The ConFab 2011 Finalizes Program and Speakers

The ConFab 2011 Finalizes Programs and Speakers

The ConFab 2011, an “invitation-only” global conference and business meeting focused on semiconductor manufacturing, has announced the final session line-up and an updated list of confirmed speakers. The event will be held May 15-18 in Las Vegas, Nevada.  Entering its seventh year, The ConFab offers a venue for executives from semiconductor equipment and material suppliers to meet with key decision makers from semiconductor manufacturers. Attendees are pre-screened to verify that they are key participants in the buying process.  The event is organized by Pennwell Corporation.

The sessions include a look at the post-recession semiconductor industry, a closer focus on the relationship between fabless semiconductor companies and foundries, a review of the technical challenges the industry faces as it moves to the 22 nm node and below, the status of the transition to 450 mm wafers, and a look at high-growth markets in fields closely related to mainstream semiconductor manufacturing. The ConFab 2011 sessions include:

  • Defining the New Semiconductor Landscape: A Post-Recession Look at the State of the Industry
  • Collaboration to Strengthen the IC Supply Chain
  • The Challenges of Continued Scaling
  • Bridging the Fabless-Foundry Gap (Panel Session)
  • High Growth Markets: Challenges and Opportunities

 Keynote talks will also address the impact of the disaster in Japan on semiconductor and related industries in Japan, and the on-going effects on the world’s supply chain.  Confirmed speakers include:

  • Bob Krakauer, CFO of GLOBALFOUNDRIES
  • Bob Bruck, VP of Technology and Manufacturing Group and GM at Intel
  • Harvey Frye, president of Tokyo Electron America (TEA)
  • John Waite, VP Supply Chain at GLOBALFOUNDRIES
  • Raj Pendse, VP of Product and Technology Marketing at STATS ChipPAC
  • Robert Darveaux, CTO at Amkor
  • Nick Yu, VP of Technology Development at Qualcomm
  • Ming-Yin Hao, VP of Field Application Engineering at UMC
  • Michael Campbell, Senior VP of Engineering at Qualcomm
  • David Medeiros, director of Patterning at IBM
  • Tom Jefferson, 450 mm program manager at ISMI
  • B.J. Woo, senior director of Business Development at TSMC
  • Paul Farrar, VP of Albany Expansion and Strategic Initiatives at IBM
  • Raj Jammy, VP Materials and Emerging Technologies at SEMATECH
  • Bill McClean, president at IC Insights

“I’m delighted to announce such a strong line-up for our 2011 conference program,” said Peter Singer, conference chair and editor-in-chief of Solid State Technology. “Not only are we covering the semiconductor industry’s evolving economics and on-going technical challenges, but we’re tackling the issues collectively faced by fabless companies, foundries and packaging houses. We’re also going to look at some of today’s high-growth market areas, including solid state lighting (high-brightness LEDs), MEMS, displays and energy storage. A special thanks to this year’s advisory board for their expertise in bringing it all together.”

The ConFab 2011 sponsors include these 19 leading industry organizations and suppliers: Advantest, AG Semiconductor, Applied Materials, ATMI, Brewer Science, Camtek, Cascade Microtech, Edwards Vacuum Ltd., EVG, KLA-Tencor, Lam Research, Nikon, Novellus, Pall Microelectronics, Qcept Technologies, RED Equipment, SEMI, Toppan Photomasks and Valqua.

For more information on The ConFab, visit: www.theconfab.com.

 April 5, 2011