IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Will Be Held in New York for First Time

This Year’s Conference Features a Tour of GLOBALFOUNDRIES Fab 8, plus Tutorials on 3D-IC and EUV Lithography

SAN JOSE, Calif. – March 15, 2011 – The 22nd Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2011) will be held May 16-18 in Saratoga Springs, New York. The conference will feature presentations of more than 65 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a tour of GLOBALFOUNDRIES and tutorials on 3D-IC and EUV lithography.

For over 20 years, ASMC has provided a premier venue for industry professionals to learn and share knowledge on new and “best practice” semiconductor manufacturing issues and concepts, accelerating innovation and moving the industry forward. ASMC is a leading conference that enables collaboration and sharing of technical breakthroughs that provide a valuable source of cost-effective, hands-on solutions to address real-world manufacturing challenges. This year’s conference features keynotes delivered by industry leaders, including:

  • Norm Armour, vice president and general manager, Fab 8, GLOBALFOUNDRIES
  • Gary Patton, Ph.D., vice president, Semiconductor Research & Development Center, IBM Systems and Technology Group
  • Peter Wright, director of research, Tradition Equities

This year, ASMC offers an ISMI co-located session panel on “Models for Successful Partnerships in Semiconductor Manufacturing” with panelists from academia, government, and industry. ASMC 2011 sessions include:

  • Factory Optimization: Semiconductor equipment and manufacturing are increasingly complex with strict economic constraints. The sessions discuss novel solutions to improve equipment/factory productivity and performance.
  • Advanced Metrology: Advanced semiconductor manufacturing demands advanced metrology techniques. This session details new technologies and improvements.
  • Equipment, Materials & Processes: Advanced memory and logic manufacturers face daunting challenges as the next generation device nodes come on line. Innovations in equipment, materials, and processes are helping meet those challenges. The session focuses on advanced application requirements.
  • Process Development and Control: The demand for high quality and product yields is a constant driver for advanced process development and control techniques. Session covers improvements in processes, tool controls and predictive process performance analysis.
  • Advanced Lithography: Lithography experts representing customers and suppliers from across the industry focus on challenges and advancements in immersion and double-patterning lithography, as well as process and productivity optimization for manufacturing.
  • Defect Inspection and Yield Optimization: Defect inspection, yield analysis and optimization are integral components in the development and manufacture of semiconductor devices. The first session explores methods to improve SEM review defect redetection and reduce self-aligned double patterning defects, while the second session presents unique yield learning and monitoring techniques.
  • Data Management: The session explores tools and techniques for compiling and analyzing complex and diverse data to optimize yield and production planning.

ASMC also holds an interactive poster session and reception, which provides an ideal opportunity for networking between authors and conference attendees. During this session, participants can engage authors in in-depth discussion of a wide range of issues impacting semiconductor manufacturing, including defect detection, continuous flow, lean manufacturing and virtual metrology. Conference participants can expect to develop insights and relationships which accelerate innovation, promote successes, and provide a more thorough understanding of standards and benchmarks.

ASMC 2011 is presented by SEMI and the Institute of Electrical & Electronics Engineers (IEEE). The conference is co-sponsored by: IEEE Electron Devices Society (EDS), and IEEE Components, Packaging and Manufacturing Technology Society (CPMT). Corporate sponsors include: Applied Materials, KLA-Tencor, Matheson, Nikon, NY Loves Nanotech, Saratoga Convention & Tourism Bureau, and Saratoga Economic Development Corporation, with support from ISMI.

Registration for ASMC 2011 is available at www.semi.org/ASMC.  For more information, please visit the website or contact Margaret Kindling at mkindling@semi.org or phone 1.202.289.0440. Qualified members of the media should contact Deborah Geiger (SEMI Public Relations) at dgeiger@semi.org for media registration information.

About SEMI

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.

Association Contact

Deborah Geiger/SEMI
Tel: 1.408.943.7988
Email: dgeiger@semi.org