|ASMC Home||AGENDA||REGISTER||TRAVEL||SPONSORSHIP||AUTHOR KIT|
ASMC continues to be one of the leading international technical conferences for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing has been a combined effort by device makers, equipment and materials suppliers and academics. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies. Technical presentations at ASMC highlight industry innovations with specific results.
The ASMC 2017 Call for Papers will open in July. Authors who are unable to provide an abstract by the final due date may consider the 'Breaking News' option. If you have questions, please contact firstname.lastname@example.org.
Why Become an ASMC Speaker?
- Recognition from industry peers
- Interaction with representatives from leading manufacturers, suppliers and academics
- Opportunity to share your knowledge, experiences and practical expertise
- IEEE Publication
- Consideration for ASMC 2017 Best Paper award*
ASMC 2015 Best Paper Award, sponsored by Entegris
"Big Data Emergence in Semiconductor Manufacturing Advanced Process Control"
James Moyne, Jamini Samantaray, Mike Armacost, Applied Materials
ASMC 2015 Best Student Paper Award, sponsored by GLOBALFOUNDRIES
"Inspection Step Modeling for Defect Source Tool Identification Using Defectivity Control"
Mohamad Chakaroun, Rabah Messouci, Mohand Djeziri, Mustapha Ouladsine, Aix Marseille Universite, CNRS, ENSAM, Universite de Toulon; Jacques Pinaton, Process Control System, STMicroelectronics
The ASMC Committee is composed of industry professionals representing the microelectronics supply-chain. Abstracts are peer-reviewed by members of ASMC technical committee with the goal of developing a high quality, informative conference. All abstracts will be evaluated on the strength of the abstract submitted, including content matter and relevance to semiconductor manufacturing. If your abstract is accepted, your paper MUST be presented in person. Submission of an abstract to ASMC represents a commitment to present a non-commercial, peer-reviewed paper at the conference. ALL technical manuscripts, regardless of presentation format, will be published in the ASMC 2016 proceedings. We strongly recommend that authors receive management approval, including travel support, in advance of abstract submission. If you cannot confirm that your paper will be presented in person, either by yourself, co-author or qualified speaker, your paper will not be published. ASMC 2017 will be held in Saratoga Springs, New York, USA. If you travel to ASMC from outside the United States, you may require a visa. Please begin the process early! If you require a letter of invitation for to obtain a travel visa to the U.S., please contact email@example.com
It is critical that you include in your timeline company approval cycles, which may be a longer process than preparation of the actual manuscript and presentation. Please note the following dates and share this information with your co-author(s) and management. Conference registration is a requirement for participation. Dates are subject to change.
Important Due Dates and Instructions
|Call for Papers Opens||12 July 2016||Authors must use the abstract template and uploaded to the ASMC collection site. Please indicate if the abstract is to be considered for a poster presentation or the ASMC student best paper competition.|
|Abstracts Due||17 October 2016||Abstracts submitted after the published deadline will be considered on a case-by-case basis. Abstracts should be uploaded to the ASMC 2017 Collection Site|
|Author Notification Sent||15 December 2016||Primary authors/contacts will receive an instructional email. Upon notification, authors will be requested to confirm their participation in the conference.|
|Speaker Agreement||3 January 2017||Speaker agreement and confirmation are due. Authors should have management, financial/travel support and any necessary IP approval. Send to firstname.lastname@example.org.|
|Manuscript||27 February 2017 ||ALL authors, regardless of session, are required to submit a manuscript using the approved MANUSCRIPT TEMPLATE. This is the same template used for the extended abstract. Accepted formats to submit are: doc, .docx, pdf. The manuscript must be uploaded to the ASMC collection site. Special PDF generation and checking capability will be provided for submission after the committee reviews and approves your manuscript. Only changes requested by reviewers should be made after this submission date. *Additional instructions below.|
|Reviewer Feedback||14 March 2017||Feedback from committee reviewers, with requested edits/changes for author(s) to be included in updated manuscript.|
|Final Manuscript||12 April 2017||Final, company-approved manuscript (PDF) and must be submitted electronically to the ASMC collection site in order to be published in the ASMC 2017 proceedings. IEEE PDF eXpress opens March 1: http://www.pdf-express.org. Conference ID will be provided at that time.|
|Presentations Due||8 May 2017|
|Conference Dates||15-18 May 2017||Hilton Hotel/City Center, Saratoga Springs, New York. All ASMC 2017 speakers/presenters who attend the conference must register. A reduced speaker registration rate is available. Contact email@example.com for information.|
All authors are required to submit a preliminary manuscript (PDF or DOC) to the ASMC collection site. This manuscript should reflect the complete/final manuscript, e.g. contain at least 90%-100% of content. Authors do NOT have to process through IEEE PDF eXpress for initial manuscript. This requirement is for final version only.
Final, company-approved manuscripts, follow these steps (after receiving final input from reviewers):
Maximum number of pages is six (6) Authors will be provided feedback to ensure the highest technical quality of manuscripts. If you have misplaced your ID and password, please contact firstname.lastname@example.org.