MEMS & Sensors Technical Congress 2017

Hosted By
Wednesday, May 10, 2017 to Thursday, May 11, 2017
Stanford University, 616 Serra Street, Bechtel Conference Center at Encina Hall, Stanford, California, United States - 94305-6055
 
Register  Wednesday, May 10, 2017 - 16:45
 

Pricing

NO ONSITE REGISTRATION - Please register on-line before May 8th, 2017.

 

Working Together to Solve Technical Challenges and Increase Value Across the MEMS and Sensors Supply Chain

Experience a blend of technical education, keynotes, a breakout session, fab tour, poster session and networking events that will engage your intellect on every level. Connect with the technical thought leaders who are driving the MEMS and sensors industry toward unprecedented growth. Tune into keynote speakers exploring cyber security and machine learning and so much more: 
     

TOPICS

    
  • Machine Learning
  • Systems With Smaller Form Factors Lower Power, Higher Performance, and Higher Cost
  • New and Emerging MEMS and Sensors
  • Technology Including Gravity Mapping, Power, Robotics, Micro-Spectrometry, Piezoelectric and Other Emerging Materials 
  • Flexible and New MEMS Equipment Technologies
  • MEMS and Sensor Security
  • Technology Transfer
  • Backend Challenges; Packaging and Test
  • Go to the Agenda tab to see more topics. 
   

KEYNOTES

    
   

POSTER SESSION & FAB TOUR

   
 

  

 

BREAKOUT DISCUSSIONS

  
 
  1. Technology Transfer for Dummies: How to get to a Stable High-yielding Process
    Lead:  Mary Ann Maher, Ph.D., President, Founder, softMEMS
     
  2. Back-end Challenges of MEMS and Sensors (Packaging, Testing, & Reliability)
    Leads:  Mike Mignardi, Manager, Technology Development, Texas Instruments, Rob O'Reilly, Senior Member Technical Staff, Analog Devices
     
  3. Integration Opportunities (Technological & Business Considerations)
    Lead: Peter Himes:  General Manager, SITRI Innovations and SITRI Ventures
     
  4. Emerging MEMS, Sensors, and Systems Incorporating Them
    Lead:  Nicole Kerness, Vice President, Sensor Design & Technology, Kionix
     
  5. Piezoelectric and other Emerging Materials for MEMS and Sensor Applications
    Lead:  Dave Horsley, PhD., Chirp Microsystems
     
 
MEDIA SPONSORS 

 

     

      Contact

      Event Contact:

      Lin Tso
      Sr. Programs Manager
      Tel: (408) 943.7920
      Em: ltso@semi.org

      Karen Lightman, Executive Director
      MEMS and Sensors Industry Group
      klightman@memsindustrygroup.org

      For the 2017 MEMS and Sensors Technical Congress Agenda, please click:  MSTC 2017 Agenda

      Agenda: Capturing Value from MEMS and Sensors from a Technical Perspective

      WEDNESDAY, MAY 10, 2017

      8:30 - 9:00 amCheck-in and Continental Breakfast
      9:00 - 9:30 

      Morning kickoff

      • Welcome by Stanford- System X Alliance, Roger T. Howe, Faculty Director, Stanford University
      • Welcome by Karen Lightman VP, MEMS & Sensors Industry Group, SEMI
      9:30 - 10:15 KeynoteMacroBase: Prioritizing Attention in Fast Data (Abstract)
      Professor Peter Bailis (Biography)
      Assistant Professor, Department of Computer Science, Stanford University
      10:15 - 10:45Coffee Break
      10:45 - 11:15 Sensor Integration: What does it mean and what are its benefits?  (Abstract)
      Jay Esfandyari Senior Manager, MEMS Product Marketing, STMicroelectronics
      11:15 - 11:45 Enabling Easy Customization of MEMS Sensors for Integrated High-Value Solutions  (Abstract)
      Stephen Breit, Vice President of Engineering, Coventor
      11:45 - 12:15 pmHigh-performance MEMS Accelerometers for Gravity Mapping  (Abstract)
      Paul Vickery, Executive Chairman, and Director, Silicon Microgravity
      12:15 - 1:30 Lunch
      1:30 – 2:00 

      A Lens-less SMD Thermopile Solution for Near Field People Recognition in Today’s Thin Battery Operated Devices  (Abstract) 
      Prometeusz Jasinski, Applications Engineer, Excelitas Technologies

      2:00 - 3:00 

      Panel Discussion (Abstract): Academic and Commercial Perspective on Capturing Value from MEMS and Sensors
      Moderator:   Allyson Hartzell Managing Engineer, Veryst Engineering;
      Panelists:  - Sanjay Bhandari, CTO & Sr. Vice President, mCube 
                          - Uma Krishnamoorthy, Director, Advanced MEMS, Bosch Research & Technology Center
                          - 
      Jonathan A. Fan, Professor and Principal Investigator, Stanford University
                          - Debbie Senesky, Assistant Professor of Aeronautics and Astronautics, Stanford University      

      3:00 - 3:30 Coffee Break and walk to Nanofabs 
      3:30 - 5:00 

      Tour of Nanofabs by Stanford - System X Alliance
      Location: begin tour in front of David Packard Electrical Engineering Building [Packard Building]

      5:00 - 7:00Reception with poster session for Stanford faculty and students

      THURSDAY, MAY 11, 2017

      8:15 - 8:45 amCheck-in and Continental Breakfast
      9:00 – 9:15 Morning Kickoff: Karen Lightman VP, MEMS & Sensors Industry Group, SEMI
      9:15 - 10:15 

      KeynoteUnderstanding Sensor and MEMS Security from an Economic Standpoint (Abstract)
      Scott Borg (Biography)
      Director and Chief Economist, U.S. Cyber Consequences Unit

      10:15 - 10:45 Smart MEMS Sensors for Robot Applications  (Abstract)
      Shuji Tanaka, Professor, Tohoku University
      10:45 -11:15 Coffee Break
      11:15 -11:45 Development of a High-Performance Micromirror Array Using the MEMS Ecosystem (Abstract)
      Carolyn White, Associate, AMFitzgerald
      11:45 - 12:15 pmMEMS Spectral Sensors Enabling New Applications for Material Analysis  (Abstract)
      Scott Smyser, Executive Vice President, W/W Marketing &Business Development, Si-Ware Systems
      12:15 - 12:45Flexible Layout, More Dies Per Wafer by Plasma Dicing Technology  (Abstract) 
      Yannick Pilloux, Business Development Manager, Plasma-Therm
      12:45 - 2:45 

      Lunch / Breakout Discussions (Click here for full Breakout Session descriptions)
      [Location: Oksenberg Room--upstairs]

      1. Technology Transfer for Dummies: How to Get to a Stable High-yielding Process
        Lead:  Mary Ann Maher, President, Founder, softMEMS
         
      2. Back-end Challenges of MEMS and Sensors (Packaging, Testing, & Reliability)
        Lead:  Mike Mignardi, Manager, Technology Development, Texas Instruments and 
                     
        Rob O'Reilly, Senior Member Technical Staff, Analog Devices
         
      3. Integration Opportunities (Technological & Business Considerations)
        Lead: Peter Himes: General Manager, SITRI Innovations and SITRI Ventures
         
      4. Emerging MEMS, Sensors, and Systems Incorporating Them
        Lead:  Nicole Kerness, Vice President, Sensor Design and Technology, Kionix
         
      5. Piezoelectric and other Emerging Materials for MEMS and Sensor Applications
        Lead:  Dave Horsley, Co-founder, Chirp Microsystems
      2:45 – 3:15Coffee Break
      3:15 - 3:45 Breakout sessions report, group discussion, wrap up/call to action
      Closing Remarks

      NO ONSITE REGISTRATION - Please register on-line before May 8th, 2017.

       

      Pricing:

      2/1/2017 - 5/8/2017

      SEMI Member - $600

      Non Member - $990

      Speakers/Session Leaders - SEMI Member $200.00

      Speakers/Session Leaders - Non Member $300.00

      Other:

      2/1/2017 - 5/08/2017

      Spouse/Significant Other Member/Non Member - $200

       

      Conference Venue

      Bechtel Conference Center
      Stanford University
      616 Serra Street, Stanford, CA 94305
      Stanford University Map and Directions

      Major Airports

      Lodging

      • Stanford’s location adjacent to Palo Alto and Menlo Park offers an abundance of lodging choices.
      • For a list of lodging options, please click here

      Get Noticed as a Leader in the MEMS and Sensors Industry!

      MEMS & Sensors Industry Group® consistently offers opportunities to broaden your competitive advantage, by increasing your credibility, image, and prestige by sponsoring MSIG and other MEMS industry events.

      Sponsorships are available to MSIG members only. Not a member? Learn about our membership benefits

      Sponsorship Opportunities

      For sponsorship opportunities, click: MEMS & Sensors Technical Congress 2017

      To find our how you can sponsor, please contact:

      Eric Rude
      Sr. Manager, Sales, Exhibitions & Events
      SEMI, FlexTech, MEMS & Sensors Industry Group
      Tel: 1.408. 943.7047 l mobile: 1.312.613.5567 
      Em: erude@semi.org  

      Karen Lightman
      V.P. MEMS & Sensors Industry Group
      Tel: (412) 390.1644
      Em: klightman@semi.org

      Event Contact:

      Lin Tso
      Sr. Programs Manager
      Tel: (408) 943.7920
      Em: ltso@semi.org

      Sponsors

      Working Together to Solve Technical Challenges and Increase Value across the MEMS and Sensors Supply Chain

      MEMS & Sensors Industry Group has been hosting its annual technical conference since 2001, we look forward to hosting our 2017 event with our Strategic Association Partner, SEMI. Building directly upon the theme and issues emanating from the 2016 MEMS & Sensors Executive Congress, the 2017 MEMS & Sensors Technical Congress (MSTC) will take a closer look at how companies in the MEMS and sensors supply chain can thrive in a challenging environment. Among the key challenges facing the industry today are:

      • Creating higher integration devices with lower power
      • Cybersecurity/security at the sensor node
      • Energy and power management
      • Ever-expanding Internet of Things (IoT) applications requiring optimized solutions
      • Smaller and flexible form factors (including testing and packaging)
      • Cloud/fog/edge computing
      • A tsunami of data on the near horizon that will require machine learning
      • Migrating from component provider to systems solution provider

      The 2017 MSTC will focus on these and other challenges with thought-provoking technical content and breakout sessions that will delve deeper into the issues and possible solutions. We are looking for compelling abstracts from speakers who will address the aforementioned topics and have recommendations for moving the industry forward to meet these challenges to commercialization from a technical perspective.

      The deadline for submission was January 11, 2017.

      Any questions, please contact
      Karen Lightman, Executive Director
      MEMS and Sensors Industry Group
      klightman@memsindustrygroup.org

      MEMS & Sensors Technical Congress 2017