Monterey, CA – February 13, 2018 – The 2018 FLEXI Awards today recognized groundbreaking accomplishments in the Flexible Hybrid Electronics (FHE) sector in 2017. Presented at the opening session of the 17th annual 2018FLEX Conference and Exhibition, in Monterey, California, the awards spotlighted the following leaders in the categories of R&D Achievements, Product Innovation and Commercialization, Education Leadership and Industry Leadership.
Product Innovation – E Ink, creator of Dazzle, the world’s largest electronic paper installation, won a FLEXI for product design and ingenuity, and potential market adoption and revenue generation. Made from electrophoretic display technology, the programmable art installation adorns one side of San Diego International Airport’s new rental car center.
R&D Achievement – The Wearable Device for Dynamic Assessment of Hydration team – consisting of GE Global Research, UES, The University of Arizona, University of Connecticut, University of Massachusetts Amherst, Dublin City University and AFRL – won a FLEXI for developing a paper-based biofluid patch that collects sweat for human hydration index monitoring. Award criteria included research approach, originality and commercial potential for expanding the bounds of flexible or printed electronics.
Technology Leadership In Education – James Turner, research scientist at Binghamton University, won a FLEXI for outstanding leadership and attention to mentoring students during the development of an FHE electrocardiography (ECG) patch. Turner led a group of students through the development which included a multi-disciplinary approach as well as coordination with industry and several academic institutions to correlate reliability data, simulations and optimize design features of the revolutionary patch.
Industry Leadership – David Morton, formerly with the Army Research Laboratory, won a FLEXI for his dedication to building awareness of advanced flexible hybrid electronics in the broader field of electronics. Award criteria include outstanding leadership in public forums and contributions to industry associations.
Technology Champion – Robert Reuss, former program manager in the Microsystems Technology Office at DARPA, won a FLEXI for his extraordinary dedication to growing the flexible electronics industry, early recognition of the impact of large area electronics and strong contributions to helping build the FLEX Conference.
FLEXIs have been the industry’s premier award for distinguished organizations and individuals since 2009. See full list of awardees. The FLEXI Awards are sponsored by FlexTech, a SEMI Strategic Association Partner, an organization dedicated to the success of the FHE sector. The 2018 FLEXI award ceremony was sponsored by SCREEN Holdings.
2018FLEX – February 12-15 in Monterey, California – spotlights FHE innovation drivers in smart medtech, smart transportation, smart manufacturing, smart data, Internet of Things (IoT) and consumer electronics.
SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (SEMI-MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.
Heidi Hoffman, SEMI-FlexTech