FlexTech Announces Cal Poly San Luis Obispo Benchmark Study
Milpitas, Calif.—January 22, 2018 – SEMI-FlexTech awards Cal Poly San Luis Obispo with a project contract for a benchmark study on printed electronics.
This 9-months long project will seek out and identify current companies and research groups involved in flexible and printed electronics. Data compiled from the research on the processing technologies and performance targets for functional components will serve as a 3-year, 5-year and 10-year horizon for benchmarking.
The project came to fruition in response to a lack of comprehensive benchmark studies on the current state of printed electronics assessing functional block performance such as: flexible batteries, high performance circuits, speaker and audio circuits, antenna, sensors of all types and more.
During this investigation period, the Cal Poly project team will be contacting targeted leaders in printed and flexible hybrid electronics (FHE) for their participation. A free executive summary of the benchmark is provided to the participants and the completed report will be available for purchase at a later time. The study will conclude with a TRL/MRL assessment for each printed electronics functional block.
For those interested in contributing to this benchmark study, please review the contact instructions below, fill out this survey or call (805) 756-2540 for more information. The Cal Poly team will also be at the 2018FLEX Conference in Monterey, CA from February 12-15, 2018 to meet up with any interested companies and organizations there. Read more here.
To participate, please contact the following based on corresponding areas of interest:
Dr. John Pan at email@example.com
- Integration Technologies
- Testing Technologies
Dr. Malcolm Keif at firstname.lastname@example.org
- High Performance Circuits
Dr. Xiaoying Rong at email@example.com
- Graphics with Embedding Electronics
Mr. Marc Chason at firstname.lastname@example.org
- Energy Harvesting
- Audio Speakers
About FlexTech, a SEMI Strategic Association Partner
SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.flextech.org and follow FlexTech on LinkedIn and Twitter.