Thank you for attending the MEMS & Sensors Technical Congress. Here is a summary of the event.
Industry Collaboration Recognized as Key Driver to Next Generation MEMS and Sensors Devices
The MEMS & Sensors Technical Congress (MSTC), organized by MEMS & Sensors Industry Group, a SEMI Association Partner (SEMI | MSIG), wrapped up with multiple calls for collaboration on technology development between academia and industry, new and updated standards, funding sources, and a sense that a new wave of MEMS sensor products coming to market. The event, hosted by Stanford SystemX Alliance and sponsored by NXP, along with Analog Devices, Ulvac and X, ab, featured keynotes, panel discussions, a poster session and breakout sessions and networking opportunities.
The MSTC was focused on addressing the market and technology challenges, moving up the value chain, and identifying market-pull, all in a convivial atmosphere conducive to collaboration.
More MSTC post-event review:
During the panel discussion featuring representatives from mCube, Bosch and Stanford, all with excellent backgrounds to explore Academic and Commercial Perspectives on the development of MEMS and sensors technology. The panel covered good models of collaboration and the roadblocks to efficient technology transfer from Universities and the private sector. Success in mentoring, industry return to labs and the timing of transfers were explored and discussion was lively. The participants will explore modeling a program after SRC – but for the MEMS industry. Particularly intriguing was the premise that venture capital is available, but not clearly being sold on the applications of the business plans for the new concepts being brought to them for commercialization. The “Next Big Thing” will enable society and generate revenue too, but needs to create differentiation for unique end products, and will be built on some level of industry collaboration since MEMS is just an ingredient, not the full solution. Patience and a commitment from the customer side is also needed if they want a unique product/solution. Academia can help with continued support for infrastructure creation, which is only optimized for certain products.
The first speaker of the day, Keynote, Scott Borg with the U.S. Cyber Consequences Unit, shared a unique perspective on the impact of all of the new sensor networks being deployed. He encouraged the attendees to approach the design of the product with hackers, and other classes of cunning adversaries in mind. Hackers are conservative by nature, but looking for easy access to the most mundane parts of the systems we are creating, including hardware vulnerabilities. The biggest impact currently is in manipulating financial markets and stealing competitive business information and that could affect our supply chains. Making it difficult and costly for hackers to attack your system is the best method of protecting yourself at this time.
With so many action items coming from the conference and breakout groups, the SEMI | MSIG members, leaders and staff were given a clear roadmap for future work, goals and activities.
The next opportunity to engage and connect with the MEMS and sensors community is the MEMS & Sensors Executive Congress, November 1-2, Napa, California-- We hope to see you there!
POSTER SESSION & FAB TOUR
For the 2017 MEMS and Sensors Technical Congress Agenda, please click: MSTC 2017 Agenda
WEDNESDAY, MAY 10, 2017
|8:30 - 9:00 am||Check-in and Continental Breakfast|
|9:00 - 9:30|
|9:30 - 10:15||Keynote: MacroBase: Prioritizing Attention in Fast Data (Abstract)|
Professor Peter Bailis (Biography)
Assistant Professor, Department of Computer Science, Stanford University
|10:15 - 10:45||Coffee Break|
|10:45 - 11:15||Sensor Integration: What does it mean and what are its benefits? (Abstract)|
Jay Esfandyari Senior Manager, MEMS Product Marketing, STMicroelectronics
|11:15 - 11:45||Enabling Easy Customization of MEMS Sensors for Integrated High-Value Solutions (Abstract)|
Stephen Breit, Vice President of Engineering, Coventor
|11:45 - 12:15 pm||High-performance MEMS Accelerometers for Gravity Mapping (Abstract)|
Paul Vickery, Executive Chairman, and Director, Silicon Microgravity
|12:15 - 1:30||Lunch|
|1:30 – 2:00|
A Lens-less SMD Thermopile Solution for Near Field People Recognition in Today’s Thin Battery Operated Devices (Abstract)
|2:00 - 3:00|
Panel Discussion (Abstract): Academic and Commercial Perspective on Capturing Value from MEMS and Sensors
|3:00 - 3:30||Coffee Break and walk to Nanofabs|
|3:30 - 5:00|
Tour of Nanofabs by Stanford - System X Alliance
|5:00 - 7:00||Reception with poster session for Stanford faculty and students|
THURSDAY, MAY 11, 2017
|8:15 - 8:45 am||Check-in and Continental Breakfast|
|9:00 – 9:15||Morning Kickoff: Karen Lightman VP, MEMS & Sensors Industry Group, SEMI|
|9:15 - 10:15|
|10:15 - 10:45||Smart MEMS Sensors for Robot Applications (Abstract)|
Shuji Tanaka, Professor, Tohoku University
|10:45 -11:15||Coffee Break|
|11:15 -11:45||Development of a High-Performance Micromirror Array Using the MEMS Ecosystem (Abstract)|
Carolyn White, Associate, AMFitzgerald
|11:45 - 12:15 pm||MEMS Spectral Sensors Enabling New Applications for Material Analysis (Abstract)|
Scott Smyser, Executive Vice President, W/W Marketing &Business Development, Si-Ware Systems
|12:15 - 12:45||Flexible Layout, More Dies Per Wafer by Plasma Dicing Technology (Abstract) |
Yannick Pilloux, Business Development Manager, Plasma-Therm
|12:45 - 2:45|
Lunch / Breakout Discussions (Click here for full Breakout Session descriptions)
|2:45 – 3:15||Coffee Break|
|3:15 - 3:45||Breakout sessions report, group discussion, wrap up/call to action|
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Sr. Manager, Sales, Exhibitions & Events
SEMI, FlexTech, MEMS & Sensors Industry Group
Tel: 1.408. 943.7047 l mobile: 1.312.613.5567
MEMS & Sensors Industry Group has been hosting its annual technical conference since 2001, we look forward to hosting our 2017 event with our Strategic Association Partner, SEMI. Building directly upon the theme and issues emanating from the 2016 MEMS & Sensors Executive Congress, the 2017 MEMS & Sensors Technical Congress (MSTC) will take a closer look at how companies in the MEMS and sensors supply chain can thrive in a challenging environment. Among the key challenges facing the industry today are:
The 2017 MSTC will focus on these and other challenges with thought-provoking technical content and breakout sessions that will delve deeper into the issues and possible solutions. We are looking for compelling abstracts from speakers who will address the aforementioned topics and have recommendations for moving the industry forward to meet these challenges to commercialization from a technical perspective.
The deadline for submission was January 11, 2017.
Any questions, please contact
Karen Lightman, Executive Director
MEMS and Sensors Industry Group