|SUMMARY|||||AGENDA|||||SHORT COURSES|||||EXHIBITOR|||||CONFERENCE PRICING|||||NETWORKING OPPORTUNITIES|||||LOCATION|||||CFA|||||FLEXI AWARDS|
Check back frequently as more information will be added as the event approaches closer.
Monday, February 12, 2018
9:00 AM - 12:00 PM
1. Basics, Flexible Hybrid Electronics & Lab to Fab
Mark Poliks, Binghamton University, James J. Watkins, University of Massachusetts, Amherst, Mike Mastropietro, NextFlex
1:00 PM - 4:00 PM
2. Challenges and Solutions for Integration of Sensors with Flexible, Hybrid, Printed Systems
Chip Spangler, Aspen Microsystems, Mary Ann Maher, SoftMEMS
This course is intended for individuals and organizations interested in exploring the latest innovations in the system design of flexible, hybrid and printed solutions incorporating sensors. The course will provide an overview of the state of the industry and design and manufacturing ecosystems and focus on key system integration challenges for incorporating sensors into flexible, hybrid and printed designs. The course will describe both design and manufacturing issues illustrated by examples from the field and will cover the problems encountered at various stages of product development from concept to production. Practical advice and solutions are described for the specific problems brought by adding sensors to a flexible, hybrid, printed system and resources available to help in designing these systems will be presented.
3. Flexible Device Integration & Packaging
Pradeep Lall, Auburn University
In this course, manufacture, design, assembly, and accelerated testing of flexible hybrid electronics for applications in some of the emerging areas will be covered. Flexible hybrid electronics opens the possibilities for the development of stretchable, bendable, foldable form-factors in electronics applications which have not been possible with the use of rigid electronics technologies. Flexible electronics may be subjected to strain magnitudes in the neighborhood of 50-150 percent during normal operation. The integration processes and semiconductor packaging architectures for flexible hybrid electronics may differ immensely in comparison with those used for rigid electronics. The manufacture of thin electronic architectures requires the integration of thin-chips, flexible encapsulation, compliant interconnects, and stretchable inks for metallization traces. A number of additive manufacturing processes for the fabrication and assembly of flexible hybrid electronics have become tractable. Processes for handling, pick-and-place operations of thin silicon and compliant interposers through interconnection processes such as reflow requires an understanding of the deformation and warpage processes for development of robust process parameters which will allow for acceptable levels of yields in high-volume manufacture. Modeling of operational stresses in flexible electronics requires the material behavior under loads including constant exposure to human body temperature, saliva, sweat, ambient temperature, humidity, dust, wear and abrasion. The strains imposed on flexible stretchable electronics may far exceed those experienced in rigid electronics requiring the consideration of finite-strain formulation in development of predictive models. The failure mechanisms, failure modes, acceleration factors in flexible electronics under operational loads of stretch, bend, fold and loads resulting from human body proximity are significantly different than rigid electronics. The testing, qualification and quality assurance protocols to meaningfully inform manufacturing processes and ensure reliability and survivability under exposure to sustained harsh environmental operating conditions, may differ in flexible electronics as well. A number of product areas for the application of flexible electronics are tractable in the near-term including Internet-of-Things (IoT), medical wearable electronics, textile woven electronics, robotics, communications, asset monitoring and automotive electronics.
4. Next Generation of Flexible Displays
Paul Cain, FlexEnable, Mike Hack, Universal Displays, Erica Montbach, Kent Displays, D. Scott Bull, E Ink
4:00 PM - 5:30 PM
5. Applications Panel Discussion (OPEN to All)
Panelists: Nancy Stoffel, GE Global Research, Jeff Spindler, OLEDWorks LLC, Al Compaan, Lucintech, Tatsuo Ogawa, Panasonic
This panel discussion provides industry viewpoints on Applications for flexible, printed, or hybrid electronic devices. Panelists are selected from industry and provide initial comments on their application area’s critical technology needs required to achieve anticipated roadmaps. The goal is to provide the community with direction on meaningful problems that require multi-disciplinary technical solutions. Continued discussion and new connections amongst the ecosystem is highly encouraged. Application areas for discussion will be chosen from Display, Automotive, Packaging, Lighting, Photovoltaic, and other power considerations.