SEMI provides this archive of news and information from industry news sources as a resource. Due to the nature of dated material on the internet, SEMI does not guarantee that links are maintained by the news provider.

December 2010

Will Taiwan DRAM makers survive in '11?
(EE Times, Dec 31)

IP trolling firms make more waves
(EE Times, Dec 31)

ActaCell wins $3M from NIST for nanocomposite Li-ion battery material
(Solid State Technology, Dec 30)

Outsourcing of IC backend services growing
(Digitimes, Dec 30)

Top 10 Countdown: Most-Read EMS Columns of 2010
(PCB007, Dec 29)

Hopes for New PV and Solar Technology in 2011
(Greentech Media, Dec 29)

How fabless companies drive tech
(Solid State Technology, Dec 29)

Semiconductor Predictions for 2011
(Semiconductor Packaging News, Dec 29)

13 Fabless IC Suppliers Forecast to Top $1.0 Billion in Sales in 2010!
(EMS Now, Dec 22)

UMC invests in smart grid firm
(EE Times Europe, Dec 22)

Quantum dots are not dots: physicists
(PhysOrg.com, Dec 21)

TSMC to raise R&D spend in 2011, says report
(EE Times, Dec 21)

GlobalFoundries looks at MEMS
(EE Times, Dec 20)

Chip manufacturers gear up for 'fab-tight'
(EE Times India, Dec 20)

New fab could be compatible with 18-inch production tools, says TSMC
(Digitimes, Dec 20)

First-Time Solar Producers May Imperil Indian Project
(Businessweek, Dec 20)

Equipment bookings, billings up significantly year over year, SEMI reports
(Electronics Design Stategy News, Dec 17)

NIST to Spend $22M on Innovative Manufacturing Projects
(Printed Circuit Design & Fab, Dec 17)

6 Myths of Semiconductor Manufacturing
(Semiconductor Packaging News, Dec 17)

iSuppli: Semiconductor rankings revealed for 2010
(Fabtech, Dec 17)

AUO Gets Taiwan Approval to Build LCD Plant in China
(Businessweek, Dec 17)

North America fab tool book-to-bill slips to 0.96 in November 2010, says SEMI
(Digitimes, Dec 17)

Penn predicts 6 percent chip market growth in 2011
(EE Times Europe, Dec 16)

Chip equipment spending to slip 1% in 2011, says Gartner
(Digitimes, Dec 16)

TSMC might consider 18-inch fab rather than another 12-inch
(Digitimes, Dec 16)

AIXTRON G5 multiple order from HUGA Optotech
(LEDInside, Dec 16)

Applied Materials, 최초 PV 장비 분야에서 10억 달러 매출 달성
(EDNKorea.com, Dec 15)

Flat year looms for semi equipment manufacturers
(Electronics Weekly, Dec 15)

TSMC Poised to Build One More Mega Fab
(Semiconductor Packaging News, Dec 13)

Transforming the U.S. semiconductor business model
(EE Times, Dec 13)

Top 5 Greentech Media Articles of 2010: Bloom Energy, 50 VC Startups, and More
(Greentech Media, Dec 13)

Quantum-dot LED screens may soon rival OLEDs and LCDs
(PhysOrg.com, Dec 13)

What’s the cost for 3-D chips?
(EE Times, Dec 09)

South Korea's LG Display may appeal EU fine over LCD cartel
(TMCnet.com, Dec 09)

Intel loses 2010 chip market share while Samsung gains, says Gartner
(Digitimes, Dec 09)

SEMI Int’l Standards Program Forms 3D Stacked IC Standards Committee; Call for Task Force Volunteers
(Circuitree, Dec 08)

Semiconductor Investments in Korea
(Semiconductor Packaging News, Dec 08)

SEMI's updated forecast: 2010 stronger, 2011 weaker, 2012 mixed
(Solid State Technology, Dec 07)

"Quantum Dot Displays Start to Shine"
(Nanotechnology Now, Dec 07)

Cree’s CEO suggests quicker LED move into general lighting
(LEDs Magazine, Dec 07)

TSMC to expand wafer capacity
(Semiconductor Packaging News, Dec 07)

Why a Moore's Law for green tech doesn't compute
(CNET News.com, Dec 07)

Taiwan Tops World's Competitors in Semi Equipment Expenditure
(Semiconductor Packaging News, Dec 06)

Advantest makes bid to buy Verigy
(EE Times, Dec 06)

Survey: Chip execs optimistic about 2011
(Electro IQ, Dec 06)

Global Semicon Sales in October Flat On-Month
(PCB007, Dec 06)

The Top Fifteen Module Producers in 2013
(Greentech Media, Dec 06)

Toshiba forms IC venture in Brazil
(EE Times Europe, Dec 06)

Turning science into successful high-tech products
(LEDInside, Dec 06)

Oct. chip sales grow 20 percent year-over-year
(Forbes.com, Dec 03)

The Growing Legacy Of Moore's Law
(Semiconductor Packaging News, Dec 03)

IP revenue to decline beyond 2014, says Gartner
(EE Times, Dec 02)

IBM Unveils New Chip; Heats Up Supercomputer Battle
(International Business Times, Dec 02)

Rudolph Technologies Collaborates with Asia OSAT
(Semiconductor Packaging News, Dec 02)

Industry Leaders are Seeing Growth for PE
(Printed Electronics Now, Dec 01)

IBM's breakthrough chip technology lights the path to exascale computing
(PhysOrg.com, Dec 01)

IBM debuts CMOS silicon nanophotonics
(EE Times Europe, Dec 01)

The 450-mm development dilemma
(Semiconductor Packaging News, Dec 01)

Moore’s Law: The Challenge And The Solution For Test
(Electronic Design, Nov 30)

Abu Dhabi: High-tech mecca or mirage?
(EDN, Nov 30)

Chip-Equipment 2011 Sales to Rise More Than Expected, Group Says
(Business Week, Nov 30)

Applied Materials, Samsung Settle Espionage Dispute
(Business Week, Nov 30)

Who's spending on solar? Mostly China
(Pennenergy, Nov 29)

"STMicroelectronics ships one billionth MEMS device"
(Nanotechnology Now, Nov 29)

TSMC's Chang Makes Bold Pledge on Sales
(Semiconductor Packaging News, Nov 29)

Printed Electronics USA: German Scientists Break Record, Draw High-Tech Investments
(Sys-con, Nov 29)

Chip-maker to hire 123 in Manassas
(TMCnet.com, Nov 24)

Auto MEMS sensor market to reach record high in 2010, says iSuppli
(Digitimes, Nov 24)

Enhanced efficiency when determining band gap in solids
(PhysOrg.com, Nov 23)

Scientists imitate nature to engineer nanofilms
(PhysOrg.com, Nov 22)

Evaluating polymer wear and particulation for semiconductors and data storage
(Electro IQ, Nov 22)

European Semiconductor Leading Indicator Up in September
(Circuitree, Nov 22)

Semi champion George Scalise is retiring, but hardly going quietly
(Semiconductor Packaging News, Nov 22)

Japan chip gear book-to-bill continues to slide on-month
(Digitimes, Nov 22)

Keeping Greentech Manufacturing in California
(Greentech Media, Nov 19)

New nanopillar light-collector geometry rivals commercial thin film PV
(Solid State Technology, Nov 19)

SMC 2011 to Highlight Innovations and Market Trends in the Semiconductor Materials Sector
(TMCnet.com, Nov 19)

Five predictions from Applied CEO
(Semiconductor Packaging News, Nov 19)

ISS 2011 to Focus on Economic Trends and New Cyclical Forces
(Semiconductor Packaging News, Nov 19)

Research: Chinese companies dominate solar manufacturing spending
(PV Magazine, Nov 19)

SEMI book-to-bill ratio drops below parity in October 2010
(Digitimes, Nov 19)

SEMI forms high-brightness LED standards committee
(LEDs Magazine, Nov 18)

New computer chip technology could fill production gap
(Nano Werk, Nov 18)

First High Volume Via Process for Packaging and Integration of MEMS / CMOS
(Display +, Nov 18)

Chinese semiconductor industry accounts for 41% of global consumption
(New Electronics, Nov 18)

ISS 2011 to Focus on Economic Trends and New Cyclical Forces in the Semiconductor Industry
(TMCnet.com, Nov 18)

Five predictions from Applied CEO
(EE Times, Nov 17)

SEMI forms LED standards group
(EE Times, Nov 17)

Deep submicron changes 3D packaging performance, lifecycle, reliability, test, power, and more, warns Bill Bottoms
(Electro IQ, Nov 17)

Intel Capital invests $77M in start-ups
(EDN, Nov 17)

Semi industry good at managing down-cycle; 'appalling' at managing up-cycle.
(Semiconductor Packaging News, Nov 17)

LED substrates and singulation discussion with Jan Vardaman
(Solid State Technology, Nov 16)

ST on track for 20nm in 2013, says CTO
(Electronics Weekly, Nov 16)

TSMC obtains termination of ITC investigation into 37nm and smaller products
(Digitimes, Nov 16)

Survey Ranks China's Supercomputer as the Fastest in the World
(TMCnet.com, Nov 15)

Minimize silicon trench etch process variations with optimized cylinder materials for hydrogen bromide delivery
(Electro IQ, Nov 15)

TSMC launches IC engineering award
(EE Times, Nov 15)

Taiwan to pass Japan as largest source of IC wafer fab capacity, says IC Insights
(Digitimes, Nov 15)

Semiconductor Research Corporation and Advanced Technology Investment Company Chart Course for...
(Forbes.com, Nov 11)

Electronics: A diverse printed future
(Semiconductor Packaging News, Nov 11)

Vanderbilt Study Shows No Increased Cancer Risk for Semiconductor Industry Cleanroom Workers
(Forbes.com, Nov 10)

A greener way to grow carbon nanotubes
(Nano Werk, Nov 10)

TSMC approves budget over US$2.68 billion for capacity expansion, R&D
(Digitimes, Nov 10)

Foundries, memory firms shine in IC ranking
(EE Times, Nov 09)

QD Vision and Solvay Enter Agreement to Develop a Printable Electroluminescent Platform for...
(Forbes.com, Nov 09)

SIA ups outlook, cracking $300B in 2010
(Electro IQ, Nov 09)

TSMC funds fabs, tips EU solar unit
(EE Times, Nov 09)

Semiconductor industry ‘back to normal’
(New Electronics, Nov 09)

PV Manufacturing: What Can High-cost Suppliers Do To Survive?
(Greentech Media, Nov 09)

Rare earth element embargo will increase prices of high-tech products, says Information Network
(Digitimes, Nov 09)

Osram presents PirOLED, the first OLED luminaire
(LEDs Magazine, Nov 08)

ON Semi invests $15.7M in equipment for Idaho fab
(Semiconductor Packaging News, Nov 08)

SIA alters IC forecast
(Semiconductor Packaging News, Nov 08)

SMIC to concentrate resources on R&D, says chairman
(Digitimes, Nov 08)

Sewer or Sea? Where Will Water Come From?
(Greentech Media, Nov 05)

SIA forecasts almost 33% chip sales growth in 2010, but slower growth ahead
(Digitimes, Nov 05)

SIA Forecast 2010 - 2012
(News Blaze, Nov 04)

SATS business not sitting still
(EE Times, Nov 04)

In Albany, a boom based on microchips
(EE Times, Nov 04)

SMIC set to return to revenue growth trend, says Digitimes Research
(Digitimes, Nov 04)

Essential principles for practical analog BIST
(EDN, Nov 04)

International SEMATECH Manufacturing Initiative Expands Portfolio with Launch of New Mature Fabs Program
(Nano Werk, Nov 03)

Texas Instruments is harking back to its glory days in deciding to take the analogue market by the scruff of its neck, writes David Manners.
(TMCnet.com, Nov 03)

Capitalizing on Europe's Strengths is Focus of Upcoming ISS Europe Symposium
(EMS Now, Nov 03)

450 mm Wafer Transition
(Semiconductor Packaging News, Nov 03)

Chipmakers, Intel, Toshiba and Samsung will form a consortium that aims to reduce chip size by half, according to Reuters.
(TMCnet.com, Nov 03)

Semi's Continue to Show Growth
(Semiconductor Packaging News, Nov 02)

TSMC not afraid of possible Intel threat
(Semiconductor Packaging News, Nov 02)

Teradyne grants SEMI license to standardize IC test data
(EE Times, Nov 02)

Intel Makes Cloud-Based Internet Computing More Interoperable and Secure
(TMCnet.com, Nov 01)

New US solar research facility awarded USD$6 million
(PV Magazine, Nov 01)

Analyst: September chip sales rise
(EE Times, Nov 01)

Intel Makes Cloud-Based Internet Computing More Interoperable and Secure
(TMCnet.com, Nov 01)

New US solar research facility awarded USD$6 million
(PV Magazine, Nov 01)

Analyst: September chip sales rise
(EE Times, Nov 01)

Intel agrees to make chips for a startup firm: report
(International Business Times, Nov 01)

Carl Zeiss and Synopsys collaborate
(Evertiq, Oct 29)

Intel's biggest chip plant opens in Vietnam
(Forbes.com, Oct 29)

TU/e changing the photonic chip paradigm
(Solid State Technology, Oct 28)

Mandates to boost auto MEMS sensor market in Korea and Japan, says iSuppli
(Digitimes, Oct 28)

Intel to spend $1.5 billion on litho
(EE Times Europe, Oct 28)

TSMC’s Chang Says World Chip Market to Grow 5 Percent in 2011
(Business Week, Oct 28)

UMC more upbeat on 2010 chip market growth
(Digitimes, Oct 28)

Packaging and testing sector to see 7-13% growth in 2011, says SPIL chairman
(Digitimes, Oct 28)

MEMS celebrate 25 years: Industry experts share insights
(Solid State Technology, Oct 27)

LED industry, LED manufacturing tech report due out from Yole, EPIC
(Solid State Technology, Oct 27)

IBM, Euro researchers seek CMOS successor
(EE Times, Oct 27)

SEMI Europe Standards Awards Honor Paul Williams and Roland Bindemann
(EMS Now, Oct 27)

Intel's plant in Dalian starts production
(Semiconductor Packaging News, Oct 27)

New Korean VC fund supports plastic electronics
(+Plastic Electronics, Oct 27)

Intel Opens First Chip Manufacturing Plant in China
(PC World, Oct 26)

Water could hold answer to graphene nanoelectronics
(Nano Werk, Oct 26)

Flexible LED arrays target biomedical applications
(LEDs Magazine, Oct 26)

Qimonda settles with U.S. subsidiaries
(EE Times, Oct 26)

TI has robust Q3; expects softer Q4
(Electronics Weekly, Oct 26)

Veeco lands multi-tool order for MOCVD systems from Epistar
(Digitimes, Oct 26)

Chip equipment bubble bursts, says Information Network
(Digitimes, Oct 26)

International Solid State Lighting Alliance (ISA) founded in China
(LEDs Magazine, Oct 25)

Semiconductor Industry Set for Soft Landing in 2011
(EMS Now, Oct 25)

Funding secured for alternative lighting technology
(+Plastic Electronics, Oct 22)

NA Semiconductor Equipment Orders Up 113 Percent Year-to-Year
(Circuitree, Oct 22)

Lithography efficiency: a cost comparison model
(Fabtech, Oct 21)

Japan September 2010 fab tool book-to-bill slips to 1.14
(Semiconductor Packaging News, Oct 21)

EUV to get ready for high-volume production in 2014
(Semiconductor Packaging News, Oct 21)

Varian Looks to Enforce Moore's Law in Solar
(Semiconductor Packaging News, Oct 21)

Imec R&D launch in Taiwan includes MEMS focus
(Electro IQ, Oct 20)

Intel to Invest Billions in Next-Gen Manufacturing in U.S.
(PCB007, Oct 20)

TSMC and UMC say no plans to raise prices despite currency fluctuations
(Digitimes, Oct 20)

Chip packagers expect currency volatility to erode 4Q10 revenues by 1-3%
(Digitimes, Oct 20)

Varian Looks to Enforce Moore’s Law in Solar
(Greentech Media, Oct 20)

Axcelis Lands Multiple System Order From Major Chip Manufacturer for Integra(TM) Plasma Dry Strip Systems
(News Blaze, Oct 19)

Betting big on printed electronics
(Semiconductor Packaging News, Oct 19)

The United States has first OLED pilot manufacturing site
(LEDInside, Oct 19)

TSMC Budgets $1 Bln for 2011 R&D Expense
(Semiconductor Packaging News, Oct 18)

EV Group's GEMINI(R) Wafer Bonder Selected by MEMS Pioneer Sensonor for High-Volume Production...
(Forbes.com, Oct 18)

Atrenta opens R&D center in Grenoble
(EE Times, Oct 18)

Fraunhofer releasing OLED lighting panels in 2011
(+Plastic Electronics, Oct 18)

TI buys 200mm Chinese fab
(New Electronics, Oct 18)

Flexible, implantable LEDs could revolutionize drug and laser therapy
(TMCnet.com, Oct 18)

EU project to accelerate uptake of quality, affordable solid-state lighting
(LEDs Magazine, Oct 15)

Groundbreaking Ceremony Marks Start of Technology Complex
(TMCnet.com, Oct 15)

Consumer electronics IC suppliers face cost challenges, says iSuppli
(Digitimes, Oct 15)

TI announces first wafer plant in China
(Digitimes, Oct 15)

Texas Instruments Buys Its First Chip Factory in China
(PC World, Oct 15)

Organic Semiconductors No Slouch As Solar Cells
(International Business Times UK, Oct 12)

ARM, SMIC extend partnership to 40-nm node
(EE Times Europe, Oct 12)

Hynix CEO: Slowdown seen amid scaling push
(EE Times, Oct 12)

Renesas eyes growth in power ICs
(EE Times, Oct 12)

China patent filings could overtake US, Japan in 2011
(Solid State Technology, Oct 11)

ARM, SMIC extend partnership to 40-nm node
(EE Times, Oct 11)

Taiwan prosecutors drop case against ex-UMC execs
(Digitimes, Oct 11)

Single-crystal films could advance solar cells (w/ Video)
(PhysOrg.com, Oct 08)

SEMI wants easier access to European money
(EE Times, Oct 08)

Foundries are powerhouse for innovation, says TSMC president
(Electronics Weekly, Oct 08)

Wonder carbon pioneers win Nobel Physics Prize
(MSN Malaysia, Oct 05)

Wonder carbon nets pair Nobel Physics Prize
(ABC News, Oct 05)

SEMICON Europa 2010 is once again the focus of Europe's Semiconductor Industry
(EMS Now, Oct 05)

August's 'actual' chip sales were below par
(EE Times, Oct 05)

Lithography materials infrastructure benefits from a collaborative research approach
(Electro IQ, Oct 04)

An SREC State of Mind
(Greentech Media, Oct 04)

Vacuum/abatement technology saves the bottom line and the planet
(Electro IQ, Oct 04)

Suppliers Brace for Looming LED Demand
(Design News, Oct 04)

ASE to budget US$700 million in capex for 2011, says paper
(Digitimes, Oct 04)

Semicon Distributors Enjoy Soaring Sales in China
(PCB007, Oct 01)

Stanford’s Thinner, Roughed-Up Solar Cells Convert 10 Times More Energy
(Clean Techies, Oct 01)

Leti Demonstrates the Integration of CMOS-Compatible Plasmonic Optical Waveguides with Silicon Photonic Devices
(Yahoo! Finance Canada, Oct 01)

Predictions of upcoming winners for Nobel Prize in physics
(PhysOrg.com, Oct 01)

iSuppli Lowers Semi Forecast; Says Q4 Will Be Negative
(Printed Circuit Design & Fab, Oct 01)

Tessera sues Sony, Renesas over stacked ICs
(EE Times, Oct 01)

Osram with pilot production line for organic LEDs in Germany
(Evertiq, Oct 01)

New PV Standards Initiatives Lower Costs for All
(EMS Now, Oct 01)

TSMC gets nod for 130-nm production in China
(EE Times Europe, Oct 01)

iSuppli trims 2010 semiconductor forecast
(Evertiq, Oct 01)

Analyst cuts 2010 chip growth forecast to 32%
(EE Times, Sep 30)

Anti-counterfeiting measure: the authorized directory of semiconductor distributors
(EE Times Europe, Sep 30)

Shipments of Semiconductor Silicon to Jump 23.6 Percent in 2010
(Electronic Products, Sep 29)

European Business and Policy Leaders Discuss the Role of Innovation and Energy
(Earth Times, Sep 29)

Semiconductor distributors enjoy soaring sales in China, says iSuppli
(Digitimes, Sep 29)

Chip equipment makers conservative over 2011 business outlook
(Digitimes, Sep 29)

Dow Corning to establish new USD$13 million Solar Energy Exploration & Development Center
(PV Magazine, Sep 29)

Fairchild expands efforts in China
(EE Times, Sep 28)

Solar Cells Thinner Than Wavelengths Of Light Hold Huge Power Potential
(Chem.Info, Sep 28)

GLOBALFOUNDRIES Joins Si2 Industry Standards Efforts
(Business Wire EON, Sep 28)

Analyst: Japan's litho firms face extinction
(EE Times, Sep 28)

Applied Materials Delivers Critical Photomask Etch Technology for 22nm Lithography
(Nano TechWire, Sep 27)

Two major Chinese companies order turnkey lines to produce crystalline solar cells from centrotherm photovoltaics
(PV Magazine, Sep 27)

China Development Bank finances LDK Solar expansion
(New Net, Sep 27)

ITRI Is Awarded as Gold Winner for Its FlexUPD at the WSJ Technology Innovation Awards
(Marketwire - Business - PE.com, Sep 27)

Grace moves 0.13-micron embedded flash process to volume production
(Digitimes, Sep 27)

Increased IDM Outsourcing Brightens TSMC's Q4 Outlook
(Semiconductor Packaging News, Sep 24)

Qualcomm defines format for 3-D chip stress
(Medical Design Technology, Sep 24)

Opportunities for Printed Silicon: 2009 to 2016
(Green Tmcnet.com, Sep 24)

Discrete component prices set to fall in 1Q11, says iSuppli
(Digitimes, Sep 24)

Discrete prices, lead times rise, says iSuppli
(EE Times, Sep 22)

Sanyo to close 2 domestic semiconductor plants
(Scottrade, Sep 22)

Japan's fab tool book-to-bill ratio falls
(EE Times, Sep 22)

Japan August chip-gear orders up slightly on-month, says SEAJ
(Digitimes, Sep 21)

Market for System-Critical Semiconductors Hits Record Expansion
(Semiconductor Packaging News, Sep 21)

Plessey plans to run GaN, SiGe at UK fab
(EE Times, Sep 21)

TSMC to unveil 20nm chips with FinFET transistors
(Computerworld, Sep 21)

Mass Production of 75nm NOR Flash Memory in Q4
(Consumer Electronics Daily News, Sep 20)

EE Times Group in Partnership with Merrill Research Launches EE Intelligence, Robust Online...
(Forbes.com, Sep 20)

Compatibility and reliability are key factors in the design of LED lighting devices and systems
(LEDs Magazine, Sep 20)

Semiconductor equipment bookings reach potential peak
(Semiconductor Packaging News, Sep 20)

Gartner says semiconductor equipment spending on pace to grow 122 percent in 2010
(Display +, Sep 20)

Solar initiatives stand out
(Power-Gen Worldwide, Sep 19)

Silicon Photonics and Quantum Computing
(EEbeat, Sep 19)

Gov. Schwarzenegger Tours Marvell Semiconductor and Receives a Briefing
(TMCnet.com, Sep 18)

Production gets smart
(Manufacturer.com, Sep 18)

North American Semiconductor Equipment Industry Posts August 2010 Book-To-Bill Ratio of 1.17 (SEMI)
(EDA Cafe, Sep 17)

Global Solar PV Shipments Likely to Double to 16 GW This Year
(Scientific American, Sep 17)

Photomask for wafer fab: A look at the industry's structure
(Solid State Technology, Sep 17)

TSMC to benefit most from IDM outsourcing
(Semiconductor Packaging News, Sep 17)

Hynix shares jump on LG Elec investment hopes
(Yahoo! Asia - Philippines Business News, Sep 16)

GSA kicks off 3-D chip, MEMS work
(EE Times, Sep 16)

TSMC to sell own-branded CIGS thin-film modules as first 200MW fab starts construction
(PV Tech, Sep 16)

Mitsubishi Electric launches world s first large-scale OLED screen
(Professional AV Buyers Guide, Sep 14)

Nichia Launches Suit Over LED Patents
(Law 360, Sep 14)

Solar PV Equipment Spending will be Great in 2010: Solarbuzz
(RenableEnergyWorld.com, Sep 14)

Fake chips threaten military
(PhysOrg.com, Sep 14)

Intel investing $30 million in software companies
(yahoo! 7 Finance, Sep 14)

CMOS, MEMS meld enabled with advanced TSV, flexible interconnects
(Solid State Technology, Sep 13)

Freescale licenses RCP to Nepes, brings redistributed chip packaging to 300mm in Singapore
(Electro IQ, Sep 13)

Applied Materials Enhanced Aerial Imaging Technology Addresses 22nm Photomask Inspection Challenges
(Nano TechWire, Sep 13)

Big Bucks for SEMI / PV group members
(Evertiq, Sep 13)

Electronic Skin Breakthrough Could Let Robots 'Feel'
(FOX News.com, Sep 13)

ATIC announces semiconductor research and development strategy for Abu Dhabi
(TMCnet.com, Sep 13)

SEMI Taiwan sets up committee to promote local sourcing of semiconductor equipment
(Digitimes, Sep 13)

Launch of megawatt lab for solar PV inverters
(Renewable Energy Focus, Sep 10)

Thirty-one visionary companies selected as technology pioneers 2011
(Telecomkh (EN), Sep 10)

Over the first hurdle
(The Photovoltaic Magazine, Sep 10)

Second-hand equipment market to remain hot through 2011, says Novellus exec
(Semiconductor Packaging News, Sep 10)

Semi Gear Bookings Still in High Gear
(Printed Circuit Design & Fab, Sep 09)

Toppan Completes 22nm and 20nm Production Photomask Process Through Toppan-IBM Joint Development
(Benzinga.com, Sep 09)

Oerlikon launches new solar technologies
(Trade Arabia - Guld Industry Magazine, Sep 09)

MEMS foundry APM to ramp up capacity
(Digitimes, Sep 09)

SEMICON Japan 2010 to Feature Next Generation Technology Pavilion Showcasing Latest Innovations in LED, MEMS, 3D Packaging Manufacturing
(TMCnet.com, Sep 09)

California Public Utilities Commission Funds ZBB Energy and SunPower Demonstration Project of Renewable Energy With a ZESS 500
(Electric Light & Power, Sep 08)

Samsung predicts memory oversupply
(The Tech Report, Sep 08)

AEG Power Solutions claims breakthrough in polysilicon production efficiency
(EE Times Europe, Sep 08)

European Photovoltaic Observatory monitoring service launches from EPIA
(Solid State Technology, Sep 07)

Imec reports large-area silicon solar cells with high efficiency
(EDN, Sep 07)

UPDATE:Samsung: Chip Oversupply Likely In 2011 If PC Demand Slows More
(Morningstar, Sep 07)

LCD TV Panel Makers Target 40% LED Penetration by Q4'10
(EMS Now, Sep 07)

Samsung Expands its ‘Green Memory’ Initiative
(.NET Developer's Journal, Sep 07)

"Printed Electronics Without Borders"
(Nanotechnology Now, Sep 03)

SEMICON Taiwan welcomes French wafer fab equipment suppliers, research orgs
(Solid State Technology, Sep 03)

UCLA chemists, engineers achieve world record with high-speed graphene transistors
(Electronic Component News, Sep 03)

Wafer prices declined in Q2, says GSA
(EE Times, Sep 03)

NCKU Associate Prof. Soon-Jyh Chang Developed Circuit Design Techniques of Energy Saving
(Yahoo! Finance US, Sep 03)

NSF funds expedition into software for efficient computing in the age of nanoscale devices
(Nano Werk, Sep 02)

Former NXP fab workers to get EU support
(EE Times, Sep 02)

California puts renewable energy bill in jeopardy
(New Net, Sep 02)

July 'actual' chip sales are above trend
(EE Times, Sep 02)

Chip revenue expected to grow 31.5 percent in 2010: Gartner
(Yahoo! News, Sep 01)

ARM, GlobalFoundries to accelerate 28-nm foundry era
(EE Times, Sep 01)

Optimizing the manufacturing test program, data collection, and diagnosis for yield analysis
(EE Times, Sep 01)

LED-backed LCD TVs on healthy growth path
(EE Times, Sep 01)

Contamination control today with Entegris
(Solid State Technology, Aug 31)

Silicon oxide circuits break barrier: Nanocrystal conductors could lead to massive, robust 3-D storage
(PhysOrg.com, Aug 31)

Advances Offer Path to Shrink Computer Chips Again - CNBC
(CNBC, Aug 31)

Toshiba rolls 24-nm NAND flash

(EE Times, Aug 31)

Europe has the major share of the growing global photovoltaic market
(Plastemart.com, Aug 30)

IMS Research Releases Latest MOCVD Forecast -- Over 4000 Tools Expected to Ship from 2010 to 2013
(BigCharts MarketWatch, Aug 30)

Prediction Of Intrinsic Magnetism At Silicon Surfaces Could Lead To Single-Spin Magnetoelectronics
(Embedded Technology, Aug 30)

July Semiconductor Sales Up 37 Percent Year-on-Year
(Business Wire, Aug 30)

Intel Buys Infineon Wireless Unit for $1.4 Billion
(Business Week, Aug 30)

Silicon prices climb; PV cutbacks in 2011 will curb trend
(Electro IQ, Aug 27)

California Proposes Feed-in Tariff PIlot Program for Renewables
(SustainableBusiness.com, Aug 27)

Samsung could overtake Intel in IC sales by mid-decade
(Semiconductor Packaging News, Aug 27)

Semi Companies Advised to Watch Inventory Levels for Second Half
(Semiconductor Packaging News, Aug 27)

Jobs await U.S.-based Taiwanese expats
(EE Times, Aug 27)

A versatile, clean and efficient way to enhance widespread application of carbon nanotubes
(PhysOrg.com, Aug 26)

Ultralow-power memory uses orders of magnitude less power than other devices
(PhysOrg.com, Aug 26)

Trio collaborate to reduce dynamic and leakage power in SoCs
(EE Times, Aug 25)

How strong are your IP assets?
(EE Times, Aug 25)

2011 semiconductor sales may be slower, Semico IPI dip indicates
(Electro IQ, Aug 25)

Synopsys adds MIPI M-PHY IP in 40nm process technology
(EE Times, Aug 25)

SEMATECH and Dai Nippon Printing Collaborate to Develop Advanced Process Technologies at UAlbany NanoCollege
(Global Print Monitor, Aug 25)

Applied Materials Enables Advanced Microchip Designs with Breakthrough Flowable CVD Technology
(Yahoo! Finance Canada, Aug 24)

Renowned Semiconductor Industry Veterans Launch Boston Semi Equipment Group
(EDA Cafe, Aug 24)

AMD Unveils Bulldozer and Bobcat Core Designs
(PCMag.com, Aug 24)

SEMICON Europa 2010 to Focus on Latest Nano-Manufacturing Innovations
(weSRCH.com, Aug 24)

GLOBALFOUNDRIES Forum with IP and EDA Leaders
(Chip Design, Aug 24)

Intel CEO: U.S. faces looming tech decline
(Webware - CNET, Aug 24)

Inventory bubble not a concern, iSuppli says
(EDN, Aug 24)

Semiconductor equipment bookings blossom
(Semiconductor Packaging News, Aug 24)

Recession Hurts Smartphone Makers in the Chips
(Top Tech News, Aug 24)

McGill harnessing piezo effect in quantum dots for nano sensors
(EE Times, Aug 23)

INTEL: CATALYST FOR GROWTH: Chipmaker celebrates 30th anniversary of Rio Rancho plant, its impact on both city and region
(Gadgets, Aug 23)

The $1 Billion Microwave Tube Market is Successfully Holding Off the Gallium Nitride Threat,...
(Forbes.com, Aug 23)

ZSW sets another new CIGS solar cell record
(PV Tech, Aug 23)

Analyst: Applied to roll shallow trench CVD tool
(EE Times, Aug 23)

Applied to Announce Breakthrough Technology for Chip Mfg
(Semiconductor Packaging News, Aug 20)

North America chip gear book-to-bill ratio up in July 2010, says SEMI
(Digitimes, Aug 20)

Intel is mum, but company reportedly plans new Hillsboro plant [The Oregonian, Portland, Ore.]
TMCnet.com, Aug 20)

Fairchild Semiconductor's Translator Solves Compatibility Issues in I2C Bus Applications
(Forbes.com, Aug 18)

Semiconducter firm develops probability chip
(Business Report.com, Aug 18)

Top 4 Clean-Tech Predictions for 2H 2010
(RenableEnergyWorld.com, Aug 18)

Why Solar Is, and Isn't, Like the Chip Industry
(Money Times, Aug 18)

July Chip Equip Orders Up 186% On Year; BB Ratio 1.53
(Nikkei.com (Eng), Aug 18)

Taiwan’s Economy Probably Expanded More Than 10%
(Business Week, Aug 18)

Semiconductor Research Corp, Georgia Tech Boost Off-Chip Bandwidth, Drive Down Energy Per Bit
(Circuitree, Aug 17)

: "Unlocking the potential of nanotechnology"
(Nanotechnology Now, Aug 17)

Spin injection, manipulation, and detection in lateral devices
(SPIE, Aug 17)

Chip Makers Aim to Reduce GHG Emissions from Products, Operations
(Environmental Leader, Aug 16)

Bruker Announces Agreement to Acquire Veeco's Scanning Probe Microscopy (SPM) and Optical...
(Forbes.com, Aug 16)

Taiwan still the largest semiconductor equipment market
(Display +, Aug 16)

Intersolar India 2010 Slated for December Debut in Mumbai
(Azocleantech, Aug 16)

SEMI Announces Management Changes, Reorganization
(Circuitree, Aug 13)

Video interview with SEMATECH: EUV on center stage
(Solid State Technology, Aug 13)

Inventory Volatility Packs Supply-Chain Peril for Global Solar Market
(EMS Now, Aug 13)

Record German Growth Drives Euro-Region Expansion
(Business Week, Aug 13)

S. KOREA'S HYNIX TO SPEND US$569 MLN ON PLANT EXPANSION
(Scottrade, Aug 13)

Study predicts nanoscience will greatly increase efficiency of next-generation solar cells
(PhysOrg.com, Aug 13)

Chip Industry Finally Learns From Past Mistakes-Accenture
(CIO, Aug 12)

Most IC Market Segments to Enjoy Double-Digit Growth in 2010, Says IC Insights
(Circuitree, Aug 12)

Europe’s First All-LED Industrial Plant Opens in The Netherlands
(Business Wire EON, Aug 12)

Semiconductor Equipment Pushouts Imminent, Says Information Network
(Circuitree, Aug 11)

Should CSP Mirrors Be Glass or Metal?
(RenableEnergyWorld.com, Aug 11)

TSMC to break ground on solar cell factory by end of 2010
(Network World, Aug 11)

SEIA’s Resch Letter to Obama
(Solar Novus Today, Aug 10)

PhillyInc: Kulicke & Soffa moving headquarters to Singapore
(Philly.com, Aug 10)

Researchers successfully test new alternative to traditional semiconductors
(Nano Werk, Aug 10)

Hynix begins mass producing 64Gb NAND flash using 20nm-class technology
(Digitimes, Aug 09)

Suntech Exits a-Si Production
(PCB007, Aug 09)

AFOSR-funded professor winner of 2010 Materials Research Society Turnbull Award
(Bioscience Technology Online, Aug 09)

SMIC to get tens of millions in govt money -source
(Yahoo! Asia - Philippines Business News, Aug 09)

'Spoof' structures tighten up T-ray laser beam
(Bioscience Technology Online, Aug 09)

Samsung Austin sending new hires to Korea to learn logic chips
(Austin Business Journal, Aug 06)

Chip inventories cast shadow on TSMC and UMC 4Q10 sales
(Digitimes, Aug 06)

Synopsys and GLOBALFOUNDRIES to Develop DesignWare Interface PHY IP for 28-nanometer Technologies
(PR-USA.net, Aug 06)

Heads Up: MEMS Technology Summit
(EEbeat, Aug 06)

Who's Running The Ship? What's The End Game?
(RenableEnergyWorld.com, Aug 05)

Synopsys Custom Design Tools Enable Creative Chips to Achieve First-pass Silicon Success
(Gabe on EDA, Aug 05)

Encouraging quantum dots to emit photons
(PhysOrg.com, Aug 05)

GLOBALFOUNDRIES Announces Keynote Speakers for Global Technology Conference
(Nano Werk, Aug 05)

KLA-Tencor Introduces The New Aleris 8330 Film Metrology Tool
(Nano Werk, Aug 05)

Japan's Nikon lifts chip equipment sales forecast
(Reuters Stocks, Aug 05)

Graphene Oxide Gets Green
(PCB007, Aug 04)

The semiconductor industry is engaging in "business, economic and industry madness" by not hiking its prices, according to Europe's leading semiconduc...
(TMCnet.com, Aug 04)

iSuppli Optimistic about Semiconductor Growth
(Maximum PC, Aug 04)

Intel settles FTC lawsuit
(Investors.com, Aug 04)

Intel-TSMC pact on Atom chips remains on hold
(Info World, Aug 04)

Research: Total solar installations to exceed 100 GW in next five years; China to be world’s largest PV market
(PV Magazine, Aug 04)

New inexpensive solar cell design
(Innovations Report, Aug 04)

Leading US Firms Give In To Ending Overseas Tax Breaks
(Morningstar, Aug 03)

SMIC 65nm Technology Successfully Moves to Volume Production
(Nano Werk, Aug 03)

iSuppli Raises Semicon Revenue Forecast to a Record Level
(PCB007, Aug 03)

AMAT findings on virtual metrology
(Electro IQ, Aug 02)

The Feed-In Tariff Discussion Heats Up
(Greentech Media, Aug 02)

Semiconductor Roid Rage Prompts iSuppli to Pump Up 2010 Forecast
(Electronic Products, Aug 02)

Global Semiconductor Sales Rise 7.1 Percent Quarter-on-Quarter
(Press Release Point, Aug 02)

'White Graphene' To The Rescue
(Chemical Online, Aug 02)

Solar Polysilicon Plant in Dubai to Complement UAE's Existing Solar Activities
(PR-Canada.net, Aug 02)

Chip sales show first-half jump of more than 50%: SIA
(MarketWatch, Aug 02)

New solar energy conversion process discovered by Stanford engineers could revamp solar power production
(Bright Surf, Aug 02)

SOLARCON(R) India 2010 Concludes Successfully
(EFY Times, Jul 30)

“SEMATECH and Carl Zeiss Demonstrate Mask Pattern Alignment and Registration to Enable Double Patterning Lithography"
(Nanotechnology Now, Jul 30)

Semicon 2010 – services lead the way
(Chip Design Blogs, Jul 30)

SEMATECH and Carl Zeiss Demonstrate Mask Pattern Alignment and Registration to Enable Double...
(Forbes.com, Jul 29)
One-of-a-kind chemical formulation enables sub-50 nanometer process technology
(Nano Werk, Jul 29)

Court Confirms Verdict in Favor of Rudolph
(MarketWatch, Jul 29)

TSMC Sales, Profit Hit All-time Highs in Second Quarter
(PC World, Jul 29)

TSMC Raises 2010 Capex To US$5.9 Billion From US$4.8 Billion
(Morningstar, Jul 29)

Air Liquide Acquires Cryogas de Centroamerica S.A. in Panama
(Business Wire, Jul 28)

Lithium Battery Oversupply Debate Rages
(Greentech Media, Jul 28)

MEMS usage sees sharp upturn
(Automotive Engineering International Online, Jul 28)

Intel says light beams can replace electronic signals for future computers
(Macsimum News, Jul 28)

"By putting a ring on it," microparticles can be captured"
(Nanotechnology Now, Jul 28)

Veeco & Aixtron glow with Elec-Tech orders of $337.5mn
(Display +, Jul 28)

No carbon disincentives, RPS in US Democrats' energy bill
(Solar Server, Jul 27)

Impact of China labour disputes, rising yuan
(International Business Times, Jul 27)

Intel 32nm High-K Metal Gate (HKMG) Recognized as Most Innovative Logic Process
(Forbes.com, Jul 27)

Nanoparticles Increase Intensity of Quantum Dots' Glow
(TMCnet.com, Jul 27)

Meijo University Orders AIXTRON CCS MOCVD System for GaN-based UV And White LEDs
(Nano Werk, Jul 27)

Applied Materials iSYS Integrated Subfab System wins SEMICON West Sustainable Technologies award
(Solid State Technology, Jul 26)

SEIA Calls For Solar Provisions In Energy Bill
(Solar Industry, Jul 26)

Fairchild Semiconductor to appeal federal court ruling of willful infringement on patent
(Washington Examiner, Jul 26)

DOE funds CO2 recycling, 'solar fuels'
(Cnet News.com, Jul 23)

Cars Shrink But Semis Grow
(Semiconductor Packaging News, Jul 23)

Graphene Oxide Gets Green
(redOrbit, Jul 23)

TSMC Says Plans To Rebuff STC.UNM Patent Infringement Allegation
(NASDAQ.com, Jul 22)

Micron to give UI $1.2 million for STEM academic research: Research to focus on improving attraction, success in certain disciplines [Moscow-Pullman Daily News, Moscow, Idaho]
(TMCnet.com, Jul 22)

Dow Electronic Materials Inaugurates New Facility to Serve Fast Growing OLED Market
(SYS-CON India, Jul 22)

Shanghai Epilight Selects Veeco's MOCVD Systems for Its LED Manufacturing Capacity Ramp
(TMCnet.com, Jul 22)

IC design houses look to modest revenue growth in 3Q10
(Digi Times, Jul 22)

iSuppli: Apple Gobbling Up Chips to Feed iPhone, iPad
(Wireless Week, Jul 21)

Imec EUV mask cleaning program on track towards EUV mass manufacturing
(Solid State Technology, Jul 21)

Applied pulls SunFab plug; shifts to c-Si, LEDs
(Solid State Technology, Jul 21)

Renewables account for 62% of the new electricity generation capacity installed in the EU in 2009
(Environmental Valuation & Cost-Benefit News (Blog), Jul 21)

Veeco Ships MOCVD Systems to Support Invenlux's Production Ramp at Its China LED Factory
(Nano Werk, Jul 21)

Air Products Building World Class ASU Trains for PCEC in China
(Forbes.com, Jul 21)

Small Wires Make Big Connections For Microelectronics
(Photonics Online, Jul 21)

EDA in a 3D semiconductor world: Walden Rhines
(Electro IQ, Jul 20)

Columnist Paula Mints updates us on PV trends
(Solid State Technology, Jul 20)

"Spintronics breakthrough documented by UNL MRSEC team"
(Nanotechnology Now, Jul 20)

SEMICON West Day 3: CMP and beyond, YouTube walkthroughs, PV drinking habits
(Solid State Technology, Jul 20)

Semiconductor Foundry to Use GE’s Water Purification System
(Process Cooling, Jul 20)

Imec welcomes research partners to its GaN research program (Semiconductor Packaging News, Jul 20)

Optimistic mood sweeps test vendors at Semicon West
(Test & Measurement World Blogs, Jul 19)

Chip industry trade group hires pro lobbyist, will move to DC | VentureBeat
(Venture Beat, Jul 19)

Arima chooses Veeco MOCVD systems for production ramp
(Semiconductor Today, Jul 19)

Solar module market to reach US$35 billion in 2010, says Displaybank
(Digi Times, Jul 19)

TSMC to boost Shanghai 8-inch fab capacity
(Digi Times, Jul 19)

Commentary: Capacity utilization rates at foundry houses likely to fall in 4Q10
(Digi Times, Jul 19)

Fraunhofer ISIT Selects Rudolph Technologies for MEMS Inspection
(Semiconductor Packaging News, Jul 19)

Tour Applied Materials: Photos and observations from our visit
(Solid State Technology, Jul 16)

CEA-Leti Building 300mm R&D Line Dedicated to 3D-Integration App
(Semiconductor Packaging News, Jul 16)

Applied Materials to Showcase Microchips and Clean Energy Solutions at California Conferences
(TMCnet.com, Jul 16)

Europe 'increasing demand for semiconductor and solar panels
(Element14, Jul 16)

TSMC breaks ground on US$9.3 billion chip factory
(Network World, Jul 16)

Oerlikon Solar’s Amorphous Silicon PV Keeping Up
(Greentech Media, Jul 15)

White OLED Outlook Brightens with Efficiency Breakthrough
(Charts, Jul 15)

ON Semiconductor To Buy Sanyo Electric's Chip Unit
(Report Linker, Jul 15)

SEMICON West: Lithography trends at Sokudo breakfast forum
(Solid State Technology, Jul 15)

Japanese electronics maker Sanyo to sell semiconductor operations
(Earth Times, Jul 15)

450mm report: Standards, AMHS, platforms getting ready
(Solid State Technology, Jul 15)

July 14: CMU Partners With Semiconductor Research Corporation; Smart Grid Research Center To Be Housed at CMU - Carnegie Mellon University
(Carnegie Mellon University, Jul 14)

Toshiba Eyes Opening Flash Facility Next Summer Amid Strong Demand
(Nikkei.com (Eng), Jul 14)

ASML Profit Beats Estimates as Clients Raise Spending
(Business Week, Jul 14)

SEMI more upbeat about 2010 chip equipment market
(Digi Times, Jul 14)

EV Group to Share Key Developments and Highlights at SEMICON West
(Nano Werk, Jul 14)

TSMC to break ground for new 12-inch fab on July 16
(Digi Times, Jul 14)

Intel Posts Biggest Quarterly Profit In A Decade
(NPR Broadcast, Jul 13)

Bayer MaterialScience Joins Dutch Flexible Electronics Initiative
(Congoo, Jul 13)

SIA: Global chip sales up 48 percent in May
(KCOY, Jul 06)

Committee advises softening of German solar FIT reductions
(Recharge, Jul 06)

Portable Entertainment Devices Consume US$5 Billion in Semiconductor Value in 2011, E-Readers the Category Star, In-Stat Says
(iPhone News, Jul 06)

Worldwide Semiconductor Revenues Will Increase to $295 Billion in 2011 and Surpass $340 Billion in 2014, According to IDC
(DMN, Jul 06)

Etch pushes limits of physics and chemistry
(Electro IQ, Jul 06)

Thinnest metallic lines in the world speeds up miniaturisation of electronic devices"
(Nanotechnology Now, Jul 06)

"Nanomaterial growth platform's end-to-end processing purity offers breakthrough for developers targetting commercial manufacturing"
(Nanotechnology Now, Jul 06)

Renewables must generate 50% of global electricity: IEA
|(Renewable Energy Focus, Jul 02)

Quadrant Launches New Products at Semicon West
(Semiconductor Packaging News, Jul 02)

UPDATE 1-Sanyo finalising chip unit sale to ON Semi-sources
(Reuters Global Markets News, Jul 02)

DEK Solar looks forward to Semicon West 2010
(Ems Now, Jul 02)

Barrier To Faster Integrated Circuits May Be Mere Speed Bump
(Semiconductor Online, Jul 01)

Ramtron Secures $6.0 Million Term Loan from Silicon Valley Bank
(Forbes.com, Jul 01)

Tool award at chip factory: GlobalFoundries contract goes to firm with plans to move to Watervliet [Times Union, Albany, N.Y.]
(TMCnet.com, Jul 01)

Air Products to Build New ASU at Granite City, Illinois
(Forbes.com, Jun 30)

"LOPE-C 2010: Overwhelming Success"
(Nanotechnology Now, Jun 30)

Barrier to faster integrated circuits may be mere speed bump, scientists say
(TechNews.AM, Jun 30)

Dainippon Screen Introduces Wafer Cleaning System for Green Devices
(Press Release Network, Jun 30)

Samsung to Double Size of Austin Semiconductor Plant
(Industrial Info Resources, Jun 30)

Solar PV Technology Update
(TechBites Blogs, Jun 29)

Companies Collaborate for Fab Synchronization to Produce Advanced Chips Based on 28 nm Process Technology with STMicroelectronics
(Wireless Design & Development, Jun 29)

Taiwan Semiconductor Takes Stake in China Rival
(Industry Week, Jun 29)

Solarbuzz forecasts solar market at 15.2GW in 2010: Germany at 8GW
(PV Tech, Jun 29)

Global Semiconductor Alliance and VLSI research Announce Partnership
(Business Wire EON, Jun 28)

Powerchip shifting product mix; approves NT$12.6 billion for 2010 capex
(Digi Times, Jun 28)

SCHOTT Solar Wins CSP Today Award
(Glass on Web, Jun 28)

Europe worries over raw materials
(Deutsche Welle, Jun 25)

Next Stop Graphene Valley?
(SYS-CON India, Jun 25)

TSMC to Build PV Cell Factory in Central Taiwan
(Ems Now, Jun 25)

TSMC 2010 capex may exceed planned US$4.8 billion, says chairman
(Ems Now, Jun 25)

Bettina Weiss of SEMI PV Group Receives the 2010 Women in Solar Energy (WISE) Award
(TMCnet.com, Jun 25)

IBM collaborates with Samsung, Globalfoundries and STMicroelectronics
(Stifel Nicolaus, Jun 25)

Major New Advances in Energy Harvesting
(PCB007, Jun 24)

Chipmakers in $173 mln US price-fixing accord
(CNN Money, Jun 24)

Infineon Will Grow Faster Than Rest of Chip Market, CEO Says
(Business Week, Jun 24)

China's $25 billion to boost domestic production, says analyst
(EE Times, Jun 24)

SUSS MicroTec Tackles The LED Market With Dedicated Lithography System
(Photonics Online, Jun 24)

Strong May chip sales show World Cup effect, says analyst
(EE Times, Jun 24)

Elpida, PTI, and UMC Partner on 3D IC Integration
(Chip Design, Jun 21)

National Semiconductor buys GTronix
(Electronics Advocate, Jun 21)

Double-digit growth expected for power management ICs
(EDN, Jun 21)

SEMI/SEAJ May numbers: Slowing at a peak?
(Electro IQ, Jun 21)

TSMC to run Tainan plants on solar power
(Electric Light & Power, Jun 21)

Gold nanowires on GaP and InP substrates raise solar cell efficiency hopes
(Gold.org Media Centre, Jun 21)

Intel Presents 20 Threaded Westmere-EX Processor
(Hardware Canucks, Jun 21)

Overstretched Taiwanese Chip Assemblers Scramble to Expand Capacity
(Ems Now, Jun 21)

UPDATE 1-North American May chip-gear orders rise 2.8 pct
(Reuters Global Markets News, Jun 17)

Novellus Systems Develops XMM Technology To Reduce In-Line Isotropic Copper Overburden - Quick Facts
(RTTNews, Jun 17)

Qualcomm Faces New European Antitrust Probe
(PC World, Jun 17)

Toshiba to Ship 128GB Memory Chip for Mobile Devices
(CIO, Jun 17)

Semiconductor mkt set to grow by 22%
(All Voices, Jun 17)

Multicore Assoc. Tears Down Tool-Interoperability Barriers
(Chip Design, Jun 17)

Qualcomm faces new European antitrust probe
(Tech Tips Today, Jun 17)

Texas Tech, U of Utah win Sandia microdevice competition
(PhysOrg.com, Jun 15)

MarketsandMarkets: Global LED Chips Market Worth US$ 8536 Million By 2014
(WQOW TV, Jun 15)

Novel GaN Technology Enhances S-band Radar Performance
(Microwave Journal, Jun 15)

2010 GaAs Foundry Services Outlook
(Microwave Journal, Jun 15)

IITC Day 3: Sub-30nm SoG gapfill, 22nm airgaps...and enforcing Zafiropoulo's Law
(Solid State Technology, Jun 15)

ARM, IBM, Samsung, GLOBALFOUNDARIES, Synopsys Announce Technology Alliance
(TMCnet.com, Jun 15)

Qualcomm Joins Group to Keep Moore’s Law on the Books
(GigaOM, Jun 15)

iSuppli Moves European Briefing to December
(Electronic Products, Jun 15)

WSTS, SIA forecasts upgrades reflect fast changes
(Electro IQ, Jun 15)

Nanotech firms need to focus on markets
(Plastic Electronics, Jun 14)

Synopsys StarRC Custom 3D Extraction Gives 20X Speedup
(Chip Design, Jun 14)

CMP Suppliers Face a Long-Lasting Shakeup from the Recession
(Ems Now, Jun 14)

Analysts' take: Samsung incites "foundry wars" with 32nm HKMG volley
(Electro IQ, Jun 14)

IMEC builds a better Ge-based TPV
(Solid State Technology, Jun 10)

Aiming to boost electronics performance, researchers capture images of sub-nano pore structures for the first time
(Nano TechWire, Jun 10)

Synopsys Delivers Comprehensive Design Enablement for TSMC 28-nm Process Technology with Reference Flow 11.0
(Nano Werk, Jun 10)

Samsung to Invest $3.6 billion in U.S. Plant
(Industry Week, Jun 10)

UPDATE 1-Global chip gear spending to surge in '10, then ease
(Reuters Global Markets News, Jun 10)

TI says inventory remains lean, narrows Q2 sales guidance toward high end
(EDN, Jun 09)

Leading Semiconductor Equipment Manufacturer Selects Crossing Automation's Spartan EFEM for Second Generation Metrology Tool
(Nano Werk, Jun 09)

SUSS MicroTec tackles HD LED market with dedicated lithography system
(Display +, Jun 08)

Global Semiconductor Shipments To Hit Record
(Manufacturing.net, Jun 08)

U.S. Stocks Fluctuate as Exxon, Alcoa Offset Chipmaker Slump
(Bloomberg.com, Jun 08)

U.S. Commerce Secretary Gary Locke to Keynote Council on Competitiveness Media Event
(Forbes.com, Jun 08)

Hynix Licenses Apical's Imaging Cores for Next Image Sensor Products
(SOCcentral, Jun 08)

Vistec gets major order from Penn State
(TimesUnion.com, Jun 07)

Management Changes in Osram's LED Business in North America
(NEMA, Jun 07)

OLED tool supplier says China is next big market for displays
(Plastic Electronics, Jun 07)

The Earth and Moon formed later than previously thought
(PhysOrg.com, Jun 07)

Taiwan's FPD Production Value to Slightly Rise in Q2
(Ems Now, Jun 07)

IC industry consolidation is here!
(Ems Now, Jun 07)

Rudolph Adds Direct-Dock Probe Card Capability to PrecisionWoRx VX4
(Forbes.com, Jun 07)

Chip makers start joint venture for improving Linux distribution
(PhysOrg.com, Jun 07)

Analog Devices' MEMS motion sensing meets Hollywood
(Display +, Jun 07)

A New Approach to Finding and Removing Defects in Graphene
(Innovations Report, Jun 07)

TSMC Extends Open Innovation Platform(TM)
(Forbes.com, Jun 07)

Tokyo Electron Limited (TEL) and Ebara Corporation (Ebara) Mutually Agreed on Joint Evaluation about Ruthenium Based Technology
(Press Release Point, Jun 07)

The Global PV Market: Yesterday, Today, and Tomorrow
(Greentech Media, Jun 03)

Renewable energy exempted from potential EU ban on hazardous household goods
(Deutsche Welle, Jun 03)

Chip sales expected to grow 27%: Gartner
(MarketWatch, Jun 03)

Semiconductor firms to increase facilities spending
(The Columbian, Jun 03)

Could German solar incentives enjoy a reprieve?
(BusinessGreen.com, Jun 03)

Interview with Henning Wicht, Senior Director and Principal Analyst at iSuppli
(Solar Plaza, Jun 03)

A liberal sprinkling of quantum dots
(Physics World.com, Jun 03)

Chip giants establish Linux group for phones, TVs
(Computerworld, Jun 03)

Air Products Introduces EXTREMA(R) Precursors for Next Generation Memory Applications
(Forbes.com, Jun 02)

GlobalFoundries to Cover the Planet with Foundries
(Maximum PC, Jun 02)

EPIA pushes EU to support solar technology funding
(PV Tech, Jun 02)

World-Class 300mm Wafer and R&D Fabs Offered for Sale
(Forbes.com, Jun 02)

Yangzhou Zhongke orders two Aixtron CRIUS systems to ramp GaN-based HB-LED production
(Semiconductor Today, Jun 02)

Solar Panels May Be Exempted in EU Hazardous Substance Revamp
(Bloomberg.com, Jun 02)

GlobalFoundries raises spending by $3B amid chip boom
(Info World, Jun 01)

April chip sales up 50.4% year over year
(San Jose / Silicon Valley Business Journal, Jun 01)

European solar PV industry ready to co-finance €1235m of R&D
(Renewable Energy Focus, Jun 01)

AUO, SunPower invest US$700 mln in Malaysian solar-cell plant
(Solar Plaza, Jun 01)

Wi-Fi IC Shipments Forecast to Surpass 770 Million Units in 2010, Says ABI ResearchWi-Fi IC Shipment Forecast by Product Type (Graphic: Business Wire)
(Consumer Electronics Net, May 28)

European Semi Distribution Sales Skyrocket
(EPN Distiblog, May 28)

Taiwan's AUO, U.S. SunPower to Build Solar Plant in Malaysia
(Industry Week, May 28)

Sony gives more details about their 4.1" rollable OLED
(OLED-Info, May 28)

Cabot Microelectronics Corporation Receives UMC's Outstanding Supplier Award
(Topix, May 28)

Utility-scale solar thin-film farm in China
(Renewable Energy Focus, May 28)

RFaxis' Chips Go Green by Delivering Best-of-Class RF Front-End Performance at Ultra-Low Voltages
(Consumer Electronics Net, May 27)

TSMC and Co-Development Partners Mentor and Synopsys Donate iDRC to Si2
(Business Wire EON, May 27)

Rambus Acquires Uni-Pixel Display and Backlighting Intellectual Property
(Market Wire, May 27)

Semiconductor packaging and electronics consortium formed for all-electric aircraft
(Electro IQ, May 26)

Cymber starts to sell lasers for OLED manufacturing, will lower cost of making OLEDs
(OLED-Info, May 26)

'Sistema is interested in buying Infineon - CEO'
(Scottrade, May 26)

Graphene films clear major fabrication hurdle
(Printed Electronics World, May 26)

EU May Give Solar Companies a Break on Cadmium, Lead
(Greentech Media, May 26)

Applied Materials and China New Energy Leader CECEP to Collaborate on Advancing Solar PV
(News Blaze, May 26)

Solar energy market to grow 43 percent in 2010 despite oversupply challenges
(EE Times Europe, May 25)

Getting nitride HEMT gates in shape for optimum performance
(Semiconductor Today, May 25)

Taiwan-based solar cell makers face dual price pressure
(Digi Times, May 25)

China-based PV module makers not offering quotes for 3Q10
(Digi Times, May 25)

Silicon nanosponges make solar energy cheaper
(New Electronics, May 25)

Group Releases Letter Urging Passage of Free Trade Agreements
(Asia - IP Communications, May 25)

Silver and gold nanowires to improve touch screens
(Daily India, May 25)

LED Based Rear Combination Lamps and their Practical Applications
(Electronic Component News, May 24)

New INL invention could aid Mars probes' search for life
(PhysOrg.com, May 24)

Dai Nippon Printing Takes Lead in Semi Photomask Market in 2009
(Semiconductor Packaging News, May 24)

MEMC to buy Solaicx for $76M
(Biz Journals, May 24)

Applied Materials' New Turnkey MES Solution Introduces Advanced Automation for Solar, LED and...
(Forbes.com, May 24)

Singapore government says FIT will 'distort the energy market'
(Recharge, May 24)

Spire matches world record for solar cell efficiency
(New Energy World Network, May 24)

Japan chip gear book-to-bill slips to 1.07 in April 2010, says SEAJ
(Digi Times, May 24)

Samsung to strengthen foundry business
(Digi Times, May 24)

GlobalFoundries may partner up with UMC
(The Tech Report, May 21)

Spire Produces World’s Most Efficient Large Area Concentrator Solar Cell
|(MSN Money, May 21)

Epistar of Taiwan Qualifies Veeco MOCVD System for High Volume Production
(Nano TechWire, May 21)

Wild Semiconductor Thin Film Equipment Market in 2009
(Semiconductor Packaging News, May 21)

Semiconductor Manufacturing Technique Holds Promise For Solar Energy
(Power Online, May 21)

North America chip-gear orders up 8% in April 2010, says SEMI
(Digi Times, May 21)

DNP leads in 2009 semiconductor photomask market
(Digi Times, May 21)

ConFab video: Systems-driven collaboration creates opportunities
(Solid State Technology, May 20)

UPDATE 1-U.S. brings green power execs to red China
(Reuters Global Markets News, May 20)

Foundry production for driver and PWM ICs to remain tight in 2H10, says VIS chairman
(Digi Times, May 20)

Applied Materials: Success Seems Distant
(Seeking Alpha, May 20)

Thin film equipment orders at Oerlikon Solar evaporate in Q1
(PV Tech, May 19)

EU fines Samsung Elec, others for chip price-fixing
(Reuters Global Markets News, May 19)

Solar Energy Market Will Grow 43% Year-Over-Year in 2010, but Oversupply is Likely, Says Pike...
(Forbes.com, May 19)

Materials with potential / Growing through holes
(Fraunhofer, May 19)

U.S., Europe look to China for clean energy sales
(Ashland Daily Tidings, May 18)

'DRAM chip manufacturers accept EC fine for price-fixing'
(TMCnet.com, May 18)

Samsung 2010 chip capex hints at upcoming boom in PCs, say Taiwan DRAM makers
(Digi Times, May 18)

Diamond wire saws to become mainstream in solar wafer slicing in 2 years
(Digi Times, May 18)

SMIC reportedly sells solar cell business
(Digi Times, May 18)

People and products
(Jconline.com (AP), May 18)

SMA Solar Unable to Meet Rising Demand for Inverters
(SustainableBusiness.com, May 17)

Samsung Electronics to Invest $22.7 Billion in Manufacturing Plants
(Industry Week, May 17)

Applied Materials' Sunfab line first to qualify for UL solar Master Certification Program
(Fmlink, May 17)

Japan rocket to blast off with Venus probe and 'space yacht'
(PhysOrg.com, May 17)

AU sees LCD shortage, eyes China deals
(Reuters Technology News, May 17)

UN warns rare metal shortage could derail clean tech boom
(BusinessGreen.com, May 14)

Trina Solar Introduces High Performance Monocrystalline Module TSM- DC80 with 'Quad Max' Cell Technology
(Pennenergy, May 14)

Strategies in Light Europe unveils program information
(LEDs Magazine, May 14)

Simple techniques to make plastic semi conductors more efficient
(Plastemart.com, May 14)

Silicon wafer shipments up 5% in 1Q10, says SEMI
(Digi Times, May 14)

TSMC revises budget for expansion
(Digi Times, May 14)

Samsung tipped to reveal $18 billion chip capex
(EE Times, May 14)

Nvidia CFO: Manufacturing Yield Problems Are 'easing'
(Yahoo! News, May 14)

The Worldwide Printed Electronics Market - 2010 Edition: Strategic Study on the Emerging Worldwide Market
(TMCnet.com, May 14)

A relationship to cherish
(Times Union, May 14)

DNA Could Replace Silicon to Create Cheap, Abundant Logic Circuits
(Inhabitat, May 12)

Intel: Full Speed Ahead to 22-nm and Beyond
(PCMag.com, May 12)

Moore's Law Continues at Intel
(Extreme Tech, May 12)

First Solar ranked first as PV module supplier
(EE Times India, May 12)

IQE's 6 Inch semiconductor wafers for making high efficiency solar PV cells
(EE Herald, May 12)

Time to Sell China?
(SeekingAlpha Media Stocks [Blog], May 12)

Samsung to invest $21 billion in green, health businesses
(EE Times Europe, May 12)

New materials for see-through electronics
(UCC, May 11)

Samsung will invest $21bn in future growth drivers, including solar cells
(PV Tech, May 11)

Toshiba to spend big on chips, nuclear power
(PhillyBurbs.com, May 11)

"JSR Joins SEMATECH s Resist Center at UAlbany NanoCollege"
(Nanotechnology Now, May 11)

Altatech Semiconductor Receives Second Equipment Order from Fraunhofer ENAS in Germany
(Sun Herald, May 11)

Samsung to Spend $20 Billion on Green Energy, Health
(Industry Week, May 11)

Graphene transistor could advance nanodevices
(PhysOrg.com, May 11)

Toshiba eyes 3D memory chips with new factory investment
(Network World, May 11)

Nano parfait a treat for scientists
(EurekAlert!, May 10)

Irish lab creates materials for see-through electronics
(Siliconrepublic.com, May 10)

TowerJazz Advances SiGe Technology
(SocalTech.com, May 10)

TSMC's chip sales hit all-time high
(Info World, May 10)

Freescale Enters GaAs MMIC Market with Four Devices Optimized for Base Station Equipment
(Consumer Electronics Net, May 10)

ASE said to acquire EEMS' two facilities amid robust market trend
(Ems Now, May 10)

Global PC Processor Q1 2010 Shipments Jump 39 Percent
(IT Channel Planet, May 07)

New Strategic Alliances Strengthen and Expand Software Solutions for Freescale Processors
(Share Cax, May 07)

NextOp comes out of stealth mode. Tackles assertion synthesis
(TechBites Blogs, May 07)

Europe pushes manufacture of printed power devices
(Plastic Electronics, May 07)

Spire Introduces Large Area Solar Simulator for Thin Film Modules
(Videobased Tutorials, May 07)

Semiconductor Industry Set For Highest Annual Growth in 10 Years
(Electronic Products, May 06)

More than 30% industry revenue growth expected in 2010, iSuppli reports
(EDN, May 06)

The Biggest Job Creator You Never Heard Of: The Patent Office
(Harvard Business Review Blog, May 06)

Intel Upgrades Atom, Targeting Smartphones
(Datamation: IT Management, May 06)

Lobby chief wants to open 'new chapter' for solar PV
(EurActiv (EN), Apr 22)

Zumtobel show concept studies on OLED lighting technology
(OLED-TV Display/Monitor Technology News_blog, Apr 22)

BASF creates advanced copper plating chemistry for integrated circuits
(Press Release Point, Apr 22)

New Thin Film Solar Cell Technology from Oregon State University
(Azocleantech, Apr 22)

Intersil Donates 100,000 Square-Foot Wafer Fabrication Facility to the University of Central Florida
(Nano Werk, Apr 22)

"Imec Technology Forum 2010"
(Nanotechnology Now, Apr 21)

X Prize Foundation Considers Clean Fuel Prize for Renewable Aviation Fuel Development
(Milling Journal Online, Apr 21)

SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness
(Business Wire, Apr 21)

Demand is growing for high-level, multidiscipline manufacturing engineers
(Diversity/Careers In Engineering & Information Technology, Apr 21)

German govt approves solar R&D subsidy
(Reuters Global Markets News, Apr 21)

Flight cancellations continue as Europes airports slowly reopen
(TMCnet.com, Apr 21)

TSMC Ships 600,000 0.25-Micron Automotive-Qualified Embedded Flash Wafers
(Forbes.com, Apr 21)

If you haven't got up to speed on memristors ...
(PC Perspective, Apr 19)

Next Generation iPad May Sport OLED Panel
(Topnews, Apr 19)

European Semiconductor Industry leading indicator Up in Feb
(Circuitree, Apr 19)

Synopsys HAPS-60 Rapid Prototyping Speeds SoC Design
(Chip Design, Apr 19)

Cardiff Takes A Step Towards Quantum Computing
(redOrbit, Apr 19)

LCD makers' outlook improves on strong TV demand
(International Business Times, Apr 19)

: "Changing the Channel in Nanoelectronics"
(Nanotechnology Now, Apr 19)

Copper Interconnect Explosion in 2009 Continuing into 2011
(Semiconductor Packaging News, Apr 19)

Applied Materials’ Singapore facility has 400 kWp solar system
(Renewable Energy Focus, Apr 16)

Sharp to Double LCD Panel Production Capacity at GREEN FRONT SAKAI
(DMN Newswire, Apr 16)

Copper interconnect explosion continues, says The Information Network
(Digitimes, Apr 16)

TSMC alarmed by rising inventory levels, say sources
(Digitimes, Apr 16)

S. Korea to invest 60 bln won to build up analog chip industry
(Scottrade, Apr 16)

Taiwan's ProMOS says to sell chip plant to Macronix
(Reuters Business News, Apr 16)

$1M for IO Semiconductor
(San Diego Union Tribune (AP), Apr 16)

Air Products Takes Hydrogen Message to the Streets in Fuel Cell Powered Chevy
(Forbes.com, Apr 14)

Standards Organizations Accellera and The SPIRIT Consortium Complete Merger
(Sys-Con, Apr 14)

Survival of the FIT-est: PV industry competition to intensify in 2010
(Pennenergy, Apr 14)

Enel Green Power’s Ingmar Wilhelm to head European Photovoltaic Industry
Association
(New Energy World Network, Apr 14)

TSMC to skip 22nm, moving directly to 20nm
(Buzz Tracker, Apr 14)

MRS Day 2: CVD for Cu, low-k etch stop, future FETs, graphene "atom hopping"
(Solid State Technology, Apr 14)

Applied sets up 32,000m² Singapore IC equipment hub
(EE Times India, Apr 14)

PE Companies are Optimistic About the State of the Industry
(Printed Electronics Now, Apr 14)

Applied Materials Opens Global Hub in Singapore for Manufacturing Semiconductor Equipment
(Business Wire, Apr 13)

China sets on-grid tariff for utility solar plants as Chinese solar stock prices jump
(New Energy World Network, Apr 13)

Printed Displays offer New World of Design Opportunities
(Wireless Design & Development, Apr 13)

Intel to produce new Sandy Bridge chips by year-end
(Computerworld, Apr 13)

Taiwan's Au to acquire China LCD plant - sources
(Reuters Stocks, Apr 13)

China's Solar Firms Get A Boost
(Solar Plaza, Apr 13)

Leti Steps Toward Terabit Optical Links
(Semiconductor International, Apr 12)

SEMATECH Litho Forum to focus on economic challenges facing the future of semiconductor lithography
(Nano Werk, Apr 12)

LED fabs take the stage
(EE Times India, Apr 12)

Taiwan government forms CIGS industry alliance
(Semiconductor Today, Apr 12)

Cree Announces Revolutionary New LED Platform Delivering 160 Lumens per Watt
(MSN Money, Apr 12)

Wireless Nanosensors Could Save Bridges, Buildings
(redOrbit, Apr 09)

Most Viewed Stories for Week of April 5, 2010
(Semiconductor International, Apr 09)

Avoiding Sun Burn: Rooftop Solar Panel Safety Tests
(Scientific American, Apr 09)

Wake Forest University Patents Plastic Fiber PV
(Cooler Planet, Apr 09)

SUMCO offers silicon wafer fab in Ohio for sale
(Fabtech, Apr 08)

"Understanding tiny reactions"
(Nanotechnology Now, Apr 08)

LED industry entering fast growth stage in 2010
(Semiconductor Today, Apr 08)

Indian Government to Offer 30% Solar Subsidies, Could Increase to 50%
(Solar Plaza, Apr 08)

Updated Materials Declaration Standard Addresses Revolving Door of Environmental Regulation Changes
(Solid State Technology, Apr 07)

Taiwan government forms CIGS industry alliance
(Digital Times (Eng), Apr 07)

Grace enhances design services to customized embedded flash macros
(Digital Times (Eng), Apr 07)

NREL Finds a Way to Give LEDs the Green Light
(SustainableBusiness.com, Apr 06)

Chip sales slip in Feb., but prospects still bright
(Solid State Technology, Apr 05)

Berkeley researchers light up white OLEDs
(Nano Werk, Apr 05)

Global Semiconductor Sales Up 56 Percent
(Manufacturing.net, Apr 05)

European THERMINATOR Project Warms Efforts to Cool Semiconductor Design Solutions
(Power Pulse, Apr 05)

Sales of Optoelectronics, Sensors, and Discretes to Hit Record
(Semiconductor International, Apr 05)

Toshiba, others invest $20M in flash memory array maker Violin
(Computerworld, Apr 02)

Paving the road: CTM Group's c-Si goals
(Solid State Technology, Apr 02)

Toshiba to Test Sub-25-nm NAND Flash
(PC Mag, Apr 02)

Configure or customize: a persistent issue for the IP industry
(Practical Chip Design (blog), Apr 02)

Cleantech Venture Investments Reach $1.9B in 1Q
(SustainableBusiness.com, Apr 02)

Toshiba gears up for 25nm flash memory
(Electronista, Apr 02)

Plastic electronics could slash the cost of solar panels
(R & D Magazine, Apr 02)

Verbatim entry into OLED lighting market at Light + Building 2010
(OLED-TV Display/Monitor Technology News_blog, Apr 02)

U.S. manufacturers need policy support in competition with China
(Solar Plaza, Apr 02)

Global OLED Revenue Increased to 35% in 2009
(OLED-TV Display/Monitor Technology News_blog, Apr 02)

NIST scientists address 'wrinkles' in transparent film development
(R & D Magazine, Apr 01)

A world MEMS database with more than 350 companies!
(Semiconductor Packaging News, Apr 01)

DisplaySearch: OLED revenues reached $826 million in 2009
(OLED-Info, Apr 01)

No one is satisfied with the planned revision of the German Renewable Energy Law – but the time to make changes is running out
(Photon Laboratory, Apr 01)

Applied Materials raises 2010 revenue outlook
(MSN Money, Mar 30)

UPDATE 1-Toshiba to sell LCD plant in Singapore - Nikkei
(Reuters Global Markets News, Mar 30)

IDTechEx Releases Report on Printed, Organic, and Flexible Electronics
(Solid State Technology, Mar 30)

Taiwanese Chipmakers Less Competitive against Rivals: Report:
(Scottrade, Mar 30)

Intel stays atop chip market but Samsung gains in tough 2009
(Network World, Mar 29)

SRC, UNT to Establish Center on Semiconductor Manufacturing
(Business Leader Triangle Edition, Mar 29)

The Future of Thin Film: Beyond the Hype
(Greentech Media, Mar 29)

Applied Materials Enables Defect Inspection at 22nm and Below with New UVision 4 System
(Business Wire EON, Mar 29)

Southern Taiwan Science Park to Create 6,000 New Jobs This Year
(Ems Now, Mar 29)

Intel solar spin-off raises $41.4 million
(EE Times Europe, Mar 29)

Legislature needs to understand why a solar company chose Oregon
(North Bay Business Journal, Mar 29)

Semiconductor firm NXP planning IPO -source
(Reuters Global Markets News, Mar 26)

Most Viewed Stories for Week of March 22, 2010
(Semiconductor International, Mar 26)

Emerging MEMS: Technologies & Markets, 2010 Report
(Semiconductor Packaging News, Mar 26)

Bosch opens billion-dollar wafer fab
(EE Times, Mar 26)

SMIC asks TI to take over fab management, says report
(EE Times, Mar 26)

Rush for Solar Gold
(Pennenergy, Mar 25)

Semiconductor Industry at Most Profitable Level in a Decade
(Electronic Products, Mar 25)

SEMI PV group Announces Formation of CTM Group
(Circuitree, Mar 25)

China takes lead on clean energy
(Chicago Tribune, Mar 25)

: "New spintronics material could help usher in next generation of microelectronics"
(Nanotechnology Now, Mar 25)

HP Demos Rollup Flexible Displays (w/ Video)
(PhysOrg.com, Mar 25)

Applied Materials Breakthrough Predictive Scheduling System Boosts Lithography Efficiency
(Nano Werk, Mar 25)

OEM Semiconductor Spend to Rise 13 Percent in 2010
(Electronic Products, Mar 25)

New wafer technology points towards realization of diamond electronic devices
(Nano Werk, Mar 25)

Taiwan Semi Plans to Add 130 Workers by End 2010 at LED Plant
(Business Week, Mar 25)

UMC says soon to apply for acquisition of China-based Hejian
(Digital Times (Eng), Mar 25)

Chip Companies Must Dig Deep for 450 mm
(Semiconductor International, Mar 24)

CIE-Taiwan as platform for Taiwan-based LED makers' international cooperation
(Digital Times (Eng), Mar 24)

Light Twists Rigid Structures In Unexpected Nanotech Finding
(Photonics Online, Mar 24)

Intel Spinout SpectraWatt Snags $41.4M for Solar Cell Plant
(Solar Plaza, Mar 24)

Time to go labless for new product ramp-up
(Solid State Technology, Mar 23)

New Chinese Polysilicon Production Plant Uses Advanced Process Technology & Equipment From Poly Plant Project, Inc.
(SYS-CON India, Mar 23)

An oil giant looks to the sun
(Pennenergy, Mar 23)

Chip companies pursue a bestseller
(EDN, Mar 23)

TSMC's Chang Forecasts Brighter 2010 Semiconductor Market
(Ems Now, Mar 23)

Are Semiconductor Valuations Peaking?
(Seeking Alpha, Mar 23)

IMAPS Experts Debate 3-D Cost Challenges
(Semiconductor International, Mar 22)

KOREA: LG gunning for Samsung's LCD market leadership
(What Hi Fi? Sound and Vision, Mar 22)

DOE Releases New Report on Benefits of Recovery Act for Small Businesses in Clean Energy, Environmental Management Sectors
(Media Newswire, Mar 22)

Applied Materials expands Taiwanese solar manufacturing
(Renewable Energy Focus, Mar 22)

Robots on the Advance
(Glass on Web, Mar 22)

North American Semiconductor Equipment Industry Posts February 2010 Book-to-Bill Ratio of 1.22
(Press Release Point, Mar 22)

Nanowire advances promise improved light-emitting diodes and solar-energy generation
(Nano Werk, Mar 22)

N. Amer. Semiconductor Equipment Industry Posts Feb Book-to-Bill Ratio of 1.22
(Circuitree, Mar 19)

Chip industry to grow 7% in 2011, predicts TSMC chairman
(Buzz Tracker, Mar 19)

Bosch opens eight-inch fab
(EDN, Mar 18)

SEMI reports 09 Global Semiconductor Materials Sales of $34.6B
(Circuitree, Mar 18)

General Electric To Take On First Solar
(Greentech Media, Mar 18)

Nanotechnology RFID tags could replace bar codes
(Nano Werk, Mar 18)

The PV industry's black swan
(Solid State Technology, Mar 18)

Alcoa and NREL Testing New Innovative Concentrating Solar Power System
(Business Wire, Mar 18)

Biden to visit NC manufacturer of semiconductors
(yahoo! 7 Finance, Mar 17)

Intermolecular’s PV Development: R&D in Hyper-Drive
(Greentech Media, Mar 17)

Teen wins $100,000 Intel science award
(Cnet News.com, Mar 17)

GlobalFoundries produces zero defect wafers, 100% yield
(Bright Side of News, Mar 17)

On-Chip Routers Could be a Choke Point for Future Chips
(CR4, Mar 17)

Dowa presents 320–350nm UV LED samples
(Semiconductor Today, Mar 17)

MIT building self-assembling computer chips
(Haaze.com, Mar 17)

Intel unveils 32nm, second gen, high-k metal gate data center MPUs
(EDN, Mar 16)

Recovery slows in electronics supply chain
(EDN, Mar 16)

GlobalFoundries, TSMC Square Off at DATE
(Semiconductor International, Mar 16)

What Lies Beneath
(Air & Space, Mar 15)

Applied Materials ups lobbying effort on energy
(Yahoo! Finance US, Mar 15)

Elcoteq to provide services to Philips' lighting ops
(TMCnet.com, Mar 15)

Taiwan LCD Giant Plans Big China Factory as Rules Ease
(PCWorld, Mar 15)

GlobalFoundries' plans for 2010 capex of $2.5 billion
(EE Times, Mar 12)

Applied expands Taiwan flat panel, solar manufacturing facility
(EDN, Mar 11)

SEMI Reports 2009 Global Semiconductor Equipment Sales Of $15.92 Billion
(ELFA, Mar 11)

RFID Wristbands designed for integrated into various applications
(EDN, Mar 11)

Global semiconductor equipment sales down 46% in 2009, says SEMI
(Digital Times (Eng), Mar 11)

Imec and Synopsys Collaborate on 3D Stacked IC Development
(Nano Werk, Mar 09)

Nintendo Surpasses Samsung as Top Consumer and Wireless MEMS Buyer
(Global SMT & Packaging, Mar 09)

Novel material paves the way for next-generation information technology
(PhysOrg.com, Mar 09)

Industry experts meet to tackle MEMS fabrication, integration challenges
(Semiconductor Packaging News, Mar 08)

Baolab Claims CMOS MEMS Breakthrough
(Semiconductor International, Mar 08)

PV feed-in tariff levels in Germany are set to decrease up to 25 percent by mid-2010 as the government obviously accepts stronger growth – still without caps
(Photon Laboratory, Mar 08)

Report: U.S. must preserve "clean energy" manufacturing jobs
(Pennenergy, Mar 05)

Most Viewed Stories for Week of March 1, 2010
(Semiconductor International, Mar 05)

2010 chip revenues to top pre-recession levels: iSuppli
(Reuters Technology News, Mar 05)

Quake is Minor Disruption at TSMC, UMC
(Semiconductor International, Mar 05)

Analysis of the US$480 Million World Market for Chemical Mechanical Planarization (CMP) Equipment
(TMCnet.com, Mar 05)

A quantum leap for lighting
(World Business Council for Sustainable Development, Mar 05)

UMC to step up hiring for 12-inch fab expansion
(Digital Times (Eng), Mar 05)

IBM Nanophotonic Switch Promises Faster Energy-Efficient Computing
(Semiconductor International, Mar 04)

Air Products Named to 100 Best Corp. Citizens List for 2010
(MarketWatch, Mar 04)

Taiwan dumps memory chip rescue plan
(Computerworld, Mar 04)

UMC To Hire 1,000 Engineers For Southern Taiwan Plant Expansion
(Morningstar, Mar 04)

IBM aims to replace copper chip interconnects with light
(Network World, Mar 04)

LED Shortage Flares Up in 2010
(Wireless Design & Development, Mar 03)

iSuppli Says LCD Panel Suppliers Struggling
(Twice, Mar 03)

Trapping sunlight with silicon nanowires
(Nano Werk, Mar 03)

LED Shortage Flares Up in 2010
(Wireless Design & Development, Mar 03)

iSuppli Says LCD Panel Suppliers Struggling
(Twice, Mar 03)

Trapping sunlight with silicon nanowires
(Nano Werk, Mar 03)

Intel Honors 16 Companies with Preferred Quality Supplier Award
(Intel, Mar 03)

Planned $20M LED manfacturing plant to create 100 jobs
(MSN Money, Mar 03)

Semiconductor Research Corporation and Researchers from Arizona Universities Develop Sensor to Drastically Cut Water Usage During Chip Making Process
(Benzinga, Mar 03)

U.K. Solar Industry May Grow 50-Fold, Create Jobs, Sharp Says
(Solar Plaza, Mar 03)

Single Photons Step Into The Slow Light
(Photonics Online, Mar 02)

Scatterometry – Measuring Ever-Smaller Chip Production
(Embedded Technology, Mar 02)

Graphene Hybrid: One-Atom-Thick Sheet Offers New Microelectronic Possibilities
(Science Daily, Mar 01)

A Second Chance For Novel Solar
(Forbes.com, Mar 01)

TSMC Facing EUV, Wafer Cost Challenges
(Semiconductor International, Mar 01)

Mitsubishi Electric to ramp up PV solar cell production
(EE Herald, Mar 01)

LDK Solar acquires Best Solar’s crystalline module manufacturing plant
(PV Tech, Mar 01)

Burn-in and Test Socket (BiTS) Workshop Preview
(Solid State Technology, Feb 26)

UPDATE 1-Global chip revenue to rise 20 pct in 2010-Gartner
(Reuters Global Markets News, Feb 24)

Printed Electronics Technology: Back to Basics
(Electronic Products, Feb 24)

IC Insights: Top 10 to Spend Aggressively in 2010
(Semiconductor International, Feb 24)

EuPD Research warns against using solar pricing to calculate German feed-in tariff cuts
(PV Tech, Feb 24)

Singapore's research institute ties up with consortium to boost wafer manufacturing
(Scottrade, Feb 24)

IBM says litho chemical better for environment
(EE Times, Feb 23)

Intel-led alliance pledges $3.5B in venture funds
(EE Times, Feb 23)

Japan Chip Gear Book-to-Bill Ratio Jumps in Jan 2010, Says SEAJ
(Circuitree, Feb 23)

TSMC to install equipment at LED R&D center in 4Q10, say sources
(Digital Times (Eng), Feb 23)

SEMI posts January 2010 book-to-bill ratio of 1.20
(Ems Now, Feb 23)

Applied Sees 50% Growth in 2010
(Yahoo! Finance US, Feb 22)

Infineon Seeks to Block U.S. Chip Imports by Elpida (Update1)
(Business Week, Feb 22)

Intel Sees Immersion Extending to 11 nm
(Semiconductor International, Feb 22)

Applied Materials Hosts Forum to Explore High-Productivity Next-Generation Lithography
(Nano Werk, Feb 22)

Junctionless transistor could simplify chip making, say researchers
(Power Management Europe, Feb 22)

SPIE: TSMC jumps on EUV bandwagon
(EE Times, Feb 22)

North America chip equipment orders top US$1 billion in January 2010, says SEMI
(Digital Times (Eng), Feb 22)

Setting the record straight on 450mm vs. 300mm
(Solid State Technology, Feb 19)

KLA-Tencor introduces Prolith X3.1 virtual lithography tool
(Semiconductor Today, Feb 19)

UPDATE 1-North American Jan chip-gear orders rise 24.1 pct
(Global Markets News, Feb 18)

Ceramics for Solar Cells and OLEDs
(Greentech Media, Feb 18)

DRAM Chip Sales Worldwide Seen Jumping 40% In 2010 - ISuppli
(NASDAQ.com, Feb 18)

Electrons on the brink: Fractal patterns may be key to semiconductor magnetism
(Labspaces, Feb 18)

SEMATECH kicks off consortium at UAlbany NanoCollege to develop crucial EUV metrology tools
(Nano Werk, Feb 18)

Semiconductors: Applied Materials vs. Novellus
(Seeking Alpha, Feb 18)

Chip Makers See Big Ramp Up in LTE Activity
(TechNews.AM, Feb 17)

Hana may hire 1,000 in $30m expansion drive: Lamphun plant near full capacity [Thailand]
(TMCnet.com, Feb 17)

China Solar Power Announces Third Thin-Film Plant
(SustainableBusiness.com, Feb 17)

"A new way to build membranes for fuel cells"
(Nanotechnology Now, Feb 17)

Chip Makers See Big Ramp Up in LTE Activity, Heavy Reading Reports
(PR Newswire, Feb 17)

Altair Semiconductor and LitePoint Showcase Advanced LTE Data Card With High-Volume Test at Mobile World Congress
(PR Newswire, Feb 15)

The economic realities of 450mm
(Solid State Technology, Feb 12)

Molecule created with promising semiconductor properties
(R & D Magazine, Feb 12)

Intel Capital and China Investment Corporation Announce Collaboration Agreement
(Business Wire, Feb 12)

Associations Call for Stronger RES
(The Bioenergy Site, Feb 12)

DOE honors top R&D achievements in solid-state lighting
(Fmlink, Feb 12)

Thin-Film Solar Investment Dries Up
(Greentech Media, Feb 09)

Electrons On The Brink
(Product Design & Development, Feb 09)
Mitsubishi Chemical to Produce OLEDs, Partner with Pioneer
(Chemical Week, Feb 09)

Moore’s Law: The Future of Cloud Computing from the Bottom Up
(Sys-Con, Feb 09)

Spire Ranked 9th Fastest-Growing Public Company in Massachusetts
(MSN Money, Feb 09)

Spinning kilometers-long, multi-layered carbon nanotube yarns
(Nano Werk, Feb 09)

Group Opposing 450 mm N.Y. Subsidy
(Semiconductor International, Feb 08)

ISSCC: Toshiba, Unity claim breakthroughs
(EE Times, Feb 08)

Electrons on the brink: Fractal patterns may be key to semiconductor magnetism
(Nano TechWire, Feb 08)

The Remaking of U.S. Manufacturing
(Seeking Alpha, Feb 08)

An analyst's 10 reasons to be cheerful
(EE Times, Feb 08)

Princeton scientist makes a leap in quantum computing
(Princeton University, Feb 05)

Technology CEO Council Calls on Congress to Act on National Export Initiative and Competitiveness
Package
(MSN Money, Feb 05)

In Tübingen, a Near-Field Microscope Yields High Precision Optical Images of an Organic Semiconductor with 17 nm Resolution: Millionfold luminescence enhancement obtained at molecular edges
(Alpha Galileo, Feb 05)

By Led Liberated
(Tehelka, Feb 05)

Scientists demonstrate world's first germanium laser
(TMCnet.com, Feb 05)

Putin and Chubais discuss nanotechnology
(Nano Werk, Feb 05)

Chip Makers Samsung, Hynix Face EU Antitrust Charges - CNBC
(CNBC, Feb 04)

Intel Paper to Reveal Reconfigurable Logic
(Yahoo! News, Feb 03)

India badly needs a semicon fab: ISRO ex-chief
(Cyber India Online, Feb 03)

Applied execs leaked Samsung process details to Hynix, say reports
(EE Times, Feb 03)

Karnataka Drafts Semiconductor Policy
(Channel Times, Feb 03)

PV Suppliers: Low Operating Costs Preventing Mergers
(Seeking Alpha, Feb 03)

Renesas Expands Back-End Process Plant in Beijing by Adding
(Gas.com, Feb 03)

Performance chemicals in solar cell manufacturing
(Solid State Technology, Feb 01)

Remaking The Design Landscape
(Chip Design Blogs, Jan 28)

Latest and greatest in printed circuits and printed electronics (28 Jan 2010)
(TechBites Blogs, Jan 28)

Carpet of Boron Nanotubes Could Lead to New Generation of Nano-scale Electronics
(CleanTechnica.com, Jan 28)

Successful 2010 CES sets optimistic tone for industry
(Global SMT & Packaging, Jan 28)

TSMC Profit Hits 2 Year High, Signals Great Year for Chips
(PCWorld, Jan 28)

JAPAN'S SHARP, OTHERS JOINTLY DEVELOP BENDABLE LCD
(Zibb, Jan 28)

Chips: Microprocessor market stages a comeback
(Individual.com, Jan 27)

Confluence Solar to begin construction of $200 million silicon ingot plant in Tennessee
(South Central Construction, Jan 25)

Survey shows concerns over copper usage in semiconductor packaging
(Nano Werk, Jan 25)

Soaring FPD Demand in China Alters Traditional FPD Seasonality
(Asia - IP Communications, Jan 25)

Chip equipment market set to rebound | Business Tech - CNET News
(Cnet News.com, Jan 25)

Grace, HHNEC begin building joint wafer fab, say reports
(EE Times, Jan 25)

Gartner fears thin film solar fallout from German feed-in tariff changes
(PV Tech, Jan 25)

ATIC Looking for Full Control of Globalfoundries
(eWeek, Jan 21)

UPDATE 1-Rambus trial vs chipmakers faces another delay
(Reuters India, Jan 21)

German ministers reach consensus on solar tariff cuts
(Environmental Finance, Jan 21)

TSMC Says 40nm Problems Resolved, Preparing 28nm Fab Production
(Daily Tech, Jan 21)

Mainland China to Buy USD5.3bn LCD Panels From Taiwan
(TMCnet.com, Jan 21)

DuPont Completes $295 Million Expansion for Photovoltaic Market
(PR-USA.net, Jan 19)

AMD becomes number-two fabless chip firm
(The Tech Report, Jan 19)

TSMC moves fab builds, expansions ahead to meet ‘urgent increases in customer demand’
(Electronics Design Stategy News, Jan 19)

STMicroelectronics Joins CEA-Leti IMAGINE Program to Develop Multiple E-Beam Lithography
(Business Wire EON, Jan 18)

21-Megawatt Solar Power Plant Opens in California
(Solar Plaza, Jan 18)

Shares of chip-tools makers tumble
(MarketWatch, Jan 15)

Deep Solar Science at Stanford
(Greentech Media, Jan 15)

China to establish an OLED industrial base in Guangdong province
(OLED-Info, Jan 15)

SIA Hails Guilty Plea in Chip Counterfeiting Case
(Cloud Computing Journal (Sys-Con), Jan 14)

TSMC Hiring Over 3,000 People This Year, Engineers in Demand
(PCWorld, Jan 14)

Silicon wafer quotes to rise on tight supply
(Digital Times (Eng), Jan 14)

Technology Predictions 2010
(Truth to Power, Jan 14)

iSuppli Ranks InvenSense' as Top MEMS Company and Consumer Gyroscope Supplier for 2009
(Consumer Electronics Net, Jan 13)

X-Fab adds Semprius' chip printing to foundry lineup
(Solid State Technology, Jan 13)

MEMC Electronic Materials Inc.: Solar Powered
(Silobreaker, Jan 08)

Qualcomm Leapfrogs Intel With 28-Nano Chips
(GigaOM, Jan 08)

Solar Start-Up Bloodbath 2010
(Greentech Media, Jan 08)

New NanoMarkets Report Pegs OLED Materials Sales at $2.9 Billion by 2015
(PR-USA.net, Jan 08)

Taiwan to decide on chip, LCD China investments soon
(CNBC, Jan 08)

India and Japan to jointly develop Solar City
(CarbonYatra.com, Jan 07)

GlobalFoundries Adds Qualcomm, Supports Gate-First Technology at 28 nm Generation
(Semiconductor International, Jan 07)

Intel rolls out new chips based on 32-nm process
(TD Ameritrade, Jan 07)

SEMI Offers Wildly Optimistic Forecast For Semi Equipment Sector
(IStock Analyst, Jan 07)

MEMS, sensors, and nanotechnology
(Electronics Design Stategy News, Jan 07)

"Growing Europe s nanowires"
(Nanotechnology Now, Jan 06)

Thoughts on the PE Market in 2010
(Printed Electronics Now, Jan 06)

Light-generating transistors to power labs on chips
(Printed Electronics World, Jan 05)

Chip inventories set to remain lean in 1Q10, says iSuppli
(Digital Times (Eng), Jan 05)

Semiconductor International's Top 100 for 2009
(Semiconductor International, Jan 05)

SIA reports November brought semiconductor sales back into ‘positive territory’
(Electronics Design Strategy News, Jan 04)

Sharp in solar panel JV with Enel, STMicroelectronics
(Green Tmcnet.com, Jan 04)

Light-generating transistors to power labs on chips
(Nano Werk, Jan 04)

LEDs Magazine - Carbon Trust backs organic LED lighting technology that promises major carbon cuts
(LEDs Magazine, Jan 04)

Consolidation Runs Rampant in the North American Semiconductor ATE Markets (Frost & Sullivan) (PR Newswire, Jan 04)

Richtek sues graphics chip makers
(Silobreaker, Jan 01)

Scientists Develop Silver Ink to Print Plastic Circuits
(PCI, Dec 31)

The Year Past and Year Ahead in Chips
(AtNewYork.com, Dec 31)

Lessons from a New Industry Cluster in India
(Business Week, Dec 30)

Overview: China's FAI in electronics and information industry slows, Jan.-Nov.
(IStock Analyst, Dec 30)

Market Directions: 2010
(Pennenergy, Dec 30)

SMIC Wuhan fab to expand foundry services
(Digital Times (Eng), Dec 30)

Solar Could Generate 15% of Power by 2020, If US Ends Fossil Fuel Subsidies
(Current, Dec 29)

Taiwanese solar cell maker to buy GE Energy plant
(EE Times, Dec 29)

Germany launches national OLED research project
(EE Times, Dec 29)

Brewer Science, SWeNT funded for CNT inks
(Solid State Technology, Dec 23)

Despite Downturn, 3-D Spending Continues
(Semiconductor International, Dec 23)

"Glitter-sized solar photovoltaics produce competitive results"
(Nanotechnology Now, Dec 23)

Printed electronics to control flexible displays
(1888 Press Release, Dec 23)

Sensor Can Detect Single Nanoparticle & Take Its Measurement
(Product Design & Development, Dec 22)

SAMSUNG Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package
(Managing Automation, Dec 22)

Infineon starts CoSiP project in Germany'
(TMCnet.com, Dec 22)

First Solar becomes first PV Company to produce 1GW in a single year
(Your Industry News, Dec 22)

What you can expect from Printed Electronics in 2010
(Global SMT & Packaging, Dec 22)

LG Starts Solar Cell Production
(TechNews.AM, Dec 22)

Hitachi High-Tech, Renesas Enter Absorption-type Company Split Deal Regarding Transfer Of Semiconductor Manufacturing Business
(RTTNews, Dec 22)

China to aid recovery of semiconductor industry: KPMG study
(Silobreaker, Dec 22)

Oled shipments explode in q309, bringing in more than $250m in revenues... (Cellular News via TechNews AM)
(Silobreaker, Dec 21)

South Korea injects $50M in IC manufacturing
(Silobreaker, Dec 21)

Executives From Q-Cells, Suntech Join SEMI Board
(Circuitree, Dec 21)

Gartner: 2009 a dismal year for the worldwide chip industry
(Computerworld, Dec 17)

LED-backlit TV shipments to reach 26 million in 2010, says Displaybank
(Silobreaker, Dec 17)

US sues Intel, accuses chipmaker of stifling competition
(Yahoo! News, Dec 16)

STMicroelectronics Unveils High-Performance System-on-Chip for Next Generation of Integrated Broadcast and Broadband-Internet Digital TVs
(Downloads Portal, Dec 16)

First Solar: 1 billion watts served
(CNET News.com, Dec 16)

European semiconductor industry leading indicator up in October
(Global SMT & Packaging, Dec 16)

PV Group Holds Industry Symposium on China Trade Frictions
(EMasia Electronics Manufacturing, Dec 16)

Tense atmosphere clouds climate talks
(Forbes, Dec 14)

Feed-in tariffs critical for new affordable clean energy policy
(eXaminer.com, Dec 14)

MEMS Industry Group Ends Year on High Note
(United press international, Dec 14)

BRIEF-ON Semiconductor to buy California Micro Devices for $108 mln
(CNBC, Dec 14)

Business struggles to sway U.N. climate talks
(Forbes, Dec 11)

Utilities to drive solar PV in United States
(Renewable Energy Focus, Dec 11)

Soitec bursts into solar sector
(Solid State Technology, Dec 11)

$5.3 billion for North African Solar Plants
(The Bioenergy Site, Dec 11)

Applied Materials eyes Semitool
(Investors.com, Dec 11)

The Changing Face of the Indian Subcontinent
(Pennenergy, Dec 10)

Tech Firms Complain About New Chinese Procurement Rules
(PCWorld, Dec 10)

Taiwan's Chi Mei to plead guilty to price fixing
(Forbes Asia, Dec 09)

Applied Material's solar exec sees sector recovery
(Reuters India, Dec 09)

TSMC buys into Motech
(PV Tech, Dec 09)

IEDM: MEMS enables powerless curved retinal implant
(EE Times, Dec 09)

Photovoltaics with a capital »P« – the European perspective
(Photon Laboratory, Dec 09)

Intel cancels plan to release graphics chip
(The Wall Street Journal [US Edition], Dec 07)

Semiconductor development `opens up smaller and faster electronics`
(Silobreaker, Dec 07)

Air Products Receives 'Supplier Excellence Award' from TSMC
(Forbes, Dec 07)

Arm, Qualcomm invest $10M in chip startup Arteris
(Info World, Dec 07)

Taiwan LCD TV panel shipments to Samsung to total 10-12 million in 2009
(Silobreaker, Dec 07)

SRC and Stanford Demonstrate Advance to Extend Life of Cost-Effective Semiconductor Manufacturing
(Sys-Con Belgium, Dec 07)

Taiwan government to spend $65 million to support electronic-book industry
(WNEP ABC-16, Dec 04)

MEMS Breakthroughs In Energy Markets
(Product Design & Development, Dec 04)

5 Reasons For Change
(Chip Design Blogs, Dec 04)

"Entangled Photons from Quantum Dots"
(Nanotechnology Now, Dec 04)

LED Backlights Breathe New Life Into Monitor Market
(PCB007, Dec 04)

First Boron-Nitride Nanotube Yarn
(redOrbit, Dec 03)

Tokyo Electron Joins SEMATECH's Front End Processes Program at UAlbany NanoCollege
(Nano Werk, Dec 03)

Good policy, and bad
(Economist, Dec 03)

Race to EUVL Still Depends on Photons
(Semiconductor International, Dec 02)

AU Optronics to Establish Manufacturing Plant in Slovak Republic to Provide Just-in-Time Services to European Customers
(DigitalSignageUniverse.com, Dec 02)

EU Clears Japanese Chip Cos Renesas,NEC Electronics To Merge
(Morningstar, Dec 02)

Applied's Astra Enters Millisecond Anneal Market
(Semiconductor International, Dec 01)

Soitec, CEA-Leti to Join Forces to Speed Commercial Adoption of 3D Integration
(Circuitree, Dec 01)

Nokia sues top LCD, CRT display makers
(Forbes Asia, Dec 01)

Applied Materials' Smart Emissions Control Solution Cuts Energy Use, Cost in Semiconductor Fabs

Teijin develops world's first silicon-on-plastic integration technology for solar cells and LCD TFT
(domain-b.com, Nov 27)

Europe suffers photovoltaic slowdown, says analyst
(Silobreaker, Nov 27)

Water droplets direct self-assembly process in thin-film materials(16)
(R & D Magazine, Nov 25)

Man pleads guilty to selling fake chips to U.S. Navy
(Network World, Nov 25)

Secretary Chu Announces $620 Million for Smart Grid Demonstration and Energy Storage Projects
(TMCnet.com, Nov 25)

Selling Chip Makers On Optical Computing
(Semiconductor Online, Nov 25)

India Plans Solar Power Boost
(Official Wire, Nov 25)

Foundries Still Face Challenges Despite Strong Fourth-Quarter Revenue Surge
(TMCnet.com, Nov 25)

3D News: Applied/Semitool, TSMC, Ziptronix
(Silobreaker, Nov 25)

DuPont bets on bright future for solar sales
(Reuters India, Nov 24)

TI introduces the industry's smallest sine-to-sine wave clock buffer
(RCR Wireless: Stock Watch, Nov 24)

Samsung and MediaTek shine amid chip market decline in 2009, says iSuppli
(Digital Times (Eng), Nov 24)

AUO teams up with Germany's Abakus to tap market for solar energy
(Silobreaker, Nov 24)

International research project launched on tailored supply chain of carbon nanotube composites
(Nano Werk, Nov 23)

Toshiba forms LSI joint venture in China
(American Chronicle, Nov 23)

Mai-Liao Power To Offer $200 Million Loan To Micron Technology Unit
(CNNMoney, Nov 23)

Intel's Cedarview 32nm Atom Due 2011
(TechBlogPlus, Nov 23)

India approves $922m for solar plan in bid to boost PV capacity
(BusinessGreen.com, Nov 23)

Good news in chip tool demand -- with a caveat
(Solid State Technology, Nov 20)

How to implement "management of change" for PV manufacturing
(Solid State Technology, Nov 20)

Samsung debuts world?s thinnest multi-die package
(Solid State Technology, Nov 20)

LED lighting approaching tipping point
(Semiconductor Today, Nov 20)

Update 1-Interview-Consolidation to hit solar in 2010-BP Solar
(Reuters India, Nov 19)

Making E-beam direct write faster
(Solid State Technology, Nov 19)

North American Semiconductor Equipment Industry Posts October 2009 Book-to-Bill Ratio of 1.10
(Business Exchange, Nov 19)

Semiconductor Plastic Packaging Materials Market to Reach $20.1 Billion by 2013
(Press Release Point, Nov 19)

STMicroelectronics Leads Drive to Better LED Signage for High-Resolution Viewing
(Smart Brief, Nov 19)

TSMC able to take seat on SMIC board, say state-run China media
(Silobreaker, Nov 19)

ASML sees decent margins at current price level
(Reuters Markets, Nov 19)

Japan Oct chip gear book-to-bill ratio at 1.28
(Forbes, Nov 19)

LILi: a new German-funded project to develop large-area efficient OLED Lighting manufacturing
(OLED-Info, Nov 17)

LED Backlight Shipments Skyrocket as CCFLs and EEFLs Lose Ground
(Asia - IP Communications, Nov 17)

UPDATE: Applied Materials To Buy Semitool For $364 Million
(NASDAQ.com, Nov 17)

U.S. vs. China: Working Together on Global Warming?
(Time Magazine CNN, Nov 17)

Toshiba develops photoresist for 20nm EUV lithography
(Digital Times (Eng), Nov 17)

LED Backlight Shipments Skyrocket as CCFLs and EEFLs Lose Ground
(Asia - IP Communications, Nov 17)

UPDATE: Applied Materials To Buy Semitool For $364 Million
(NASDAQ.com, Nov 17)

U.S. vs. China: Working Together on Global Warming?
(Time Magazine CNN, Nov 17)

Toshiba develops photoresist for 20nm EUV lithography
(Digital Times (Eng), Nov 17)

Suntech hopes Arizona plant to ease US job worries
(Reuters Business News, Nov 16)

Here Comes China’s $3B, ‘Golden Sun’ Projects
(Greentech Media, Nov 16)

Semiconductor revenue to rebound in 2010 after smaller-than-expected 2009 decline
(Electronics Design Stategy News, Nov 16)

Intel-AMD settlement's a sign that rivals need each other
(MarketWatch, Nov 16)

Building a More Versatile Laser
(CR4, Nov 16)

Hon Hai makes LED next consolidation target
(Silobreaker, Nov 16)

U.S. Dept. Of Energy to Fund Innovative OLED Lighting Developed by DuPont
(U.S. Tech, Nov 16)

More Conslidation for Taiwan's LCD Panelmakers
(News Cred, Nov 16)

Chip Consortium To Develop High-Security ID Cards
(Electronic Design, Nov 16)

US to boost solar manufacturing with tax credits
(Environmental Finance, Nov 12)

Konica Minolta eyes $1 bln in OLED lighting sales
(Forbes Asia, Nov 12)

Red figures, job cuts in Germany's PV industry
(EE Times Europe, Nov 12)

South Korean firm withdraws offer for chipmaker Hynix
(M&C, Nov 12)

Aerospace Cluster Al Ain gears up to launch $1b world-class aerospace cluster
(TMCnet.com, Nov 12)

Intel to Pay AMD $1.25 Billion in Antitrust Case
(Industry Week, Nov 12)

Targeting tiny contacts
(Nano Werk, Nov 11)

Taiwan lawmakers reject funds for memory chip makers
(Information Technology World, Nov 11)

iSuppli says thin-film will take over market share in 2013
(PV Tech, Nov 11)

Lawsuit settlement seen as boon for semiconductor industry
(Silobreaker, Nov 11)

Photovoltaic devices power up with plastics
(European Plastics News, Nov 11)

Researchers overcome barrier for organic electronics
(Nano Werk, Nov 11)

Caltech scientists develop DNA origami nanoscale breadboards for carbon nanotube circuits
(News Guide, Nov 10)

US could create 4.5 million jobs in renewable energy, says analysis
(Renewable Energy Focus, Nov 10)

TSMC's Next Move in China
(Silobreaker, Nov 10)

GlobalFoundries Continues To Push Industry Forward
(PC Hardwareblips, Nov 10)

Moser Baer to set up photovoltaic unit in Andhra Pradesh
(Projects Today, Nov 10)

Japan aims to build solar power station in space by 2030
(Current, Nov 09)

"Carbon Nanotube Sponges"
(Nanotechnology Now, Nov 09)

Spending Spree Earns Capital Punishment for DRAM Suppliers
(Electronic Products, Nov 09)

SOLARCON India 2009 gets going in Hyderabad
(AndhraNews.net, Nov 09)

Freescale puts two chip factories up for sale
(Network World, Nov 09)

Suntech and Huadian partner on 10 MW solar plant in Jiangsu Province, China
(Renewable Energy Focus, Nov 09)

Top 20 suppliers show 19% sales growth in Q3
(Electronics Design Strtegy News, Nov 06)

Rare Earths Shortages May Hurt Tech Firms
(Business Week, Nov 06)

Underestimating East Germany
(The Atlantic, Nov 06)

UPDATE 3-Japan's Elpida to outsource chips to Taiwan's ProMOS
(Forbes, Nov 06)

U.S. Struggles to Build Solar Opportunities
(Solar Plaza, Nov 06)

Outlooks brighten for 2009, 2010
(Electronics Design Stategy News, Nov 05)

Invisible but indispensable
(Economist, Nov 05)

Industry group says chip forecast is brighter
(Forbes, Nov 05)

Infineon, TSMC extend collaboration to 65nm
(Digital Times (Eng), Nov 05)

New York's Cuomo names Intel in antitrust lawsuit
(Investors.com, Nov 04)

New semiconductor standards proposed to deter counterfeiters
(Congoo, Nov 04)

Single-wafer processing is key to MEMS success
(Solid State Technology, Nov 04)

AMD Sees Opportunities to Design, Produce Chips in the United Arab Emirates
(Silobreaker, Nov 04)

Chartered shareholders accept ATIC acquisition offer
(Network World, Nov 04)

Chip companies may face drawn-out economic recovery [BC-CPT-CHIPS:SJ]
(TMCnet.com, Nov 04)

NEMO Project: 11 Partners Conduct Research on New OLED Materials
(Global SMT & Packaging, Nov 04)

MEMS chip business struggles with growing pains, says IC Insights
(Congoo, Nov 04)

Scientists Make Foldable 3D Solar Cells around an Optical Fibre
(Scientific American, Nov 03)

A design sign of the times: Distributors boost technical support offerings
(Electronics Design Stategy News, Nov 03)

Merck KGaA leads OLED consortium
(Silobreaker, Nov 03)

UPDATE 1-Toshiba, UAE's Taqa eye joint Areva T&D bid-sources
(CNBC, Nov 03)

Climate & credibility
(Frontline, Nov 03)

Inventory in Semiconductors Looking Lean
(Minyanville, Nov 03)

Unity Trans-Pacific Cable Lands in Japan
(Interactive Voice Response, Nov 03)

Chartered Adopts Brion s Computational Lithography Solutions
(Global SMT & Packaging, Nov 03)

New yield problems at TSMC
(Congoo, Nov 03)

Agilent Tech & Stanford Univ to Explore New Class of Nanoscale Devices
(U.S. Tech, Nov 02)

COO benefits in manufacturing mobile displays with steppers
(Solid State Technology, Nov 02)

SIA: Chips a $20B/mo industry again, ahead of forecasts
(Solid State Technology, Nov 02)

DuPont, Silicon Energy Make Glass-Glass c-Si Modules
(RenableEnergyWorld.com, Nov 02)

Q-Cells terminates solar wafer agreement with LDK Solar
(Renewable Energy Focus, Nov 02)

Sahara Sun 'to help power Europe'
(BBC News, Nov 02)

Chinese solar panel manufacturer scopes out Austin
(South Florida Business Journal, Nov 02)

Happy solar-cell scientists
(Alpha Galileo, Oct 30)

Sony, Panasonic outlooks suggest sector recovery
(The Washington Post, Oct 30)

UCF Secures $7.5 Million Research Grant to Improve Hybrid Photovoltaic Solar Cells
(Nanotechnology Now, Oct 29)

Europe Factory Usage Rises for First Time Since 2007 (Update3)
(Bloomberg, Oct 29)

Japanese solar cell shipments to double
(Solid State Technology, Oct 29)

Recession Slows Electricity Demand and Renewable Energy Growth, NERC Finds
(The New York Times, Oct 29)

Belgium-based IMEC to set up R&D center in Taiwan
(Silobreaker, Oct 29)

Calm after storm over Ruiz story
(TimesUnion.com, Oct 29)

Stimulating development in UV AlGaN emission
(Semiconductor Today, Oct 28)

Freescale and Synopsys announce multi-year strategic collaboration agreement
(Global SMT & Packaging, Oct 28)

Semiconductor recovery to kick off in 4Q09, says iSuppli
(Digital Times (Eng), Oct 28)

Obama announces $3.4B for 'smart' power grid
(The News Tribune | Seattle- Tacoma News, Oct 27)

China still faces supply shortage of multi-crystalline silicon, insider
(Chinamining.org, Oct 27)

Colorado Solar Research Center Powers Up
(SustainableBusiness.com, Oct 23)

Japanese chemical companies focus on renewables
(ICIS, Oct 23)

STMicroelectronics Boosts STM32 Development with Fast-Start Development Platform
(IntoMobile Finance, Oct 23)

The Chip-Equipment Disconnect
(TheStreet.com, Oct 23)

MEMC buys solar energy services firm SunEdison
(Tree Hugger, Oct 23)

Solar recovery to start, but 2010 outlook dim
(Reuters Special Coverage News, Oct 23)

UMC Sub to Establish Shandong PV Co
(JLM Pacific Epoch, Oct 23)

Hynix records first net profit in 2 years on chips
(Action 3 News, Oct 23)

Nakaya, Amkor and Toshiba Sign Definitive Agreements on Joint Venture for Semiconductor Assembly and Test Services
(Consumer Electronics Net, Oct 23)

Renewable companies see advantages in auto industry's pain
(Solid State Technology, Oct 22)

UPDATE 1-First solar IPO in 15 months set to price Nov. 5
(Forbes, Oct 22)

AUO unveils flexible e-paper technology
(Printed Electronics World, Oct 21)

SOI Consortium Simpler Process Reduces Variability
(Chip Design Magazine, Oct 21)

India chip dreams replaced by PV solar
(Solid State Technology, Oct 21)

SEMI: Bookings rise y/y for first time since May 2007, industry continues to improve
(Electronics Design Stategy News, Oct 21)

Hynix Semiconductor to sell U.S. chip plant, would-be buyer says
(Daily News, Oct 21)

AT&T sues screen makers, alleging price fixing
(MSN Money, Oct 21)

Carbon nanotubes may cheaply harvest sunlight
(PhysOrg.com, Oct 19)

Fujitsu develops first millimeter-wave GaN transceiver amplifier chipset
(Semiconductor Today, Oct 16)

HB LED & LED Packaging 2009 Report
(Global SMT & Packaging, Oct 16)

Samsung Electronics Develops the World’s First Single Chip for North American Mobile Digital TV Standard Approved Yesterday
(Cloud Computing Journal (Sys-Con), Oct 16)

Fujitsu develops first millimeter-wave GaN transceiver amplifier chipset
(Semiconductor Today, Oct 16)

IR cameras: The new tool for emission leak detection
(Plant Engineering, Oct 16)

GLOBALFOUNDRIES Selects Mentor Graphics Calibre Platform for Computational Lithography and DFM Enablement
(DMN, Oct 16)

AMD's First "Fusion" Processors to Be Made Using 32nm SOI Process Technology - CEO
(PC Hardwareblips, Oct 16)

See the light
(Design World, Oct 16)

Motion Sensor is designed for intelligent vehicle electronics
(Thomas Net News, Oct 16)

HB LED & LED Packaging 2009 Report
(Global SMT & Packaging, Oct 16)

Litho contaminants: Getting ready for EUV
(Solid State Technology, Oct 16)

UPDATE 1-Samsung to build China LCD plant for $2.3 bln
(CNBC, Oct 16)

Rohm Co. Buying Kionix
(PEHUB, Oct 15)

Synopsys Introduces Synphony High Level Synthesis
(1888 Press Release, Oct 15)

Axcelis Scores Another High Energy Win as Major Foundry Selects Optima XE for Advanced IC Manufacturing
(Stockwatch, Oct 15)

Air Products, DuPont sign a-Si gases deal in China
(Pennenergy, Oct 15)

Dow Corning expands its SiC epitaxy capabilities with the latest generation AIXTRON Planetary Reactor
(Display +, Oct 15)

Mentor Graphics and Valor Sign Definitive Merger Agreement
(Global SMT & Packaging, Oct 15)

Air Products to Supply LNG Technology to Technip for China Plant
(Orlando Business Journal, Oct 14)

ASML returns to profit in third quarter, orders up
(Newschief.com, Oct 14)

STMicroelectronics Expands MEMS Portfolio with Medium-G Accelerometers
(Downloads Portal, Oct 14)

Scientists Create Nuclear Battery with Liquid Semiconductor
(Daily Tech, Oct 12)

ASML upbeat on micro-lithography growth
(Silobreaker, Oct 12)

The European Semiconductor industry will meet again in Dresden in 2010
(Global SMT & Packaging, Oct 12)

CHINA'S IC INDUSTRY SHOWS RECOVERY SIGNS
(Individual.com, Oct 12)

Rep. Giffords' Solar Roadmap Bill Passes Science and Technology Committee
(RenableEnergyWorld.com, Oct 09)

Semiconductor Industry Sheds Inventory, But Turnaround Not Likely in 2009
(Congoo, Oct 09)

Nvidia Stops Next Gen Chipset Development
(Tech Fragments, Oct 09)

Foundries plan huge CapEx increases in 2010
(Ems Now, Oct 09)

TSMC and IMEC join forces to bring novel technology solutions to emerging markets
(Global SMT & Packaging, Oct 09)

PV Taiwan Shines New Era on Industry
(The Earth Times, Oct 09)

Tokyo Electron: Jul-Sept Chip, LCD Equip Orders Up 94% Q/Q
(Morningstar, Oct 09)

ARM Reveals Results of 45nm SOI Test Chip
(EDA Geek, Oct 08)

Opportunities and Risks in the Italian PV Markets
(RenableEnergyWorld.com, Oct 08)

UMC Fab 12i Migrates to 45/40nm Manufacturing
(Tec Trends, Oct 08)

Where's The Next Boom? Maybe In 'Cleantech'
(Product Design & Development, Oct 07)

The Promise Of Nanotubes
(Forbes, Oct 07)

Will cleaning technologies break through the red brick wall?
(Semiconductor Packaging News, Oct 07)

Foundries Play Semiconductor Survivor in 2010
(Global SMT & Packaging, Oct 07)

NASA Invites Young People to Take Virtual Space Station Spacewalks
(KMEG 14, Oct 07)

Region also bested Russia, Brazil for fab: China wasn't the only other candidate for the multibillion-dollar facility
(TMCnet.com, Oct 06)

When will emerging memory arrive?
(Electronics Design Stategy News, Oct 06)

Big Blue's DNA-Reading Chips
(Technology Review, Oct 06)

Panasonic and Renesas Start SoC Development at Naka Site in Japan
(Microwave Journal, Oct 05)

Nanotechnology gets a new light touch
(PhysOrg.com, Oct 02)

3D IC packaging to be mature within 3 years, says ASE chief officer
(Digital Times (Eng), Oct 02)

Honda Nano Technology Has Promise for New Class of Electronics
(MSN Money, Oct 01)

3D IC technology drives public investment in 300mm
(Solid State Technology, Oct 01)

Performance Comparison of Gold vs. Copper Wire Bonding
(Semiconductor International, Oct 01)

IMEC Steps Towards 3D Integration of DRAM on Logic
(Chip Design Magazine, Sep 30)

Better Brain Implants
(Product Design & Development, Sep 30)

RF engineers automate tests
(EDN Asia, Sep 30)

Rapid China solar growth seen by Applied Materials
(Silobreaker, Sep 30)

Semiconductor Inventories Fall Below Optimal Levels
(TMCnet.com, Sep 30)

Physicists create first atomic-scale map of quantum dots
(PhysOrg.com, Sep 29)

TI opens 300-mm analog manufacturing facility in Texas, adds up to 1000 jobs
(Electronics Design Stategy News, Sep 29)

Lean IC inventories could create artificial sales bump
(EE Times, Sep 29)

Nanoruler Sets Some Very Small Marks
(Scientific Computing, Sep 29)

Semi Equipment Makers: Rising from the Dead?
(Seeking Alpha, Sep 29)

TSMC vs.SMIC Focuses on 130 nm Process
(Semiconductor International, Sep 29)

Toshiba To Halve R&D Spending At Chip Operations By FY10
(Nikkei Net Interactive, Sep 29)

PV2 Standard Collaborators Recognized, Cimetrix Included
(Business Wire, Sep 29)

Analysis: the detail versus the spirit of Taiwan's investment easing
(EE Times, Sep 29)

Semi Market Recovery on Track Due to Strong Fundamental Demand
(EDN Asia, Sep 28)

From Solar Energy to LEDs: Yale Scientists Tackle Energy Problems in Five New Energy Research Frontier Centers
(TMCnet.com, Sep 25)

TSMC to ramp capacity at Fab 14 for Intel Atom opportunity
(Digital Times (Eng), Sep 25)

Energy Secretary Steven Chu announces more than $106 million in funding from the American
Recovery and Reinvestment Act
(Media Newswire, Sep 25)

Intel Developer Forum: The top 9 takeaways
(Between the Lines ZDNet.com, Sep 25)

Seoul shares slip but cut losses; Hynix tumbles
(Forbes, Sep 25)

Intel brings Nehalem to notebooks
(Zdnet Technology News, Sep 24)

IMEC unveils mechanically stacked GaAs/Ge dual-junction solar cell
(Laser Focus World, Sep 24)

Officials Discuss Trade in Counterfeit Semiconductor Products
(ag-IP-news, Sep 24)

Progress Report: Nanoelectronics
(Chip Design Blogs, Sep 24)

Intel Corporation: Manufacturing, Chip Design Expertise Driving Innovation
and Integration, Historic Change to Computers
(TMCnet.com, Sep 23)

Oerlikon Solar Wins Solar Industry Award
(The Earth Times, Sep 23)

Moore's Law has decades left, Intel CTO predicts
(Information Technology World, Sep 23)

Intel to Ship More System-on-Chip Devices than Microprocessors – Chief Executive
(XBIT Labs, Sep 23)

SunPower Shines in Italy
(Individual.com, Sep 23)

Suntech Sets Another World Record for Multi-Crystalline Module Conversion Efficiency
(CNBC, Sep 23)

German solars upbeat but wary on upturn
(Reuters Special Coverage News, Sep 22)

Semi market recovery on track due to strong fundamental demand
(Electronics Design Stategy News, Sep 22)

The Five Building Blocks Of An Efficient, High-Brightness LED Driver
(Electronic Design, Sep 22)

TSMC vs. SMIC Trade Secrets Theft Trial Grinds On
(Semiconductor International, Sep 22)

South Korean president pushes 'green growth'
(TMCnet.com, Sep 22)

Tool demand improving slowly, surely?
(Solid State Technology, Sep 21)

Springs built from nanotubes could provide big power storage potential
(PhysOrg.com, Sep 21)

Applied Materials sees solar unit profit in 2010
(Reuters Business News, Sep 21)

Sabic Awards ASU Contract to Air Products, Samsung
(Downstreamtoday.com, Sep 21)

Brooks Automation shares soar on analyst upgrade
(Forbes, Sep 21)

NEWSWEEK Launches Ranking of Greenest Companies in America
(StreetInsider.com, Sep 21)

UMC First To Announce Carbon Footprint Verification On Integrated Circuit Wafers
(Semiconductor Online, Sep 18)

India’s Gujarat to Give Contracts for Solar Project (Update1)
(Bloomberg, Sep 18)

Japan Aug chip gear book-to-bill ratio comes in at 1.44
(Reuters US News, Sep 17)

Semiconductor Research Corporation and Intel Foundation Partner to Prepare Future Innovators with Use-Inspired Research Program
(Nano TechWire, Sep 17)

S.KOREAN SCIENTISTS DEVELOP WORLD'S 1ST OPERATIONAL SPIN TRANSISTOR
(Individual.com, Sep 17)

TSMC reportedly eyeing Lumileds and Toyoda Gosei to enter LED market
(Congoo, Sep 17)

President Obama set to reference GlobalFoundries in speech, say reports
(EE Times, Sep 17)

Pulling Power Out Of Thin Air
(Chip Design Blogs, Sep 17)

Amkor, Nakaya, Toshiba still discussing venture
(Forbes, Sep 16)

'Swift recovery under way' with shortages possible, analyst reports
(Electronics Design Stategy News, Sep 16)

NEC Elec, Renesas to get $2.2 billion from parent firms
(Reuters Special Coverage News, Sep 16)

Friction Differences Offer New Means for Manipulating Nanotubes
(Georgia Tech, Sep 15)

Synopsys Moves On
(Yahoo! Finance, Sep 15)

Graphene Advances Simplify Fabrication of Nano Storage
(Controlled Environments Magazine, Sep 15)

Applied Materials Receives EPA Green Power Leadership Award
(Business Wire, Sep 15)

Mora Grilled in TSMC vs. SMIC Deposition
(Semiconductor International, Sep 15)

Solar market to recover … eventually
(Electronics Design Stategy News, Sep 15)

Intel: $1.4B EU monopoly fine based on mistakes
(Fresno Bee (AP), Sep 15)

Profile of China's electronics and information industry in Jan.-July
(TMCnet.com, Sep 15)

Taiwan's five big DRAM makers see sales pick up
(Network World, Sep 14)

IMEC to house Kaneka’s European Photovoltaics Lab advancing joint research
(Nanotech Cafe, Sep 14)

Applied Material’s Santa Clara property for sale
(Biz Journals, Sep 14)

Air Products Celebrates Career Development Program's 50th Year
(The Earth Times, Sep 14)

Tracking Chip Companies' High-Tech Spend
(TheStreet.com, Sep 14)

Intel Ramping 32 nm Manufacturing in Oregon
(Semiconductor International, Sep 14)

Solar power plant in a box
(Chron.com Blogs, Sep 14)

Intel Ramping 32 nm Manufacturing in Oregon
(Semiconductor International, Sep 14)

Semiconductor Equipment Spending Expected to Rebound in 2010
(Monitordaily.com, Sep 11)

Chip Tools Spending To Fall 48% In '09: Gartner
(Fox Business, Sep 11)

TSMC Hears Charges of IP Leaks, FUD Campaign in Trial With SMIC
(Semiconductor International, Sep 11)

Using Nanotubes in Computer Chips
(Nano TechWire, Sep 11)

China: U.S. Should Take Responsibility on Climate
(Pennenergy, Sep 11)

National Semiconductor Profit Plunges
(TheStreet.com, Sep 11)

The Impact of Globalfoundries Acquisition of Chartered Semiconductor
(Global SMT & Packaging, Sep 11)

China market: Foundry chipmakers calling for extensions on tax exemption
(Digital Times (Eng), Sep 11)

Why The Chartered Semiconductor Acquisition Matters
(Chip Design Blogs, Sep 11)

Texas Instruments, ASML invigorate tech sector
(International Business Times, Sep 10)

Using Nanotubes in Computer Chips
(MIT, Sep 10)

FOCUS: Semiconductor Sector On Its Way To Recovery
(Morningstar, Sep 10)

Gold solution for enhancing nanocrystal electrical conductance
(PhysOrg.com, Sep 10)

DuPont to investing $120 million in photovoltaic film research
(Pennenergy, Sep 10)

PennWell Launches ElectroIQ Web Portal for Electronics Manufacturing
(Security @ ITBusiness Net.com, Sep 09)

Air Products India JV Signs Two Photovoltaic Contracts
(Interest Alert, Sep 09)

Entegris sees 3Q sales above Wall Street estimates
(yahoo! 7 Finance, Sep 09)

Nano material could boost new microchips
(Congoo, Sep 08)

Capacity utilization expected to bounce back in Q3
(EE Times, Sep 08)

Silicon Valley is shrinking
(Network World, Sep 08)

"Thermochemical nanopatterning of organic semiconductors"
(Nanotechnology Now, Sep 08)

Toshiba to Outsource Chip Making
(Yahoo! Finance, Sep 08)

First Solar to Team With Ordos City on Major Solar Power Plant in China Desert
(News Blaze, Sep 08)

Why China's Chip Industry Won't Catch America's
(CIO Today, Sep 08)

UPDATE 1-UMC's solid Aug sales show improving chip demand
(Forbes, Sep 08)

WRAPUP 1-Abu Dhabi to buy Chartered; Hynix stake up for grabs
(Forbes, Sep 06)

SEMI Predicts 64% Growth in Fab Spending
(PCBDesign007, Sep 04)

Researchers Grow Nanowire Crystals For 3-D Microchips
(Embedded Technology, Sep 04)

EVE Emulation Supports Up to One-Billion ASIC Gates
(Chip Design Magazine, Sep 04)

Investigating Cosmic Radiation’s Impact on Complex Microelectronics
(Scientific Computing, Sep 03)

Chinese Stimulus Policy Offers New Opportunity for Semiconductor Vendors, Says G...
(Congoo, Sep 03)

Japan Fashions Super Chip
(Forbes, Sep 03)

Researchers Design New Graphene-Based, Nano-Material With Magnetic Properties
(Semiconductor Online, Sep 03)

Researchers Build Smallest Semiconductor Laser to Date
(The Daily Californian, Sep 03)

Hynix Contemplates Action Against Counterfeiters
(Congoo, Sep 02)

The Incompatibilities of Semiconductor and Life Science Cleanrooms
(Congoo, Sep 02)

Applied Materials sees signs of solar uptick
(Business Exchange, Sep 02)

Renewable Energy Made by Mixing Salt and Fresh Water
(PhysOrg.com, Sep 02)

TECH STOCKS: Tech Stocks Try To Find Early Upward Momentum
(Morningstar, Sep 02)

Intersolar Expands Into India
(PR Newswire, Sep 02)

KLA-Tencor keeping up R&D spending despite difficult times
(Congoo, Sep 02)

Indian, British entities sign semiconductor deal
(Technorati, Sep 02)

ASML fulfills “holistic litho” plan with two tools, custom packages
(Congoo, Sep 01)

Slump-hit companies switch to less-is-more policy with vendors [The Economic Times, India]
(TMCnet.com, Sep 01)

It’s Official — Khosla Raises Over $1 Billion, Mostly For Clean Tech
(PEHUB, Sep 01)

China Gengsheng Minerals, Inc. Establishes Monolithic Refractory Materials Technology Research Center Supported by Henan Province
(PR Newswire, Sep 01)

Japan's chipmakers mapping out independent futures
(SST WaferNews, Sep 01)

IBM, Dalsa form 3-D R&D center in Canada
(EE Times, Sep 01)

NIST, Maryland tout gold/Si "sandwich" for molecular switches
(Small Times Media, Sep 01)

UPDATE 3-Japan's Elpida to raise $844 mln, seeks to reboot
(Forbes, Sep 01)

Semiconductor sales creeping up
(Biz Journals, Aug 31)

Report: MEMS-based system market to generate $13B supply chain revenue in 2012
(Small Times Media, Aug 28)

Die-scale stress management to advanced annealing optimization
(SST WaferNews, Aug 28)

Researchers Hope to Mass-Produce Robots on a Chip
(PhysOrg.com, Aug 28)

Nuclear Fusion Research Key to Advancing Computer Chips
(Scientific Computing, Aug 28)

A ‘Reverse Auction Market’ Proposed To Spur California Renewables
(Green Inc., Aug 28)

Intel ups Q3 revenue expectations on stronger than expected demand for MPUs, chipsets
(Electronics Design Stategy News, Aug 28)

Crossing The Great Divide
(Chip Design Blogs, Aug 28)

Confusion Reigns Over China's Polysilicon Import Policy
(Morningstar, Aug 27)

Fujitsu taps TSMC for advanced 28nm chip production
(The Industry Standard, Aug 27)

UPDATE 6-Renesas, NEC Elec may get $2.1 bln bailout -Nikkei
(Forbes, Aug 26)

Yole Développement Forecasts IPD Market to Reach over $1B by 2013
(PCBDesign007, Aug 26)

ALLEN LU NAMED PRESIDENT OF SEMI CHINA
(Press Release Point, Aug 26)

Gartner Raises Global Chip Revenue Forecast for 2009
(Yahoo Tech, Aug 26)

Semiconductor Research Corporation and University of Arizona Researchers Advance Peridynamic Theory Research to Help Make Electronics More Reliable
(TMCnet.com, Aug 26)

US Recovery Act funding goes to green LED research
(Semiconductor Today, Aug 25)

Counterfeit Components: How Bad Is It, Really?
(PCBDesign007, Aug 25)

Options bullish on Applied Materials-08/25/2009
(NASDAQ.com, Aug 25)

TSMC takes over IDT fabrication process
(Ems Now, Aug 25)

Tera-Barrier Films Receives Investment from Applied Ventures to Commercialize
Moisture-Resistant
(Congoo, Aug 25)

Tech stocks move up led by chip giants
(MarketWatch, Aug 25)

Soon, solar cells might be printed like newspaper or painted on rooftops
(TMCnet.com, Aug 25)

Analyzing Call Buying in Applied Materials Inc. (AMAT) and Dell Inc. (DELL) - www.ONN.tv Reports
(KMEG 14, Aug 24)

Europe looks to N.Africa Sahara for solar power
(TMCnet.com, Aug 24)

Vietnam sees delays in IC manufacturing push
(EE Times, Aug 21)

TI offers to bid on Qimonda's Virginia factory
(Forbes, Aug 21)

SOI Industry Consortium stalks the “green thing”
(Electronics Design Stategy News, Aug 19)

2Q Global Silicon Wafer Shipments Up 79%
(EDN Asia, Aug 19)

SEMI book-to-bill ratio climbs above parity for first time since January 2007
(Electronics Design Stategy News, Aug 19)

Japanese chip gear book-to-bill hits 1.32
(EE Times, Aug 19)

SMIC drops unpaid leave scheme
(Digital Times (Eng), Aug 19)

Nuclear fusion research key to advancing computer chips
(PhysOrg.com, Aug 18)

First signs of recovery seen in electronics supply chain, IPC reports
(Electronics Design Stategy News, Aug 18)

Competition for High-Growth Mobile Chip Market Escalating This Year, Says In-Stat
(4g-wirelessevolution.tmcnet.com, Aug 18)

Printed Electronics Using More Inorganics
(U.S. Tech, Aug 18)

Flash Manufacturers May Cease to Build New Fabs, Warns Chief Executive of SanDisk.
(XBIT Labs, Aug 17)

New Devices Harness Carbon Nanomaterials For Drug Delivery Systems, Oxygen Sensors
(Science Daily, Aug 17)

IBM Scientists Use DNA Scaffolding To Build Tiny Circuit Boards
(PR Newswire, Aug 16)

Typhoon forces chip maker ASE to truck water to factories
(Network World, Aug 14)

Sistema could take stake in Infineon -report
(Forbes, Aug 14)

China's SMIC hopes to climb into the black during 2010
(Network World, Aug 13)

'Printed chips' could be boon for consumers
(PhysOrg.com, Aug 12)

Tiny 'MEMS' Devices to Filter, Amplify Electronic Signals
(Communications of the ACM, Aug 12)

SEMI: Wafer shipments spike in 2Q
(Solid State Technology, Aug 12)

A Nascent Debate in Germany - Research or Manufacturing?
(The New York Times, Aug 11)

Applied Materials Weathers Storm
(Forbes, Aug 10)

China boosts fabless startup efforts
(Electronic Engineering Times, Aug 10)

IC Insights: Only Three Companies in Billion Dollar Capex Club
(Semiconductor International, Aug 07)

Powerchip to end unpaid leave as DRAM glut eases
(Congoo, Aug 07)

Emerging commercial applications of nano electronics
(Small Times Media, Aug 07)

IDT to exit Oregon chip plant and outsource to TSMC
(Congoo, Aug 06)

U.S., Chinese, and Taiwanese solar-cell makers gain ground
(Display +, Aug 05)

Silicon wafer shipments jump in Q2
(EE Times, Aug 05)

Liquidation starts for bankrupt DRAM maker Qimonda
(Network World, Aug 05)

BeSang Demonstrates Multi-Layer 3D IC Technology
(PR Newswire, Aug 04)

SIA: Global chip sales on an upswing
(South Florida Business Journal, Aug 03)

China’s Manufacturing Expands Amid Signs of Recovery (Update1)
(Bloomberg, Aug 03)

Top 20 semiconductor suppliers see 21% sales surge in Q2
(Electronics Design Stategy News, Jul 31)

TSMC Expects to Win the Battle Against GlobalFoundries
(XBIT Labs, Jul 30)

Ge-on-Si direct-band-gap LED lays groundwork for group-IV laser
(Laser Focus World, Jul 30)

GlobalFoundries could be the elusive Eurofoundry, and more
(EE Times, Jul 30)

Thinnest semiconductor laser holds promise for on-chip interconnects
(Laser Focus World, Jul 29)

CORRECTED: Chipmakers optimistic on recovering demand, prices
(Thoughts.com, Jul 29)

GlobalFoundries signs manufacturing deal with STMicro
(MarketWatch, Jul 28)

Infineon Austria to return to full-time work
(Congoo, Jul 28)

ARM, Chartered, IBM, Samsung, and Synopsys Collaborate to Deliver Vertically Optimized Solution for 32/28nm Mobile SoC Designs
(IT INDUSTRY TODAY, Jul 27)

IC backend firms expect 10% revenue decline in 4Q09
(Digital Times (Eng), Jul 27)

AMD Spin-Off GlobalFoundries Breaks Ground On Fab
(Information Week, Jul 24)

Nanotube growth caught on camera
(Congoo, Jul 24)

Chartered Semiconductor increasing 300mm fab capacity and spending
(Congoo, Jul 24)

Hynix Semiconductor's net loss sharply narrows
(PhysOrg.com, Jul 24)

TSMC and Cadence Expand Collaboration to Deliver Advanced, Feature-Rich Process Design Kits
(Cloud Computing Journal (Sys-Con), Jul 23)

More Than Meets The Eye: New Blue Light Nanocrystals
(Photonics Online, Jul 23)

Silicon with afterburners: Process developed at Rice could be boon to electronics manufacturer
(News Guide, Jul 23)

Semicons Driving Force for Energy Efficiency
(U.S. Tech, Jul 16)

Intel to open up fab facilities with task-specific designs
(PC Perspective, Jul 15)

Intersolar - The 1GW Solar Factory, a Dream Deferred
(The New York Times, Jul 15)

Chasing First Solar: Why Oerlikon, Applied Materials Think They Can Catch Up
(Earth2Tech, Jul 15)

Intel says profit blows past estimates
(WXYZ.Com, Jul 14)

Anticipation Builds for GLOBALFOUNDRIES Fab 2
(Hard OCP, Jul 14)

Solar Manufacturers: More Solar Robots, Less Green Jobs
(Earth2Tech, Jul 13)

Novellus Systems loss jumps to $50M
(Nashville Business Journal, Jul 13)

LED technology makes super efficient light bulbs, to replace filament models within three years!
(Techchee.com, Jul 13)

NXP and TSMC deliver industry's first 45nm single-chip digital TV platform
(Display +, Jul 10)

Applied Materials to Demonstrate the Power of Scaling Solar Technology at Intersolar North America
(Nano Werk, Jul 10)

Nanopillars Promise Cheap, Efficient, Flexible Solar Cells
(Semiconductor Online, Jul 10)

Photronics to Close IC Mask Photomask Manufacturing Facility in Shanghai
(Congoo, Jul 09)

New White Paper Details 3-D IC Deployment
(Printed Circuit Design & Fab, Jul 09)

Global recovery looking more & more likely
(Global SMT & Packaging, Jul 08)

OKI to acquire Renesas' LED production line
(Electronic Engineering Times, Jul 08)

SUSS MicroTec and Thin Materials Cooperate on Temporary Bonding Solution for 3D Packaging
(DiGiTAL50.com, Jul 08)

S. Korean chip, shipbuilding sectors to fare well in H2: report
(TMCnet.com, Jul 06)

GLOBALFOUNDRIES Appoints Head of Enterprise Quality, Completes Senior Leadership Team
(TMCnet.com, Jul 06)

ISMI to Report Progress at SEMICON West
(Semiconductor International, Jul 06)

May semiconductor sales show slight increase from April
(New Mexico Business Weekly, Jul 06)

Semis Sales to Surge, Says IC Insights
(EPN Distiblog, Jul 06)

TSMC Unveils First Commercial 65-Nanometer Multi-Time Programmable Non-Volatile Memory Technology
(Breitbart.com, Jul 01)

Wafer Processing Engineers at SEMICON West Consider Role of New Particle-Sensing Technology in Validating, Analyzing Real-Time Wafer Contamination During Demo and Launch of New WaferSense(R) APS From CyberOptics Semiconductor, Inc.
(TMCnet.com, Jul 01)

Market for Green PCs Will Exceed $190 Billion by 2013
(PCBDesign007, Jul 01)

TSMC still having problems with 40nm production
(PC Perspective, Jul 01)

Japan Bails Out DRAM Maker Elpida with $313M
(Extreme Tech, Jun 30)

Analyst: MEMS tool market on the rebound
(Small Times Media, Jun 30)

Chip maker Semilab restructures U.S. operations
(Mass High Tech, Jun 30)

Taiwan opens door for Chinese investment
(KSWO, Jun 30)

Film on making MEMS to debut at SEMICON West
(Small Times Media, Jun 29)

Five enablers for future chip scaling
(EE Times, Jun 26)

Tegal’s quarterly revenue down 74% year-on-year
(Semiconductor Today, Jun 26)

Chip equipment market bogged down by used equipment, says The Information Network
(Digital Times (Eng), Jun 26)

Marginal changes in DRAM and NAND flash spot prices, says inSpectrum
(Digital Times (Eng), Jun 26)

Robust growth predicted for 193-nm resist
(EE Times, Jun 26)

SMIC strengthens deployment in MEMS segment
(Digital Times (Eng), Jun 25)

Alchimer Raises $10 Million to Expand Global Customer Support and Broaden New IP Development
(Global SMT & Packaging, Jun 25)

Analog Devices CEO Sees A Bottom
(The Wall Street Journal, Jun 24)

Synopsys and TSMC Deliver 28nm Lithography Verification
(Chip Design Magazine, Jun 23)

April IC growth strongest since 1996
(Electronic Engineering Times, Jun 23)

LCD backlight LEDs to grow from 8bn in 2008 to 34bn in 2012
(Semiconductor Today, Jun 23)

Sustainable recovery coming in 2010, Gartner reports
(Electronics Design Stategy News, Jun 23)

Novellus’ Peter Wolters Division develops 22nm double-sided Silicon Wafer Polish Process
(Electronics Design Stategy News, Jun 23)

Solar PV capex to pick up in 2011
(Electronic Engineering Times, Jun 22)

Intel scales down 193nm litho to 15nm
(Electronic Engineering Times, Jun 22)

TSMC CEO change: What other analysts are saying
(EE Times, Jun 21)

TSMC gearing up for PWM IC market
(Digital Times (Eng), Jun 19)

A quiet week for both the DRAM and NAND flash spot markets, says inSpectrum
(Digital Times (Eng), Jun 19)

Global Chip Sales Down 34% In 1Q As Bottom Arrives -ISuppli
(Wall Street Journal Template, Jun 18)

TSMC claims first 28nm SRAM cell
(Electronic Engineering Times, Jun 18)

Foundries to see reduced orders for communications chips in 3Q09
(Digital Times (Eng), Jun 18)

Japan May chip gear book-to-bill ratio at 0.66
(Forbes, Jun 17)

New TSMC CEO eyes LED, solar markets
(Electronic Engineering Times, Jun 16)

GLOBALFOUNDRIES Technology Aimed at 22nm and Beyond
(Chip Design Magazine, Jun 16)

Major Taiwan IC designers expect growth in June
(Digital Times (Eng), Jun 16)

Taiwan companies gearing up for touch panel market
(Digital Times (Eng), Jun 15)

Outlook for semiconductor equipment industry improving, spending growth expected, Gartner says
(Electronics Design Stategy News, Jun 15)

Top 7 trends in bleak IC market
(Electronic Engineering Times, Jun 15)

SEMICON REPORT:Chartered Semi, Globalfoundries A Good Match
(Wall Street Journal Template, Jun 15)

TSMC CEO seeks new growth markets
(EE Times, Jun 12)

Bigger 300mm plants to boost fab capex in 2010
(Electronic Engineering Times, Jun 11)

Morris Chang to resume helm of TSMC
(Digital Times (Eng), Jun 11)

Global chip market may fully recover in 2012, says TSMC chairman
(Digital Times (Eng), Jun 10)

Analysts, vendors tip slow IC improvement
(Electronic Engineering Times, Jun 10)

Global chip equipment mkt to jump in 2010 -industry
(Reuters India, Jun 10)

Taiwan, China to set up LED cooperation platform
(Digital Times (Eng), Jun 09)

Foundry growth seen in Q2 as shortages loom
(Electronic Engineering Times, Jun 09)

Intel on track to commence operations at China fab in 2010
(Digital Times (Eng), Jun 08)

Taiwan should implement aggressive renewable energy policy, says Applied chairman
(Digital Times (Eng), Jun 08)

Taiwan mulls loosening semiconductor restrictions
(Forbes, Jun 06)

Semiconductor index falls after analyst downgrade
(Forbes, Jun 05)

SIA estimates rebound will begin in 2010
(Electronics Design Stategy News, Jun 05)

Portuguese group to buy Qimonda solar unit-report
(Forbes, Jun 05)

GA Tech: Graphene could replace Cu for IC interconnects
(Small Times Media, Jun 04)

IMEC, TSMC expand research collaboration
(Electronic Engineering Times, Jun 04)

Ex-Intel Fellow: AMD struggling to stay in the game
(Electronic Engineering Times, Jun 04)

TSMC bases extended European research efforts at IMEC
(Electronics Design Stategy News, Jun 03)

Team touts advance in flexible OLED displays
(Electronic Engineering Times, Jun 03)

MEMS find place GPS, mobile apps
(Electronic Engineering Times, Jun 03)

Analysis: AMD's road to fabless operations
(Electronic Engineering Times, Jun 02)

Computex 2009: Intel sales chief outlines industry growth opportunities
(Digital Times (Eng), Jun 02)

Semiconductor industry poised for growth in 2Q09, says IC Insights
(Digital Times (Eng), Jun 02)

Report: Taiwan investment to boost China IC industry
(Electronic Engineering Times, Jun 01)

Nanocrystals key to sub-32nm optical litho
(Electronic Engineering Times, Jun 01)

10 companies in trouble
(EE Times, May 29)

No deadline for Qimonda, says insolvency adminstrator
(EE Times, May 29)

AMEC gains legal victory over Applied
(EE Times, May 29)

Gartner expectations for 2009 improve, predicts Q2 sales growth
(Electronics Design Stategy News, May 28)

Nikon plans 1,000 layoffs in fab tool unit
(Electronic Engineering Times, May 28)

Long wait for IC recovery
(Electronic Engineering Times, May 27)

SanDisk, Samsung renew semiconductor agreements
(Forbes, May 27)

DRAM demand remains weak, say Taiwan makers
(Digital Times (Eng), May 26)

Micron seeks funds to enter LED, solar markets
(Electronic Engineering Times, May 25)

BPA forecasts a U-shaped slow recovery for semiconductor and PCB industries
(Electronics Design Stategy News, May 22)

DRAM and NAND flash spot price cuts not stimulating demand, says inSpectrum
(Digital Times (Eng), May 22)

Taiwan's Economy Worsens
(The Wall Street Journal, May 21)

Semiconductor Slowdown Easing
(Forbes, May 21)

SEMI Sees Recovery of Semiconductor Industry
(EDN Asia, May 20)

Japan April chip gear book-to-bill ratio at 0.44
(Forbes, May 20)

IC equipment facility rises in Saigon Hi-Tech Park
(Electronic Engineering Times, May 20)

Global Semiconductor Industry Leading Indicator fell in March
(Global SMT & Packaging, May 20)

Hynix says DRAM prices to rise further in H2
(Reuters India, May 18)

Memory-Chip Alternative Is Unveiled
(The Wall Street Journal, May 18)

Mobile chip firms see better second quarter
(Reuters India, May 18)

Downturn shuffles top 20 IC supplier list
(Electronic Engineering Times, May 18)

Hynix to establish back-end joint venture in China
(Digital Times (Eng), May 17)

TSMC sees delay in e-beam equipment delivery
(Digital Times (Eng), May 17)

Hynix to sell back-end equipment to China venture
(Forbes, May 17)

Chip, Transistor Demand Returns As Pricing Stabilizes
(Electronic Design, May 15)

STMicroelectronics, Soitec to Collaborate on Next-generation CMOS Image Sensor Technology Development
(EDN Asia, May 14)

Synthesis Needs to Change to Serve Modern Chip Design
(Chip Design Magazine, May 13)

Rising demand stabilizes analog IC market
(Electronic Engineering Times, May 13)

China-based solar-grade wafer suppliers in negotiations to adjust contract prices
(Digital Times (Eng), May 12)

Analog demand returns, pricing stabilizes, iSuppli reports
(Electronics Design Stategy News, May 12)

Freescale taps nanocrystals for embedded flash
(Electronic Engineering Times, May 12)

New nanocrystals show potential for cheap lasers, new lighting
(Small Times Media, May 11)

Micron back on No. 3 spot in DRAM ranking
(Electronic Engineering Times, May 11)

TSMC buys equipment from ASML and Tokyo Electron
(Digital Times (Eng), May 11)

Brighter light at end of tunnel
(Global SMT & Packaging, May 08)

IC equipment recovery not until August, analyst says
(Electronic Engineering Times, May 07)

X-ray reveals anatomy of gallium oxide
(Semiconductor Today, May 07)

Intel invests in fab tool supplier ASMI
(Electronics Design Stategy News, May 06)

Foundry startup CEO sketches bright future
(Electronic Engineering Times, May 06)

No rebound just yet, according to supply-chain survey
(EE Times, May 06)

SVTC Technologies Receives Additional Funding
(Small Times Media, May 06)

TSMC resolves 40nm yield issues
(Electronic Engineering Times, May 05)

Semiconductor sales starting rebound, says The Information Network
(Digital Times (Eng), May 05)

A night of semiconductor history
(Blogs @ Intel, May 04)

March chip sales reflect stabilizing market
(Solid State Technology, May 04)

Fujitsu, TSMC partner on 40nm logic ICs
(Electronic Engineering Times, May 04)

Semiconductor sales up in March, but down for the quarter
(Phoenix Business Journal, May 01)

Apple's push into chips could unnerve suppliers
(Reuters, May 01)

Semiconductor manufacturer reduces carbon footprint, energy use
(Control Engineering, May 01)

Philippines: TI Ramps Up New Assembly/Test Facility
(TMCnet.com, Apr 30)

China: Intel Says Committed to Chinese Investments
(TMCnet.com, Apr 30)

Apple building its own chips for the iPhone, iPod touch?
(Macsimum News, Apr 30)

ICs and other semiconductors will bounce back in 2010
(Purchasing.com, Apr 29)

UMC pays $285M for China foundry
(Electronics Design Stategy News, Apr 29)

Atmel chip-maker lays off 266 in Springs
(The Daily Times, Apr 29)

China and IP: the piper will get paid
(ZDNet Blogs, Apr 28)

Kulicke & Soffa revenues down 65%
(Philadelphia Inquirer, Apr 28)

Surprising Gains in Semiconductor Sectors Despite Economic Downturn According to The Linley Group Study
(Consumer Electronics Net, Apr 28)

Cypress Unveils Market s First SRAM on 65-nm Process Technology
(Nano TechWire, Apr 27)

GlobalFoundries appoints ex-Freescale exec as R&D leader
(Semiconductor International, Apr 27)

Renesas and NEC Electronics to merge
(TG Daily, Apr 27)

Oversupply continues to arrest memory market recovery
(Electronics Design Stategy News, Apr 24)

Cypress Q1 loss widens to $90.7M but beats Street
(Sacramento Business Journal, Apr 23)

Freescale Semiconductor laying off 69 in Boca Raton
(Palm Beach Post, Apr 23)

UPDATE 2-KLA Tencor posts wider-than-expected loss
(Reuters Industries, Apr 23)

Qimonda shopping semiconductor plant built for $3B
(Austin Business Journal, Apr 22)

TSMC invests in R&D despite downturn
(Electronic Engineering Times, Apr 22)

JAPAN NEWS: Analyzing the Renesas-NEC deal; fleeing to solar, LEDs
(SST WaferNews, Apr 21)

Semiconductor capital spending will increase in 2010
(Purchasing.com, Apr 21)

AMD softens losses to $416m
(Macnn, Apr 21)

Asyst to file for Chapter 11 bankruptcy
(Cincinnati Business Journal, Apr 20)

Self-assembled Nanowires Could Make Chips Smaller And Faster
(Science Daily, Apr 20)

SEMI India bets big on solar power
(Electronic Engineering Times, Apr 20)

Paper: Japan's chip-tool B:B hits record low
(SST WaferNews, Apr 20)

The world's smallest diamond transistor is just 50 nanometers long
(Nano Werk, Apr 17)

Toshiba to cut 3,900 positions
(Individual.com, Apr 17)

NEC, Renesas consider merger
(Purchasing.com, Apr 17)

Albany chip industry supplier plans new building
(OregonLive.com, Apr 16)

Fairchild Semi posts 1Q loss but beats Street
(1170 Am Kcbq, Apr 16)

Intersolar North America Announces 2009 Event Partners
(Cloud Computing Journal (Sys-Con), Apr 16)

MEMC to lay off 200 more
(Los Angeles Business, Apr 14)

Intel "Bottoms Out"
(Kvew42, Apr 14)

Abound Solar opens first thin-film PV production facility
(Solid State Technology, Apr 14)

MEMC expects sales drop
(Charlotte Business Journal, Apr 13)

ON Semiconductor Inks Deal With LSI
(techrockies.com, Apr 13)

Japan to Lift Punitive Tariffs on S. Korea's Hynix Chips
(IStock Analyst, Apr 13)

Micron drops plan to join Taiwan chipmaker
(M&C, Apr 09)

US firm investing billions in chip industry
(The Raw Story, Apr 09)

Intel signs agreement with Vietnam's Ministry of Education to increase uptake of e-learning
(TMCnet.com, Apr 09)

Gartner: Semiconductor sales fell 5% in 2008
(Purchasing.com, Apr 08)

Applied Materials May Suffer From Weaker Solar Customers
(ADVFN, Apr 07)

MEMC Electronic Materials lays off 200
(Atlanta Business Chronicle, Apr 07)

ISMI Readies 450 mm Equipment Metrics
(Semiconductor International, Apr 07)

No recovery yet, Gartner says
(EE Times, Apr 06)

Chips Sales Still Downbeat
(Datamation: IT Management, Apr 06)

China to set up first MEMS special zone in Shanghai
(Digital Times (Eng), Apr 06)

Electronics Demand May Recover Late This Year
(PCWorld, Apr 05)

February chip sales fall 30% to $14.2B
(Milwaukee Business Journal, Apr 03)

Plastic memory close to commercialization
(EE Times, Apr 03)

Soitec Group Announces Circuit Stacking Capability Ready For Manufacturing And Technology Transfer
(Semiconductor Online, Apr 03)

Soitec reduces headcount
(Semiconductor International, Apr 02)

Chip industry may have hit local bottom, says VC
(Congoo, Apr 02)

Oerlikon completes sale of Esec to BE Semiconductor
(Semiconductor Today, Apr 02)

Qimonda takes further move towards closure
(SST WaferNews, Apr 01)

Oerlikon Solar: Patent Dispute Far From Over
(Greentech Media, Apr 01)

iPhone spurs MEMS market
(Semiconductor Packaging News, Apr 01)

Used test equipment: A bright spot in an ever-bleak economy
(Test and Measurement, Apr 01)

Applied Materials Statement on European Patent Office Decision Revoking University of Neuchatel Patent
(DVD Creation, Mar 31)

Metrology firm gears up during downturn
(SST WaferNews, Mar 31)

Thousands lose their jobs at Sun, KLA-Tencor
(KLIV CNN 1590, Mar 31)
Applied Materials, Disco Team up to Develop Wafer Thinning Technology for 3-D Semiconductors - Update
(RTT News, Mar 30)

KLA-Tencor to cut another 10% of staff
(Pittsburgh Business Times, Mar 30)

Hundreds of jobs trimmed at Google, Plantronics, Fairchild
(KLIV CNN 1590, Mar 27)

MEMS suppliers suffer from shrinking automotive sales
(Semiconductor International, Mar 27)

NAND Prices Expected to Climb
(IT Business Edge, Mar 27)

Mountain Top plant to close; 200 to lose jobs ( )
(RBC Dain Rauscher Inc. (fka Dain Rausche), Mar 26)

Paper: Intel's Dalian (China) plant on track
(SST WaferNews, Mar 26)

China Wants a Slice of the Semi Pie
(CR4, Mar 26)

Semitool warns all Montana employees of possible layoff
(Greatfallstribune.com, Mar 25)

First Solar to Develop 30 Megawatt AC Solar Power Plant for Tri-State
(Cable and Wire Directory, Mar 25)

Intermolecular hires former Applied Materials general manager for overseas expansion
(Display +, Mar 25)

Feinstein Blocking Solar Development in Mojave
(Electronic Component News, Mar 25)

Tri-State, First Solar to develop 30 MW solar plant
(PEI, Mar 24)

SEMI demand at historic lows...but now at bottom?
(Solid State Technology, Mar 24)

Globalfoundries CEO Denies Intel's Claim on Licensing Agreement Breach
(Congoo, Mar 24)

Globalfoundries Expects to Get 32nm Bulk Process Technology in 2009.
(XBIT Labs, Mar 23)

Chip Makers Call Market Bottom
(U.S. Tech, Mar 23)

Soitec Group Announces Partnership With New China Distributor
(Circuitree, Mar 20)

First Solar Produces 1 Gigawatt of Clean Solar Electricity
(DiGiTAL50.com, Mar 20)

SMIC readies 45nm production
(Semiconductor Packaging News, Mar 20)

National Semiconductor Acquires Act Solar, Extending Its Solar Energy Efficiency and Management Capabilities
(KRISTV.com, Mar 19)

Lam Research to cut 375 jobs, or 10% of workforce
(MarketWatch, Mar 19)

Brooks Auto. execs accept 10% pay cut
(Memphis Business Journal, Mar 19)

State of Saxony doesn't rule out Qimonda stake
(yahoo! 7 Finance, Mar 19)

New industries are "spectacularly" inefficient
(R & D, Mar 18)

SMIC gets more orders: CEO
(SST WaferNews, Mar 18)

Japan Feb chip gear B:B falls to record low
(SST WaferNews, Mar 18)

Commodity chip prices hit rock bottom
(TG Daily, Mar 18)

Synopsys CEO confident of IC rebound
(Electronic Engineering Times, Mar 18)

Kulicke & Soffa Launches New Die Bonding Platform at SEMICON China 2009
(Trading Markets, Mar 17)

Investor Ends Talks About Qimonda Stake Purchase.
(XBIT Labs, Mar 17)

China Vice Premier Demonstrates Support for Clean Energy at Applied Materials Solar Facility in Xi’an
(Business Wire, Mar 17)

Intel Objects To AMD's Spin-Off of Globalfoundries
(Top Tech News, Mar 16)

Photovoltaic market to see 17% growth rate, Gartner reports
(Semiconductor International, Mar 16)

Qimonda still seeks investors, cuts production
(Digital Pro Sound, Mar 13)

The Chips Were Down, Down, Down in 2008
(AtNewYork.com, Mar 13)

Worst of chip correction past - LSI CEO
(Reuters India, Mar 13)

State expects ‘green’ growth from new solar cell factories
(Phoenix Business Journal, Mar 13)

Gartner: Worldwide Semiconductor Capital Equipment Spending to Decline in '09
(Monitordaily.com, Mar 13)

TSMC and UMC to See 2Q09 Double-Digit Growth
(Hard OCP, Mar 13)

Obama Tax Plan Would Nail Chip Industry
(PC Mag, Mar 12)

Will Taiwan DRAM venture push through?
(Electronic Engineering Times, Mar 12)

Top semiconductor suppliers suffer revenue declines in 2008, according to iSuppli Corp
(Ems Now, Mar 12)

IC Insights: Industry Poised for Rebound
(Semiconductor International, Mar 12)

Chipmakers say higher taxes will cost U.S. jobs
(Reuters, Mar 11)

National Semi: Profit Beats Street, But Plans to Cut Workforce 26%
(Seeking Alpha, Mar 11)

Samsung Semi Gets New CEO
(Byte and Switch, Mar 11)

DRAM downturn no longer oversupply-driven, say memory makers
(Digital Times (Eng), Mar 11)

IMEC Creates Ultra Thin Chip Package for Wearable Electronics
(EDA Geek, Mar 10)

Capital spending in chip business to fall 45%
(Semiconductor Packaging News, Mar 10)

Chartered seeks to raise $300 million with rights issue
(Congoo, Mar 09)

Equipment Spending to Decline 45.2% in 2009, Gartner Says
(Semiconductor International, Mar 09)

When? Reaching the elusive bottom and beginning recovery
(Global SMT & Packaging, Mar 06)

Taiwan Gov't Urges Sickly Chip Industry to Seek Foreign Help
(CRMBuyer, Mar 06)

Intel Shoots for Customizable Chips
(Yahoo! Finance, Mar 06)

Taiwan's Chip Industry Seeks Foreign Tie-Ups
(Manufacturing.net, Mar 05)

DRAM prices could rise based on Taiwan government proposal
(Purchasing.com, Mar 05)

Chip industry headed toward consolidation
(International Herald Tribune, Mar 05)

AMD foundry spin-off gets its name: GlobalFoundries
(The Tech Report, Mar 04)

Microchip prices are sliding again
(Purchasing.com, Mar 04)

Better solar panel efficiency achieved
(Zibb, Mar 04)

Fabless companies buck economic trend, gain in IC Insights top 20 rankings
(Congoo, Mar 04)

Recession Has Chipmakers Reeling
(Red Orbit, Mar 03)

Taiwan May Broker Mergers, Tie-Ups in Chip Industry ‘Big Bang’
(Bloomberg, Mar 03)

TSMC details litho roadmap, taps maskless
(Electronic Engineering Times, Mar 02)

Intel dips $62.9M R&D investment in Ireland
(Electronic Engineering Times, Mar 02)

Tokyo Electron, Oerlikon Solar team up for PV
(Electronic Engineering Times, Mar 02)

Intel, TSMC prepare joint announcement
(The Tech Report, Feb 27)

California targets semiconductor industry for huge greenhouse gas reduction
(TG Daily, Feb 27)

German solar company to build $1B plant in Tenn. - Salon.com
(Salon.com, Feb 26)

Intel, AMD, Samsung Affected as Chip Sales Dive Globally: IDC
(eWeek, Feb 26)

Otellini: Purchasing More 'Predictable'
(circuitsassembly.com, Feb 26)

Chip sales set back five years, says Gartner
(FreeRealTime.com, Feb 25)

Semi Equip Book-To-Bill Hits 0.1 As Orders Evaporate
(Barron's Online (blog), Feb 25)

Dow cutting 800 jobs, but officials say proposed Clarksville plant safe
(Daily News Journal, Feb 25)

Nanotechnology Researchers Make Solar Energy Advance
(Newswise, Feb 25)

Difficulties to haunt China's IC industry
(Electronic Engineering Times, Feb 24)

The payoff for pursuing non-chip markets? Less volatility (hopefully)
(Small Times Media, Feb 24)

Qimonda reiterates concrete talks with potential buyers
(Digital Times (Eng), Feb 24)

In-Stat: Global recession to make "bloody" 2009 chip market
(Solid State Technology, Feb 23)

ChipMOS TERMINATES SERVICE AGREEMENT WITH A LEADING NOR FLASH MAKER IN THE US
(EDA Cafe, Feb 23)

Chip Industry “Pretty Close” to Bottom
(All Things Digital, Feb 23)

Silicon Valley green tech jobs on the rise
(Nashville Business Journal, Feb 20)

Qimonda North America files for bankruptcy
(Charlotte Business Journal, Feb 20)

Applied Materials backs Joint Venture's green effort
(Dallas Business Journal, Feb 20)

Solar Equipment Revenues Likely to See Moderate Increase
(Semiconductor International, Feb 19)

Taiwan Semi Reportedly Cuts Prices To Boost Utilization
(Barron's Online (blog), Feb 19)

Applied Materials' Sunny Plans
(Forbes.com, Feb 18)

AMD Shareholders Greenlight Processor Manufacturing Spinoff
(eWeek, Feb 18)

Qimonda works council appeals to Merkel for help
(Reuters Industries, Feb 18)

China steps up consolidation of foundries, sources say
(Digital Times (Eng), Feb 17)

Taiwan IC production value to fall almost 27% in 2009
(Digital Times (Eng), Feb 17)

DRAM PRICES TURNING UPWARD ON REDUCED OUTPUT
(Zibb, Feb 16)

Foundry watch: TSMC stays on top
(Electronic Engineering Times, Feb 16)

Chip packaging houses in red, too
(Electronic Engineering Times, Feb 16)

Tegal doubles revenue and halves loss, boosted by AMMS acquisition
(Semiconductor Today, Feb 13)

DRAM prices may drop again to US$1
(Digital Times (Eng), Feb 13)

Interview with Charlie Gay, 'a solar guy'
(Congoo, Feb 12)

Saving green by being green
(Clean Rooms, Feb 12)

iSuppli: LEDs will outperform overall chip industry
(Purchasing.com, Feb 12)

Applied Materials swings to huge quarterly loss
(Semiconductor Packaging News, Feb 11)

Taiwan government backs Elpida-Taiwan chip makers' merger
(M&C, Feb 11)

Qimonda Has Until End of March to Attract New Investment
(PCWorld, Feb 11)

Intel demos first-ever 32nm processors
(Gadgets Addict, Feb 10)

China firm to lend Qimonda a hand?
(Electronic Engineering Times, Feb 10)

* Battered semiconductor industry reeling in Asia
(Congoo, Feb 09)

Solar Manufacturing: The Sun Always Rises
(SMT Magazine, Feb 09)

Brave New Chip For a Brave New Wireless Future - NYTimes.com
(The New York Times, Feb 09)

ON Semiconductor to close Phoenix wafer-fab facility
(Scottrade, Feb 06)

Elpida sees DRAM makers forming two groups in 5 years
(Forbes.com, Feb 06)

3-D foundry Allvia gains funding
(EE Times, Feb 05)

Samsung Reveals 40nm Fabrication Process for DRAM.
(XBIT Labs, Feb 05)

Intel to tweak China plans, close Shanghai plant
(Silicon Valley, Feb 05)

Nikon to cut immersion stepper capex by 40 pct
(SST WaferNews, Feb 05)

Hynix attributes losses to falling DRAM prices
(Reuters Markets, Feb 04)

Popular Consumer and Mobile Products Fuel MEMS Boom
(Global SMT & Packaging, Feb 04)

Despite Financial Trouble, Qimonda Marches On
(TechBlogPlus, Feb 04)

German chip maker closing U.S. plant
(Daily Breeze, Feb 03)

Creditors shut doors on local semicon firms: Amid worsening economic crisis
(TMCnet.com, Feb 03)

Intel To Close Plants, Cuts Up To 6,000 Jobs
(EE TIMES, Feb 03)

Global Semiconductor Sales Down 2.8% in 2008
(PCB007, Feb 02)

Good news for chipmakers: Memory prices soar | Nanotech - The Circuits Blog - CNET News
(Cnet News.com, Feb 02)

Lam Research CEO gives UC-Davis $1.5M|
(Dayton Business Journal, Jan 30)

MEMS Market Grows
(EDA Blog, Jan 30)

Japanese chipmakers seek merger to survive Gulf Daily News
(World News, Jan 30)

Indian semiconductor market keeps growing
(Purchasing.com, Jan 30)

Austin considering major solar power plan
(WFAA.com, Jan 29)

Joint research to reduce chip footprint by 10x
(Electronic Engineering Times, Jan 29)

Euro Court Tells Intel To Go Suck an Egg
(Sys-Con, Jan 29)

Fraunhofer claims world record in solar cell efficiency - 41.1%
(TG Daily, Jan 28)
ST slashes 4500 jobs, halves capex in $700M savings plan

(Electronics Design News, Jan 28)

Asia memory chip shares jump on Qimonda woes
(Semiconductor Packaging News, Jan 28)

Qimonda hopes for strong investor
(Digital Pro Sound, Jan 26)

TI Cuts Work Force by 12%
(The Wall Street Journal, Jan 26)

Brooks Automation to cut 350 jobs
(BostonHerald.com, Jan 26)

Barrett to retire from Intel
(Electronics Design News, Jan 23)

German chipmaker Qimonda declares bankruptcy
(39online.com, Jan 23)

Intel succumbs to job cuts, fab shutdown
(Electronic Engineering Times, Jan 22)

China’s semiconductor market to fall 5.8%, iSuppli reports
(Electronics Design News, Jan 22)

Researchers Discover Method for Controlling Graphene
(Daily Tech, Jan 22)

Semiconducting Nanotubes Produced in Quantity
(Red Orbit, Jan 22)

Intel to Cut Jobs in Restructuring
(The Wall Street Journal, Jan 21)

Elpida in merger talks with 3 Taiwanese chipmakers, including Promos ( )
(RBC Dain Rauscher Inc. (fka Dain Rausche), Jan 21)

LEDs shine bright in bleak IC market

(Electronic Engineering Times, Jan 21)

Analysts urge memory makers to consolidate
(Electronic Engineering Times India, Jan 21)

AMD to cut 1,100 workers, 9 pct of staff
(Rapid City Journal, Jan 19)

TSMC sales down 45%, inventory now at 100 day supply
(TG Daily, Jan 19)

Toshiba taps MEMS to shrink fuel cells
(Fuel Cell Works, Jan 19)

Analysis: ST keeps Europe IC market afloat
(Electronic Engineering Times, Jan 15)

Graphene Has A Flexible Future In Electronics
(Red Orbit, Jan 15)

iSuppli: Chip inventories swell in fourth quarter
(Purchasing.com, Jan 15)

Chip prices will fall along with capital spending
(Purchasing.com, Jan 15)

SEMI: Despite downturn, wafer capacity continues to grow
(Purchasing.com, Jan 15)

Dresden gets 3D silicon research institution
(EE Times, Jan 14)

Chipmaker leak points to iPhone nano in June The Register
(World News, Jan 14)

Solar panels pose an environmental hazard, claims report
(Venture Beat, Jan 14)

More cuts in semiconductor industry likely as sales slow
(Columbus Business First, Jan 12)

UPDATE 1-Hynix believes Q4 2008 bottom of DRAM downturn-CEO
(Reuters Markets, Jan 12)

EE Times top stories of 2008: Energy, memristors
(Industrial Control Design, Jan 09)

Wafer-based Solar Cells Aren't Done Yet
(RenableEnergyWorld.com, Jan 09)

EC raids Infineon, ST, NXP for price fixing
(Electronic Engineering Times, Jan 08)

Tests resolve tension over silicon strain
(Electronics Design News, Jan 08)

Black silicon is ready to revolutionize photoelectronics
(SPIE, Jan 08)

UPDATE:Taiwan DRAM Makers Seek Government Aid But Won't Consolidate
(Fortune Magazine, Jan 08)

Tokyo Electron and Novellus Systems colleborate on copper process technology for 2Xnm and beyond
(Display +, Jan 07)

Intel lowers revenue estimate again
(International Herald Tribune, Jan 07)

Samsung says no decision yet on chip investment plan
(The Estacada News, Jan 06)

Intel could take a strategic stake in SMIC, says report
(EE Times, Jan 06)

Applied accelerating TSV implementation, launches Silvia etch tool
(Solid State Technology, Jan 06)

The year ahead: a time for innovation
(Solid State Technology, Jan 06)

Status and trends in 300mm manufacturing
(Solid State Technology, Jan 06)

Cracking A Tough Nut For The Semiconductor Industry
(Semiconductor Online, Jan 05)

Taiwan Prepares to Assist Struggling Companies
(The Wall Street Journal, Jan 05)

Samsung: No spending cut
(Reuters Video News, Jan 05)

Global chip sales down 9.8% to US$20.8b
(U.S. Tech, Jan 05)

Semiconductor industry slides past dark and into "pitch black"
(Ars Technica, Jan 04)