • APC: Advanced Process Control
  • CFM: Contamination-Free Manufacturing
  • CIP: Cybersecurity and IP protection
  • DI: Defect Inspection and Reduction
  • DM: Big Data Management and Machine Learning
  • EO: Equipment Optimization
  • FA: Factory Automation
  • IE: Industrial Engineering
  • MS: Manufacturing for Sustainability
  • ND: Novel Devices
  • SM: Smart Manufacturing
  • WFD: Workforce Development
  • WLP: Wafer Level Packaging
  • YE/YM: Yield Enhancement/Learning and Methodologies
View Full Topic Descriptions
 

Important Due Dates and Instructions

Call for Abstract BeginsAugust 29, 2025Instructions regarding abstracts submissions are located on the ASMC 2026 Call For Abstracts Brochure. Be sure to use ASMC Abstract Template for submission. 
Abstracts DueOctober 31, 2025Submit an abstract via the ASMC 2026 Call For Abstract Submission Site before the deadline. 
Authors NotificationWeek of December 15, 2025Abstract submitter will be notified of acceptance status, next steps and important deadlines. All accepted speakers must complete the Speaker Letter of Agreement form and email to Taylor Zhao at [email protected] by the deadline.
Registration OpenFebruary 11, 2026Conference registration is required. Speakers will receive a discounted registration rate. Speakers are responsible for their own travel and accommodation expenses. 
Draft Manuscript and Presentation Due February 20, 2025

Authors to submit draft version of their manuscript and presentation Powerpoint slides via the ASMC submission site for ASMC Committee's review. 

  • Authors must use the IEEE Manuscript Template when preparing their submission. This manuscript should represent the near-final version, containing at least 90-100% of the intended content. Maximum number of pages is six (6); minimum four (4) pages.
  • Authors should use ASMC PPT Template for their presentation slides.  
Final Manuscript DueApril 24, 2026

Final, IEEE Xplore compatible PDF must be submitted electronically to the ASMC submission site in order to be published in the ASMC 2026 proceedings. 

Please follow below steps to complete the final manuscript submission: 

  1. Proofread your manuscript thoroughly to confirm that it will require no revision.
  2. Convert your manuscript to PDF
  3. Visit the IEEE PDF eXpress site.
  4. Sign up or login to your PDF eXpress account. (Conference ID 69324X)
  5. Follow the prompt to upload your PDF manuscript to be checked for IEEE Xplore compatibility.
  6. If the manuscript is not approved, please make the necessary revisions until it meets the IEEE PDF eXpress requirements.
  7. Upload your approved, IEEE Xplore compatible PDF to the ASMC submission site. DO NOT PASSWORD PROTECT PDF.
Final Presentation DueApril 24, 2026

Oral Presenters
Oral presenters must submit their final, company-approved presentation in PowerPoint and PDF format by the deadline. ASMC PPT Template should be used. Presentation slides are pre-loaded to the presentation computer prior to the start of the session. The PDF presentation will be shared with registered attendees. Be sure to remove any information or slides you do not wish to share. Oral presentations are allotted a total of 20 minutes (16 minutes for presentation + 4 minutes for Q&A). 

Upload presentation files in the My Presentation section of the ASMC submission site. 

Poster Presenters
Poster Presenters are responsible for printing and setting up their poster at the conference. If you would like to share a PDF version of your poster with the attendees, please upload to the My Presentation section of the ASMC submission site. 

For poster presentations, we recommend that authors use the ASMC poster template rather than multiple pages, as it looks more professional. The available size of the Posterboard / Frame is 8'w x 4'h (2.4m x 1.2m). Your poster should be a minimum ANSI E 44w" x 34"h (or ISO A0, 1.189m x 0.84m) or larger, to fit within the frame. Keep in mind that a good poster has lots of figures, graphs, and a minimum amount of text in a large font. Please see Poster Session Presenter Instruction for more details. 

Conference DatesMay 11-14, 2026

ASMC 2026 is taking place at Albany Hilton, Albany, New York. Click to view Conference Agenda. Information regarding your specific presentation will be posted once your final manuscript is approved. 

All ASMC 2026 speakers/presenters must register for the conference. 

NOTE: 
Only those presenting at the conference should register as speakers. Co-authors, admins and colleagues etc. should register as regular conference attendees. 

Speakers who are current students can register as Student instead of Speaker. 

Contact Taylor Zhao at [email protected] if you have any questions. 

Best Paper Award

Congratulations to the 2024 Best Paper Award Winners! 

Best Paper Award Winner (Sponsored by Entegris)
Optimization of Area Selective Barrier on Different Metal Interconnects 
Linda Wangoh, Andrew Simon, Matthew Shoudy, IBM Research

 

Best Student Paper Award Winner

Dynamic Time Warping Constraints for Semiconductor Processing 

Rachel Owens, Fan-Keng Sun, Duane Boning, Massachusetts Institute of Technology; Christopher Venditti, Daniel Blake, Jack Dillon, Analog Devices

 

(2025 Best Paper Award and Best Student Paper Award Winners will be announced in April 2026)