EVENT DATE: February 12 - 15, 2018
LOCATION: Monterey, California, USA
FlexTech, NextFlex, SEMI and the 2018FLEX Executive Committee invite you to submit an abstract of a paper, student poster or industry poster for the 17th Annual Flexible and Printed Electronics Conference - www.2018FLEX.com. The annual event highlights the latest technical breakthroughs and demonstrations of flexible hybrid and printed electronics products, equipment, processes and materials and the applications they enable.
The city of Monterey, California hosts 2018FLEX, which brings together world leaders in flexible and printed electronics in an environment conducive to formal and informal information-exchange, networking, and business collaboration. The event attracts technical representatives from over 400 companies, universities, R&D labs, and government agencies from around the world.
Students from leading research universities are especially welcome to submit posters describing their work and results on the same target topics. Prizes are awarded to the top three student posters as judged by a panel of industry and academic experts. The author/co-author must be available to present during the poster judging times.
Abstract Deadline: NOVEMBER 3, 2017
Notification of Acceptance: NOVEMBER 13, 2017
Questions? Please email 2018FLEX@flextech.org.
Event Date: February 13 - 14, 2017
Location: Monterey, California, USA
MEMS & Sensors Industry Group, SEMI and the 2018 MSTC Speaker Selection Committee invite you to submit an abstract of a paper, student poster or industry poster for the 2018 MEMS & Sensors Technical Congress (MSTC) - www.2018FLEX.com. The annual event highlights the latest technical breakthroughs and demonstrations of MEMS and sensors products, equipment, processes and materials and the applications they enable.
This year's theme is MEMS & Sensors Systems: Creating Sixth Senses.
The range of innovative new products incorporating MEMS and Sensor devices is rapidly growing. Applications are wide and varied from sensors for fully autonomous systems (including robotics, industrial and vehicle applications) and wearable devices to agricultural devices that measure sunlight, soil pH, and moisture content to products aimed at enhancing athletic performance such as golf, tennis, and basketball and the list goes on and on.
Presentations will focus on system level solutions incorporating MEMS and/or Sensor Devices, unique applications, and innovative technological or market solutions. Integration challenges and system level architecture decisions are driven by the particular use-case. Each application has unique requirements which may include power efficiency, computational capability, wireless interconnectivity, software algorithms as well as data collection, interpretation, and encryption. Speakers will elucidate these challenges and describe how to manage and successfully implement to essentially Create Sixth Senses towards total system solutions.
Abstract Deadline: NOVEMBER 10, 2017
Notification of Acceptance: NOVEMBER 20, 2017
Questions? Please email email@example.com.
Event Dates: 30 April - 3 May 2018
Location: Saratoga Springs, New York, USA
The call for papers for the 2018 SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2018) is now closed. With technical sponsorship from IEEE, ASMC has been a leading international technical conference for exploring solutions to improve the collective microelectronics manufacturing expertise. Solving the challenges presented by semiconductor manufacturing is an ongoing collaborative effort by users, device makers, equipment and materials suppliers and academia. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest information in the practical application of advanced manufacturing strategies and methodologies. The conference is now soliciting abstracts in multiple topic areas from professionals involved in all areas of semiconductor manufacturing. In addition to publication in the conference proceedings, select papers will be invited to participate in a special section of ASMC 2018 to be featured in the IEEE Transactions on Semiconductor Manufacturing. For more information, visit the ASMC Author Kit. Questions? Contact Margaret Kindling at firstname.lastname@example.org.
IMPORTANT DATES (subject to change)
|Abstracts Due (extended):||October 26, 2017|
|Author Notification:||December 6, 2017|
|Manuscripts Due:||February 5, 2018|
|Final Manuscripts Due:||April 2, 2018|
|Presentations Due:||April 27, 2018|
|Conference Dates:||April 30 – 3 May 3, 2018|
ASMC Mailing List: Make sure you receive the latest information about ASMC 2018. Add your name to the ASMC distribution list.
SEMI Technology Symposium (STS) 2018 (held in conjunction with SEMICON Korea 2018)
Call for Papers - CLOSED
Event Date: Jan 31-Feb 2, 2018
Location: Seoul, Korea
STS focuses specifically on exploring current and future trends in semiconductor design and manufacturing. By participating as a presenter, you will enhance the value of the STS and provide valuable information to your peers and other attending industry professionals.
Abstracts due: September 30, 2017
Selected speakers notified: October 31, 2017
Presentation file due: January 19, 2018.
MEMS & Sensors Executive Congress
Call for Papers - CLOSED
Conference Theme: MEMS & Sensor Systems: Creating Sixth Senses
Event Date: November 1-2, 2017
Location: Napa Valley, California, USA
We are accepting abstracts for the MEMS & Sensors Executive Congress focused on system integration and system solutions. We are looking at presentations that address a holistic approach to integration of sensors into solutions or products or increasing the value of products through additional functionality on the device itself.
Abstract Deadline: May 15, 2017
Abstract Acceptance Notification: July 25, 2017
Presentation Due Date: September 1, 2017
SEMICON Europa 2017 — co-located with Productronica
Event Date: November 14-17, 2017
Location: Munich, Germany
The call for papers for SEMICON Europa 2017 is now open. We invite you to submit an abstract and contribute for an event featuring more than 100 hours of technical sessions and presentations focused on critical industry topics shaping the design and manufacturing of semiconductors. This year the main themes are:
Advanced Packaging, Power Electronics, Flexible Electronics, and Materials.
Questions? Contact Christina Fritsch at email@example.com.
Abstracts Due: May 24, 2017
Notification: June/July 2017