Roadblocks for Critical New Microelectronics Manufacturing Technologies Confronted at SEMICON West 2011
SAN JOSE, Calif. — June 22, 2011 —The convergence of critical new microelectronics manufacturing technologies, including vertical transistors (FinFETs), 3D-IC, 450mm, and EUV, hold the promise of driving continued cost reduction and performance needs beyond the 20nm node— but getting there remains rife with technical and business challenges and potential roadblocks. How the global microelectronics supply chain works together to address these challenges will probably determine the industry's profitability and growth over the coming decade. At SEMICON West 2011 on July 12-14 in San Francisco next month, two executive-level panels will address the questions surrounding the development and adoption of critical new technologies, and the business challenges of moving these technologies from the lab to the fab.
The SEMICON West Executive Summit on July 13 will gather four of the industry's leading executives in a discussion on the critical trends and issues facing the equipment and materials industry over the next 10 years, including market drivers, political and economic megatrend implications, and public policy. Panelists include Dave Miller, president, DuPont Electronics and Communications; Doug Neugold, chairman, chief executive officer, and president, ATMI; Stephen G. Newberry, chief executive officer and vice chairman, Lam Research; and Richard Wallace, president and chief executive officer, KLA-Tencor. The Executive Summit takes place on Wednesday, July 13 from 1:30-3:00pm at Moscone Center, Keynote Stage in Esplanade Hall.
The industry appears poised to go beyond talking and begin serious planning for 450mm wafers. On July 14 at SEMICON West, the 450mm Transition Forum will feature a review of the R&D initiatives that may lead to fuller implementation of 450mm wafer processing and provide a status of the prevailing challenges for device makers and their suppliers. Panelists include David Bennett, vice president of Alliances, GLOBALFOUNDRIES; Bob Johnson, research vice president, Gartner; Hans Lebon, vice president, Fab and Process Step R&D&M Technology, IMEC; Brian Trafas, chief marketing officer, KLA-Tencor; and David Hemker, vice president, New Product Development, Lam Research. The 450mm Transition Forum takes place on Thursday, July 14 from 10:30am-12:30pm at Moscone Center in North Hall at the NorthOne TechXPOT.
Both panel sessions, like all presentations on the Keynote Stage and the four TechXPOT technical stages on the SEMICON West show floor, are open to all registered attendees. For more information on these and other events, and to register, visit www.semiconwest.org.
SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bengaluru, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
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