Manufacturing Innovations in HB-LEDs, MEMS, Printed Electronics Featured at SEMICON West 2011

Manufacturing Innovations in HB-LEDs, MEMS, Printed Electronics Featured at SEMICON West 2011

“Extreme Electronics” Spotlights Emerging Mega Markets for Large-Scale Nano- and Microelectronics Manufacturing

SAN FRANCISCO, Calif. — May 5, 2011 — Advanced nano- and microelectronics manufacturing technology are continuing to enable extreme cost reductions, performance increases and quality improvements in high-growth HB-LEDs, MEMS, next generation power solutions and printed electronics markets.   Many of these recent developments— and future challenges in manufacturing efficiency and effectiveness— will be featured in Extreme Electronics, the dedicated “show within a show” at SEMICON West, North America’s premier nano- and microelectronics manufacturing exposition, held July 12-14 at the Moscone Center in San Francisco, Calif.  Over 20 free technical sessions at the show-floor Extreme Electronics TechXPOT stage and hundreds of exhibitors with manufacturing solutions applicable to many emerging markets will be featured at this year’s event.

SEMI members and SEMICON exhibitors are responsible for the innovations and technologies that enable smarter, faster, more powerful, and more affordable electronic products and devices that bring the power of the digital age to more people every day.  Technological advances go beyond just semiconductors.  The science used to make microchips is also enabling advances in solid-state lighting, flexible displays and PV, micro-machines, thin film sensors, new power ICs, and many other emerging technologies.  Extreme Electronics is a dedicated exhibition area and presentation forum for technical presentations on the key challenges, trends and break-through solutions addressing these high-growth markets.   

Extreme Electronics Sessions at SEMICON West 2011

Solid State Lighting and HB-LED

  • More Lumens per Dollar: Issues and Answers to Bring Costs Down to Create the General Lighting Market; Wednesday, July 13, 10:30am–4:30pm.  Speakers expected from Cree, Philips Lumileds, Veeco, Dow Electronic Materials, UCSB, Fraunhofer IZM, Redwood Systems, Intematix, NNCrystal, Cascade Microsystems, KLA-Tencor and more.

MEMS

  • The Future of MEMS: Solutions for Moving from a Niche to a Mainstream Business; Tuesday, July 12, 10:30am–12:30pm. Speakers from GlobalFoundries, Teledyne Dalsa, Bosch, IMEC, Sand 9 and Yole Développement.

Power ICs

  • Energy: Opportunities in Smart Power Management for Alternative Energy Applications; Tuesday, July 12, 2:00–4:30pm.  Speakers from Freescale, Yole Développement, Oakridge National Labs, International Rectifier, SemiSouth, and IBM.

Printed/Flexible Electronics

  • Printed/Flexible Electronics: Beyond R&D to Real Deal Technologies; Thursday, July 14, 10:30am–1:30pm. Speakers from FlexTech Alliance, Novacentrix, Xenon and more.

For more information, visit the SEMICON West website at www.semiconwest.org.  

Premier sponsors for SEMICON West 2011 are: Applied Materials, KLA-Tencor and Verigy.

Visitor registration is free through May 8; onsite registration will be $150. To register or for more information, please visit www.semiconwest.org.

About SEMI

SEMI is the global industry association serving the manufacturing supply chains for the nano and microelectronics manufacturing supply chain.  SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.

Association Contact

Deborah Geiger/SEMI
Email: dgeiger@semi.org
Phone: 408.943.7988

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