Strategic Materials Conference 2017

Strategic Materials Conference 2017

Monday, Sep 18, 2017 to Wednesday, Sep 20, 2017
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DoubleTree by Hilton
2050 Gateway Place
San Jose, California, United States - 95110

Materials Accelerating Innovation"

The Strategic Materials Conference—SMC 2017, is a two and half day conference (newly added Welcome Reception on Monday, September 18 from 5:30pm. to 7:00pm.) that brings together key players from the semiconductor industry ecosystem to share insights on the latest developments in Advanced Materials. SMC is the only premier conference devoted to technology and business drivers of materials in the microelectronics supply chain. SMC is also a great opportunity to network with industry leaders and colleagues.

This year's conference theme is “Materials Accelerating Innovation,”  and will delve into what’s driving demand for new materials, 5nm and Beyond, the Future of the Materials Market in China, Heterogeneous Integration, and many more topics.

The conference attracts a highly influential audience from every segment of the semiconductor manufacturing industry and provides comprehensive in-depth content and unprecedented networking opportunities for professionals who share common strategic objectives for the extended electronics ecosystem.

Keynotes

Future of Semiconductor:
Moore’s Law Plus 
 

 

The Next Level:
Is it Time for Equipment and Materials Suppliers to Collaborate More?

 

Collaborate to Win in China

 

 

 

 

 
Mark Papermaster
Chief Technology Officer and Senior Vice President
Technology and Engineering 
 Dave Hemker, Ph.D.
Chief Technology Officer and
Sr. Vice President, Corporate Technology Department 
 Sunny Hui
Senior Vice President,
Marketing
 
   
      

Session 1:  Economic/Market Trends:  The Consolidation game (M&A), China, 200mm & More...
                    
Presenters:  Applied Materials, SEMI China, Linx Consulting, Credit Suisse

Session 2:  Process Challenges at 5nm and Beyond
                    
Presenters: TSMC, ARM, Samsung Semiconductor 

Session 3:  Universities: Innovation Drivers
                    
Presenters: Berkeley University, Stanford University, University of Chicago

Session 4:  The Future of Materials Market in China
                    
Presenters: Entegris, Konfoong Materials International (KFMI),
                    Dow Chemical, Semiconductor Manufacturing International Corporation (SMIC)

Session 5:  Materials Supply Chain Challenges in Adjacent Industries
                  
  Presenters: EMD Performance Materials, Pixelligent Technologies, The Linde Group, PARC
                    (A Xerox Company)

Session 6:  Heterogeneous Integration: Design to New Materials & Packaging
                 
   Presenters: UCLA, IMEC, ASE 

Session 7:  Executive Panel
                    Presenters: TSMC, Intel Corporation, Versum Materials, Tokyo Electron

          

 

      

Sponsorship Opportunities:
Reach out to decision makers involved in all aspects of semiconductor
manufacturing and the microelectronics supply chain by sponsoring SMC.
For more information on available promotional opportunities contact: 
Shane Poblete, spoblete@semi.org, Tel: +1.202.847.5983

Event Contact:
Lin Tso
ltso@semi.org
Tel: 1.408.943.7920  
Cell: 1.510-921-1165

 


SMC 2017 Downloadable Agenda

 

MONDAY, SEPTEMBER 18  
5:30–7:00pm 

Registration (Check-in) and Welcome Reception 

Reception sponsor:  

TUESDAY, SEPTEMBER 19

  
7:30–8:30am 

Registration & Check-in

 

Breakfast sponsor:  
8:30–8:35am  

Welcome
Dave Anderson, President, SEMI Americas

 
    
8:35–8:40am

Opening Remarks –  SMC 2017 Co-Chair
Mark Thirsk, Managing Partner, Linx Consulting

 

    
8:40–9:20am

Keynote: Future of Semiconductor: Moore’s Law Plus  

Mark Papermaster
Chief Technology Officer and Senior Vice President, Technology and Engineering
AMD

   
9:20–9:50am

Keynote: The Next Level: Is it Time for Equipment and Materials Suppliers to Collaborate More?

David Hemker, Ph.D.
Chief Technology Officer
Lam Research

Keynote sponsor: 

    
9:50–10:20am 

Networking Break 

Break sponsor: 

    

SESSION 1: ECONOMIC / MARKET TRENDS; THE CONSOLIDATION GAME (M&A),
                     CHINA, 200MM, & MORE
       

Session sponsor: 
10:20–10:25am 

Welcome and Introductions
Sanjay Malhotra, Senior Director, Applied Materials
 

 
10:25–10:55am

Drivers and Opportunities for the Wafer Fab Equipment Industry

Arthur Sherman
CMO & Vice President of Strategy & Market Research
Applied Materials

    
10:55–11:25am

The Rise of China IC Industry: Challenges and Opportunities

Lung Chu
President
SEMI China  

    
11:25–11:55am

Trends in the Materials Market in 2017

Mark Thirsk
Managing Partner
Linx Consulting

 
    
11:55–12:25pm

Semiconductor Renaissance – The Staples of a Data Driven Economy

John Pitzer
Managing Director
Credit Suisse

    
12:25–1:30pm 

Lunch

 

SESSION 2: PROCESS CHALLENGES AT 5NM AND BEYOND    

Session sponsor:  
1:30–1:35pm

Welcome and Introductions SMC 2017 Co-Chair
Mark Thirsk, Managing Partner, Linx Consulting

    
1:35–2:05pm

The Art of Advanced Materials Management

Joe Wu, Ph.D.
Deputy Director, Nano-Materials Center
TSMC

    
2:05–2:35pm  

Beyond CMOS — The Rise of Non-volatile Switches

Lucian Shifren
Senior Principal Research Engineer
ARM

    
2:35–3:05pm 

Pratik Joshi, Ph.D.,
Staff Engineer, Materials Technology
Samsung Austin Semiconductor

 
    
3:05–3:35pm 

Networking Break

Break sponsor: 

SESSION 3: UNIVERSITIES: INNOVATION DRIVERS

 
3:35–3:40pm 

Welcome and Introductions
Kim Arnold, Executive Director, Wafer Level Packaging, Brewer Science

    
3:40–4:10pm

Extending the Era of Moore’s Law through Materials Innovation

Tsu-Jae King Liu, Ph.D.
University of California, Berkeley

    
4:10–4:40pm

Paper and Circuits, only Atoms Thick

Jiwoong Park, Ph.D.
Department of Chemistry Institute for Molecular Engineering James Franck Institute
University of Chicago

 
    
4:40–5:10pm 

Selective Atomic Layer Processing

Stacey Bent, Ph.D.
Stanford University

 
    
5:10–7:00pm 

SMC 2017 Networking Reception

Reception sponsor:  

 

WEDNESDAY, SEPTEMBER 20

  

SESSION 4: THE FUTURE OF MATERIALS MARKET IN CHINA  

Session sponsor:  
    
7:30–8:30am 

Continental Breakfast and Networking

Breakfast sponsor:  
8:30–8:35am 

Welcome—SMC Co-Chair
Wenge Yang, Ph.D., Vice President of Marketing, Entegris

 
8:35–9:05am

Keynote: Collaborate to Win in China

Sunny Hui
Senior Vice President, Marketing
Semiconductor Manufacturing International Corporation
(SMIC)

 
    
9:05–9:35am

China Semiconductor Materials Market: Opportunities and Challenges

Shuji Dinglee
Global Head of Lithography Technologies
Dow Chemical Company

 
    
9:35–10:05am

The Progress of Ultra-high Purity Metal Material for PVD in China

Lijun Yao, Ph.D.
Chairman & President
Konfoong Materials International (KFMI)

10:05–10:35am 


Networking Break  

 

Break sponsor:  

SESSION 5: MATERIALS SUPPLY CHAIN CHALLENGES IN ADJACENT INDUSTRIES

 
10:35–10:40am 

Welcome and Introductions
Ravi Kanjolia, Ph.D., CTO, Deposition Materials
EMD Performance Materials

 
10:40–11:10am

Safety Critical: Emerging Quality and Supply Chain Requirements for Automotive Electronics

Anish Tolia, Ph.D.
VP Global Marketing, Electronics

The Linde Group  

    
11:10–11:40am

Novel Metal Oxide Nanocrystals and Nanocomposites Technology Enabling Next Generation Opto-Electronic Devices

Shree Deshpande
VP Business Development
Pixelligent Technologies

    
11:40–12:10pm

Top Down vs.Bottom Up: Approaches for Making Electronics Systems Flexible

Julie Bert, Ph.D.
Research Staff, Prototype Devices and Circuits
PARC, a Xerox Company

12:10–1:30pm 

Lunch

 

 

SESSION 6: HETEROGENEOUS INTEGRATION: DESIGN TO NEW MATERIALS & PACKAGINGSession sponsor:
1:30–1:35pm 

Welcome and Introductions:  Session Sponsor:  Brewer Science
Kevin Peterson, Director of Sales & Marketing, JX Nippon Mining & Metals

1:35–2:05pm

Heterogeneous Integration for Performance and Scaling

Subramanian Iyer
Distinguished Chancellor’s Professor, Electrical Engineering Department
UCLA

    
2:05–2:35pm

3D Systems Partitioning-Processing Options and How They Link to Advanced Packaging

Andy Miller
Group Leader, 3D Enables System Integration
IMEC

    
2:35–3:05pm

Eelco Bergman
Sr. Director, Sales and Business Development
ASE Group 

 
3:05–3:35pm 


Networking Break   

Break sponsor:

SESSION 7: EXECUTIVE PANEL 

Session sponsor: 
3:35–3:45pm 

Welcome and Introductions
Kurt Carlsen, Director, Strategic Sourcing, Air Liquide

 
  

PANELISTS:

 
3:45–3:50pm

Device Maker Perspective

Joe Wu, Ph.D.
Deputy Director, Nano-Materials Center, TSMC

 
    
3:50–3:55pm

Device Maker Perspective

E. Steve Putna, Ph.D.
Materials & Equipment, Global Supply Management, Intel

 
    
3:55–4:00pm

Equipment Manufacturer Perspective

Ben Rathsack
Director, Product Technology and Marketing, Tokyo Electron

    
4:00–4:05pm

Materials Manufacturer Perspective

Gene Karwacki
Director, Global Strategic Marketing, Versum Materials

4:05–4:45pm 

Panel Discussion and Q&A

 
4:45–5:00pm 

Closing Remarks — Bart Pitcock, Vice President and General Manager, North America, KMG Electronic Chemicals, CGMG Co-Chair 

 

Full Conference Pricing 

     Extended through September 7, 2017

 After September 7,  2017  

SEMI Members        

         US $535.00

    US $635.00

Non Members

         US $695.00

    US $795.00

*Students (with valid ID; code required)

         US $80.00

    US $100.00

Please contact Lin Tso (ltso@semi.org) for Student Code.

Full registration includes all meals (breakfast, lunch, receptions, and breaks), conference sessions, receptions and speaker presentation. 
Airfare and hotel accommodations are not included.

Venue:

DoubleTree by Hilton San Jose

2050 Gateway Place

San Jose, CA 95110

Hotel Accommodations:

DoubleTree by Hilton San Jose

2050 Gateway Place

San Jose, CA 95110

A block of rooms have been reserved for September 17, 2017 - September 22, 2017. The special room rate ($262 per night), Standard King:  Single/Double will be available until September 3, 2017 so please register immediately.  

To begin the process, click on "Make A Reservation" below to receive the group's preferred rate. Hotel is pleased to offer complimentary high speed internet (WiFi) access.

Make a Reservation

OR

Guests can call our 24-7 reservations desk at 1-800- 222-8733 to book your room.  Please reference code: CDTSMC Conference.

Important note:  Hotel will not allow a one night for Tuesday or Wednesday only, Hotel requires minimum of 2 night stay.  Rooms fill quickly so please register by today.

Parking

Reduced Daily Self-Parking Rate of $12.00 per day -  Individuals pay on own

Reduced Overnight Self-Parking Rate of $17.00 per night - individual on own

 

 

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