ATE Vision 2020 Conference Addresses Mid- and Long-term Critical Technology Issues in Semiconductor Test

Call for Papers Welcomes Test Insights on New Technologies and Advanced Test Solutions for Coming Decade

San Jose, California – May 5, 2011 – SEMI has announced that the ATE Test Technology Technical Council (TTTC) of the IEEE Computer Society will hold its ATE Vision 2020 Conference on July 14, 2011 during the annual SEMICON West exposition in San Francisco, California. ATE Vision 2020 occupies a unique role in the semiconductor test industry as the only dedicated forum to discuss technology gaps needing advancement by test instrumentation, automated test equipment (ATE) developers, test equipment users, and other key contributors to the test industry. Winner of the Most Successful Event Award of the IEEE/TTTC for two years, the 2011 conference will focus on emerging issues in semiconductor test including, but not limited to, SoC, 3DIC, 450 mm wafers, and new functionality in RF, mixed signal and other applications. 

Through technical papers, panels and interactive discussions, the one-day event will examine the direction and requirements of the ATE and test industry as integrated circuits continue to get denser, faster, and highly heterogeneous. Technical papers are being solicited for consideration in the areas of multiple cores on a die, 3D trends enabled by die-stacking and thru-silicon-vias (TSVs), adaptive test, BIST, and other areas. The conference’s objective will be to explore technology needs as they relate to the cost-of-test, time-to-market, and time-to-yield needs of the industry.

 “Test is playing an increasingly critical role in next generation semiconductors, both as an enabling technology and as a potential gating factor,” said Erik Volkerink, chief technologist of Verigy, and founder and general chair of ATE Vision. “Identifying test technology gaps and needs in critical areas such as 3D chip stacking and 450 mm wafers are essential today to enable tomorrow’s advanced chips.  This year’s program will be designed to compliment SEMICON West’s TechXPOT test sessions with more technical presentations and more interactive sessions with key industry stakeholders.” 

The Call for Papers is open until May 15, 2011.  More information, including the Call for Papers, registration and corporate sponsorship information, is available at:

About SEMI

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bengaluru, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit

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